Imagination wins MIPS bid
News & Analysis 12/20/2012 1 comment
DSP IP licensor Ceva has announced that it will not rebid against Imagination for processor IP company MIPS Technologies.
Oregon courts Azalea project, says report
Blog 12/19/2012 3 comments
Oregon could be seeking to bid against New York as the site for a wafer fab, according The Oregonian newspaper. The publication reports that Business Oregon, the state's economic development agency, is working with a company under the codename Azalea.
Top 10 shifts in chips, comms
News & Analysis 12/17/2012 4 comments
It was a down year for semiconductors that saw shifting fortunes for many chip and comms companies as growth fled to the extremes of mobile and cloud.
Imagination raises MIPS bid
News & Analysis 12/17/2012 1 comment
The bidding war between Imagination Technologies and Ceva for MIPS Technologies Inc. has reached $100 million. MIPS is a long-established licensor of processor architectures and IP.
Altera eyes FDSOI process for FPGAs
News & Analysis 12/15/2012 4 comments
In what could signify a move away from foundry TSMC, Altera has been looking at a fully-depleted silicon-on-insulator manufacturing process as an option for future FPGAs.
Meeting Zuckerberg and Mr. EUV
Blog 12/13/2012 3 comments
I learned a little something in brief encounters this week with Facebook’s Mark Zuckerberg and the man I think of as Mr. EUV—two very unique men in black.
London Calling: Whither ST?
Blog 12/12/2012 6 comments
STMicroelectronics' plan to exit from its joint venture with Ericsson makes sense, but its 2013 timetable suggests selling ST-Ericsson will not be easy.
IBM details 3-D server chip stacks
News & Analysis 12/12/2012 4 comments
IBM will show work stacking 45-nm server processors with memory and transceivers at IEDM, techniques that could give it significant performance and power gains.
28-nm FDSOI is production ready, says ST
News & Analysis 12/11/2012 11 comments
To coincide with a meeting on process technology held alongside IEDM, European chip company ST has announced that its 28-nm fully depleted silicon-on-insulator (FDSOI) is available for pre-production volumes from its wafer fab at Crolles, France.
IBM, Intel face off at 22 nm
News & Analysis 12/11/2012 4 comments
IBM is prototyping server CPUs in a new 3-D ready, 22-nm process disclosed at IEDM as Intel shared details of its SoC work and talked privately about its costs and foundry business.
ST remains committed to FD-SOI, says CEO
News & Analysis 12/10/2012 2 comments
Despite planning to exit from its joint venture ST-Ericsson, one of few users of its fully-depleted silicon on insulator (FDSOI) manufacturing process, European chip maker intends to keep faith with the technology and continue using it at its wafer fab in Crolles, near Grenoble, France.
ST to exit ST-Ericsson in 2013
News & Analysis 12/10/2012 12 comments
As part of a strategic plan to improve the financial situation of the company STMicroelectronics has announced its intention to exit from mobile digital joint venture ST-Ericsson during 2013.
Intel upping Atom ante
News & Analysis 12/7/2012 20 comments
Intel is positioning its upcoming Atom-based Centerton chip as a server alternative to 64-bit ARM devices.