Oregon courts Azalea project, says report Blog 12/19/2012 3 comments Oregon could be seeking to bid against New York as the site for a wafer fab, according The Oregonian newspaper. The publication reports that Business Oregon, the state's economic development agency, is working with a company under the codename Azalea.
Top 10 shifts in chips, comms News & Analysis 12/17/2012 4 comments It was a down year for semiconductors that saw shifting fortunes for many chip and comms companies as growth fled to the extremes of mobile and cloud.
Imagination raises MIPS bid News & Analysis 12/17/2012 1 comment The bidding war between Imagination Technologies and Ceva for MIPS Technologies Inc. has reached $100 million. MIPS is a long-established licensor of processor architectures and IP.
Altera eyes FDSOI process for FPGAs News & Analysis 12/15/2012 4 comments In what could signify a move away from foundry TSMC, Altera has been looking at a fully-depleted silicon-on-insulator manufacturing process as an option for future FPGAs.
Meeting Zuckerberg and Mr. EUV Blog 12/13/2012 3 comments I learned a little something in brief encounters this week with Facebook’s Mark Zuckerberg and the man I think of as Mr. EUV—two very unique men in black.
London Calling: Whither ST? Blog 12/12/2012 6 comments STMicroelectronics' plan to exit from its joint venture with Ericsson makes sense, but its 2013 timetable suggests selling ST-Ericsson will not be easy.
IBM details 3-D server chip stacks News & Analysis 12/12/2012 4 comments IBM will show work stacking 45-nm server processors with memory and transceivers at IEDM, techniques that could give it significant performance and power gains.
28-nm FDSOI is production ready, says ST News & Analysis 12/11/2012 11 comments To coincide with a meeting on process technology held alongside IEDM, European chip company ST has announced that its 28-nm fully depleted silicon-on-insulator (FDSOI) is available for pre-production volumes from its wafer fab at Crolles, France.
IBM, Intel face off at 22 nm News & Analysis 12/11/2012 4 comments IBM is prototyping server CPUs in a new 3-D ready, 22-nm process disclosed at IEDM as Intel shared details of its SoC work and talked privately about its costs and foundry business.
ST remains committed to FD-SOI, says CEO News & Analysis 12/10/2012 2 comments Despite planning to exit from its joint venture ST-Ericsson, one of few users of its fully-depleted silicon on insulator (FDSOI) manufacturing process, European chip maker intends to keep faith with the technology and continue using it at its wafer fab in Crolles, near Grenoble, France.
ST-Ericsson vows to keep working on turnaround News & Analysis 12/10/2012 2 comments Loss-making mobile digital chip company ST-Ericsson NV, the joint venture that STMicroelectronics has said it will exit, has said it will not change its strategy as a result of ST's announcement.
ST to exit ST-Ericsson in 2013 News & Analysis 12/10/2012 12 comments As part of a strategic plan to improve the financial situation of the company STMicroelectronics has announced its intention to exit from mobile digital joint venture ST-Ericsson during 2013.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.