IBM will steer PowerPC into mobile mart News & Analysis 2/28/2002 Post a comment IBM intends to take its PowerPC processor architecture to the mobile sector and into "head-to-head competition with Intel" and that company's Xscale processor, John Kelly III, senior vice president of IBM's Technology Group, said this week.
Intel works toward ramp of 90-nm process in 2003 News & Analysis 2/27/2002 Post a comment SAN FRANCISCO -- In a move to keep up in the IC technology race, Intel Corp. plans to soon announce its 90-nm (0.09-micron) process for use in high-speed microprocessors, flash memories, and other chips, said company executives at the Intel Developer Forum (IDF) here.
Intel to drop support of Rambus in new CPU products News & Analysis 2/26/2002 Post a comment Intel Corp. in the second half of this year will drop its final Direct Rambus DRAMs support in new products, it was learned Tuesday at the Intel Developers Forum.
The last RDRAMs used in Xeon workstations will be replaced by new chipsets supporting double data rate (DDR memory).
An Intel workstation roadmap secured by EBN showed a Placer chipset with DDR SDRAMs for dual processor Xeon workstations, and a Granite Bay DDR chipset for uniprocessor Xeon workstations. They will replace the
AMD demos 64-bit Hammer's ability to run 64- and 32-bit software News & Analysis 2/26/2002 Post a comment SAN FRANCISCO--In an attempt to steal some of the spotlight from its archrival, Advanced Micro Devices Inc. here today held the first public demonstration of its 64-bit "Hammer" processor while much of the industry's attention was focused at the Intel Developer Forum in San Francisco.
Intel ships first 0.13-micron processors made on 300-mm wafers News & Analysis 2/25/2002 Post a comment SANTA CLARA, Calif.--As predicted earlier this year, Intel Corp. today announced it has completed first production of microprocessors on 300-mm diameter wafers using a 0.13-micron process technology. Intel claimed it is the first chip maker to produce and ship "production level processors" on 0.13-micron technology using 300-mm (12-inch) silicon substrates.
Dell drops Itanium-based workstation News & Analysis 2/11/2002 Post a comment Dell Computers has dropped its 64-bit Intel-Itanium-based Precision Workstation 730 model to concentrate on Intel 32-bit processor workstations, a spokeswoman confirmed Monday.
Sun to use X86-based MPUs as it supports Linux News & Analysis 2/11/2002 Post a comment Sun Microsystems Inc. has ended more than a year of speculation by announcing it would for the first time adopt X86 microprocessors in its server products.
As part of a larger initiative to broaden support for the Linux operating system, the move signals a major shift for the workstation and server maker, which has exclusively used its proprietary Sparc processor architecture to power its systems.
Motorola, Sega plan portable game interface for DragonBall processors News & Analysis 2/5/2002 Post a comment AUSTIN, Tex. -- Motorola Inc.'s semiconductor group and the company's Metrowerks development tool business today announced a partnership with Sega Corp. to develop an application programming interface (API) for portable games on personal digital assistants (PDAs) that are running the Palm OS operating system.
TI targets 0.09-micron process for production by mid-2003 News & Analysis 2/4/2002 Post a comment DALLAS -- Texas Instruments Inc. today announced it will launch a 0.09-micron logic process into production in the middle of 2003. TI said its next-generation CMOS process features transistors as small as 37 nm (0.037 micron), and it will enable the company to fabricate ICs with more than 400 million transistors on a chip.
300-mm pact means AMD shifts from Motorola to UMC as technology partner News & Analysis 2/1/2002 Post a comment SUNNYVALE, Calif. -- While Advanced Micro Devices Inc. here and silicon foundry supplier United Microelectronics Corp. move into a major manufacturing alliance for PC processors and 300-mm wafer processing, the two companies are also faced with restructuring and merging their R&D activities to implement 65-nm processes for a planned joint-venture fab in Singapore by 2005.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.