LTE Built-In GM Cars: No Smartphones Required News & Analysis 2/25/2014 24 comments Smartphones are no longer the only platform hotly pursued by cellular operators eager to boost their revenue. Now, it’s cars. GM has partnered with AT&T, and Qualcomm launched 20nm LTE-A chipset for automotive.
Samsung Galaxy S5 Unveiled at MWC News & Analysis 2/24/2014 12 comments Samsung announced the next generation of its flagship smartphone, the Galaxy S5, at Mobile World Conference in Barcelona. The water and dust proof S5 has cat 4 LTE coverage and is designed to complement the company's new line of wearable devices.
Teenage CEO Speaks at EE Live! News & Analysis 2/24/2014 9 comments At 17, and chief executive of his own high-performance computer startup, Thomas Sohmers shares his views on Silicon Valley and more at EE Live!
Startup Stacks Chips Wirelessly News & Analysis 2/21/2014 28 comments ThruChip of Japan wants to license an inductive coupling method for linking 3D chip stacks wirelessly, saving costs and hassles of wired links.
Broadcom Chip Locates Wearables News & Analysis 2/21/2014 4 comments Broadcom announced a global navigation satellite system (GNSS) and sensor hub integrated SoC. The 40nm chip is designed for low-power, mass-market wearable devices and aims to fix issues associated with high cost, often inaccurate GPS systems.
Intel Drives Xeon to Big Data News & Analysis 2/19/2014 7 comments In an effort to increase data analysis power, Intel has achieved breakthrough computing speeds on its recently announced Xeon E7 v2 family of server processors. The Xeon processors can analyze large, diverse amounts of previously inaccessible data.
Spansion to Launch HyperBus I/F for Automotive News & Analysis 2/18/2014 12 comments Spansion has developed HyberBus Interface, targeting in-car systems that demand “instant-on” and “interactive graphical user interface.” The proprietary interface offers low latency, high read throughput, and low pin-count.
Sonics' New IP for Low-Power SoCs Patented News & Analysis 2/18/2014 3 comments Sonics revealed the issuance of patent 8,601,288 "Intelligent Power Controller" from the US Patent Office. The hardware-based power-management IP lets SoC designers partition power domains and turn them on and off without software intervention.
Did Apple Steal DLNA's Thunder? Blog 2/13/2014 23 comments Within its closed iOS device universe, Apple has delivered an "interoperable" experience, "or at least the belief in such" among its users, says an analyst. Does that mean Apple stole DLNA's thunder?
Simplify the Complexity of M2M Industrial Control DesignLine Blog 2/13/2014 3 comments The new industrial control made possible by M2M pushes the envelope of traditional supervisory control and data acquisition (SCADA).
Google Ramps Up Chip Design News & Analysis 2/12/2014 29 comments Evidence is mounting that Google is ramping up a broad and deep chip design capability, but its focus and timing are still unclear.
NFV Spec Nearly Done Blog 2/11/2014 3 comments The final draft of the spec for Network Functions Virtualization is nearly complete, but several challenges lie ahead.
Qualcomm Answers 'Auto-Grade Dilemma' Blog 2/10/2014 1 comment Qualcomm is ideally positioned to answer what I call the "auto-grade dilemma." It's a dilemma because moving technologies originally designed for smartphones to automotive use is a big challenge -- especially for a company like Qualcomm.
Google Cloud Needs Lower Latency News & Analysis 2/10/2014 8 comments A Google fellow asked engineers at ISSCC to come up with new techniques to reduce latencies to handle a rising tide of sensor data from wearables.
IBM’s Chip Unit on Chopping Block? News & Analysis 2/7/2014 49 comments Discussions about putting IBM’s semiconductor business on the chopping block have returned with a vengeance. IBM reportedly retained Goldman Sachs to look for possible buyers.
Government OKs Car-to-Car Talk News & Analysis 2/5/2014 23 comments In announcing vehicle-to-vehicle (V2V) communication technology Monday, the US Dept. of Transportation pledged to “begin taking steps to enable” V2V for light vehicles. But it stopped short of proposing rulemaking.
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.