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posted in December 2012
DesignCon's 5 Toughest Tech Questions
News & Analysis  
12/28/2012   11 comments
FPGA or ASIC? What are the issues for 3-D interconnects? Enquiring tech minds want to know.
Intel claims latest tablet SoC beats Nvidia Tegra 3
News & Analysis  
12/20/2012   24 comments
Atom-based Clover Trail SoCs outperformed Nvidia’s Tegra 3 while using less power, Intel claimed in a briefing that covered a sub-10W Haswell Ultrabook.
Silicon Valley Nation: Processor speed kings crowned
Blog  
12/20/2012   Post a comment
Want to know who's got the fastest CPUs and GPUs? Ask gamers. (Hint: AMD and Intel.)
Servers cool it with liquid refrigerant
News & Analysis  
12/20/2012   7 comments
Startup Clustered Systems lets data centers pack 200 KW of electronics into a rack using its sealed liquid cooling system.
Imagination wins MIPS bid
News & Analysis  
12/20/2012   1 comment
DSP IP licensor Ceva has announced that it will not rebid against Imagination for processor IP company MIPS Technologies.
TI and University of Florida student collaborate on FRAM research
Programmable Logic DesignLine Blog  
12/19/2012   1 comment
I just heard about a rather interesting university research story that improved upon the FRAM technology used in TI’s MSP430 Wolverine platform.
Oregon courts Azalea project, says report
Blog  
12/19/2012   3 comments
Oregon could be seeking to bid against New York as the site for a wafer fab, according The Oregonian newspaper. The publication reports that Business Oregon, the state's economic development agency, is working with a company under the codename Azalea.
Conexant launches high-def voice capture IC
Product News  
12/18/2012   Post a comment
This latest offering from Conexant complements its portfolio of turnkey Far-Field Voice Input Processor SoC solutions.
Add voice, sound clips, and streaming audio to embedded designs
Product News  
12/18/2012   Post a comment
Silicon Labs' new Class D ToolStick simplifies the addition of voice, sound clips and streaming audio to embedded designs.
Energy-friendly MCU design for remote medical systems
Product News  
12/18/2012   Post a comment
Energy Micro and Lamprey Networks demonstrate an energy-friendly MCU design with communications protocol stack for remote medical systems
Apple, Nvidia may stack graphics for Macs, iPads
Blog  
12/18/2012   7 comments
Rumor is Apple is working with Nvidia on some chip stacks that could power novel iMacs, Macbooks and even iPads starting late next year.
PLX, Kontron drive PCIe backplane to 5.6 GB/s
News & Analysis  
12/17/2012   Post a comment
Kontron used switches from PLX Technology to drive a PCI Express 3.0 backplane at average rates of 5.6 GBytes/second.
Top 10 shifts in chips, comms
News & Analysis  
12/17/2012   4 comments
It was a down year for semiconductors that saw shifting fortunes for many chip and comms companies as growth fled to the extremes of mobile and cloud.
Imagination raises MIPS bid
News & Analysis  
12/17/2012   1 comment
The bidding war between Imagination Technologies and Ceva for MIPS Technologies Inc. has reached $100 million. MIPS is a long-established licensor of processor architectures and IP.
Altera eyes FDSOI process for FPGAs
News & Analysis  
12/15/2012   4 comments
In what could signify a move away from foundry TSMC, Altera has been looking at a fully-depleted silicon-on-insulator manufacturing process as an option for future FPGAs.
Altera, ARM announce adaptive FPGA embedded S/W toolkit
Product News  
12/14/2012   1 comment
Unique partnership creates DS-5 toolkit that removes debugging barriers for SoC FPGA devices.
Ireland still set for FinFETs, says Intel exec
News & Analysis  
12/14/2012   8 comments
Despite sending Irish workers home from training Intel is still working hard in Ireland to prepare for the introduction of P1272, its 14-nm FinFET manufacturing process.
Meeting Zuckerberg and Mr. EUV
Blog  
12/13/2012   3 comments
I learned a little something in brief encounters this week with Facebook’s Mark Zuckerberg and the man I think of as Mr. EUV—two very unique men in black.
Yoshida in China: Will MediaTek’s good luck hold in 2013?
Blog  
12/13/2012   4 comments
While most mobile chip vendors saw their customer base shrink in 2012, MediaTek is talking about a ten-fold increase in its smartphone chip shipments.
Intel's FinFETs approach draws fire from rivals
News & Analysis  
12/13/2012   8 comments
The FinFET popularized by Intel is just one option to keep chip technology driving to ever small dimensions, said a group of experts in an IEDM debate.
Ceva rebids for MIPS to stretch Imagination
Design How-To  
12/12/2012   2 comments
DSP processor licensor Ceva has raised its bid for the operating business of MIPS Technologies Inc. to $90 million, matching the cash balance of its rival in the bidding process.
London Calling: Whither ST?
Blog  
12/12/2012   6 comments
STMicroelectronics' plan to exit from its joint venture with Ericsson makes sense, but its 2013 timetable suggests selling ST-Ericsson will not be easy.
IBM details 3-D server chip stacks
