Free DSP cores! Signal Processing DesignLine Blog 12/17/2007 Post a comment Structured ASIC company eASIC now offers Tensilica cores free of charge. If you have a medium-volume app, you should check this out.
Zilog's first 1.8-V flash MCU debuts Product News 12/14/2007 Post a comment Designated the Z8 Encore! XP F1680 series, this single chip is based on Zilog's eZ8 CPU core and provides customers a rich set of analog and digital peripherals, multiple flash memory configurations up to 24KB and a low bill of materials (BOM).
AMD to postpone some Quad-Core shipment News & Analysis 12/13/2007 Post a comment Advanced Micro Devices Inc. said it will delay the shipment of several Quad Core processors until the first quarter of 2008 due to manufacturing delays it believes have overshadowed many of its other major achievements.
AMD grooms Meyer to replace Ruiz News & Analysis 12/12/2007 Post a comment Advanced Micro Devices Inc. has picked president and chief operating officer Dirk Meyer to replace Hector Ruiz as CEO although the succession is still more than one year away.
Tensilica enhances Xtensa cores and tools Product News 12/11/2007 Post a comment Tensilica has shrunken the minimum core size of its Xtensa 7 and Xtensa LX2 configurable processor families. It has also enhanced the Xtensa Xplorer design environment to make customization easier and faster.
AMD, Intel at it again, as both take aim at SoC News & Analysis 12/10/2007 Post a comment Advanced Micro Devices and Intel are ramping up system- on-chip capabilities, creating new prod- ucts and processes. Although both companies will continue to design high-end custom microprocessors, increasingly their competition will hinge on how well they assemble chips out of a stock of reusable cores.
New Intel group will drive system-chip design News & Analysis 12/6/2007 Post a comment Intel has created a new system-on-chip enablement group under Gadi Singer, a veteran executive of many high profile projects for the company who hopes to help smooth the way for future multicore processors as well as a range of SoCs for sockets outside its traditional PC markets.
ARC readies energy saving cores Product News 12/5/2007 Post a comment ARC International is readying a range of cores, dubbed Energy PRO, that adds active power management capability to its line-up of IP cores. The cores come validated with Cadence Low Power Solution and Common Power Format (CPF) through a partnership between the ARC, Cadence and Virage.
TI rolls DaVinci for HD transcoding Product News 12/3/2007 Post a comment The TMS320DM6467 targets video transcoding in products such as set-top boxes and media gateways. It can simultaneously encode and decode multi-format HD video at resolutions up to H.264 HP@L4.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.