News & Analysis  
12/12/2012   4 comments
IBM will show work stacking 45-nm server processors with memory and transceivers at IEDM, techniques that could give it significant performance and power gains.
Intel leapfrogs ARM (for now) with Atom server SoC
News & Analysis  
12/11/2012   20 comments
Intel is shipping Centerton, aka the S1200, claiming design wins for the server SoC aimed at fending off a growing crowd of ARM server SoCs.
28-nm FDSOI is production ready, says ST
News & Analysis  
12/11/2012   11 comments
To coincide with a meeting on process technology held alongside IEDM, European chip company ST has announced that its 28-nm fully depleted silicon-on-insulator (FDSOI) is available for pre-production volumes from its wafer fab at Crolles, France.
IBM, Intel face off at 22 nm
News & Analysis  
12/11/2012   4 comments
IBM is prototyping server CPUs in a new 3-D ready, 22-nm process disclosed at IEDM as Intel shared details of its SoC work and talked privately about its costs and foundry business.
ARM founder sees startups hustling in hard times
News & Analysis  
12/10/2012   5 comments
Retired ARM co-founder Sir Robin Saxby ARM said he is applying the lessons learned there to a new generation of semiconductor startups.
ST remains committed to FD-SOI, says CEO
News & Analysis  
12/10/2012   2 comments
Despite planning to exit from its joint venture ST-Ericsson, one of few users of its fully-depleted silicon on insulator (FDSOI) manufacturing process, European chip maker intends to keep faith with the technology and continue using it at its wafer fab in Crolles, near Grenoble, France.
ST-Ericsson vows to keep working on turnaround
News & Analysis  
12/10/2012   2 comments
Loss-making mobile digital chip company ST-Ericsson NV, the joint venture that STMicroelectronics has said it will exit, has said it will not change its strategy as a result of ST's announcement.
ST to exit ST-Ericsson in 2013
News & Analysis  
12/10/2012   12 comments
As part of a strategic plan to improve the financial situation of the company STMicroelectronics has announced its intention to exit from mobile digital joint venture ST-Ericsson during 2013.
AMD recasts foundry deal to save cash
News & Analysis  
12/7/2012   Post a comment
Struggling AMD has negotiated a fixed-price wafer deal with Globalfoundries to help it conserve resources and in an attempt to generate cash.
Intel upping Atom ante
News & Analysis  
12/7/2012   20 comments
Intel is positioning its upcoming Atom-based Centerton chip as a server alternative to 64-bit ARM devices.
Report: China approves ARM venture with conditions
News & Analysis  
12/7/2012   Post a comment
The Chinese government has followed the European Commission in approving a joint venture on security on condition that ARM shares TrustZone information with competitors.
Broadcom sees rising 20 nm costs amid handset push
News & Analysis  
12/6/2012   19 comments
Broadcom’s CEO Scott McGregor expects the company will move closer to leading-edge processes in 2013 as it moves toward integrated mobile SoCs.
MIPS rolls architecture extensions amid bidding war
News & Analysis  
12/6/2012   1 comment
MIPS Technologies released virtualization and SIMD extensions to its base architecture that are likely to be its final technology update as an independent company.
TI launches new real-time operating system: TI-RTOS
Product News  
12/6/2012   1 comment
TI-RTOS eases software development for microcontroller (MCU) designers, allowing them to take applications with greater functionality and connectivity to market faster.
TI’s MSP430 5xx MCUs with independent 1.8V I/O supply for simplified co-processor design
Product News  
12/4/2012   Post a comment
MSP430F521x/522x devices offer simplified, smart-interface solutions between 1.8V and up to 3.6V voltage domains for applications such as sensor hub, keyboard control, and health and fitness.
DCD's DRPIC166X low-cost high-performance MCU IP core
Product News  
12/4/2012   Post a comment
The DRPIC166X is a low-cost high performance 8-bit, fully static soft IP Core, intended to operate with fast (typically on-chip), dual ported memory.
TI's new, highly-integrated C2000 32-bit Piccolo F2805x MCUs
Product News  
12/4/2012   Post a comment
Achieve best-in-class motor system efficiency and 5X performance with robust Piccolo F2805x MCUs featuring the CLA co-processor, software, tools and support
Why Intel should make chips for Apple, Cisco
Blog  
12/3/2012   26 comments
Signs point to a shift in emphasis for the world’s biggest semiconductor company from a little less on microprocessors to a little more on manufacturing.


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Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
3 comments
A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
19 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
39 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Karen Field

July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
144 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

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