Breaking News
Content tagged with Microprocessor
posted in March 2007
Page 1 / 2   >   >>
Smart junction blocks ease the automotive wiring squeeze: Part 2 - Enablers and advantages
Design How-To  
3/30/2007   Post a comment
Clever connector design and intelligent MOSFETs, with a proper PCB layout and thermal design, come together for a smart, fuse-and-relay-free junction block.
Lattice's embedded microprocessor available through open source
Product News  
3/30/2007   Post a comment
LatticeMico32 is a 32-bit soft microprocessor optimized for Lattice Field Programmable Gate Arrays (FPGAs)
Dell primes for battle in China
News & Analysis  
3/30/2007   Post a comment
Michael Dell doesn't like being No. 2, let alone No. 3. But that's where he is in China, and a distant third at that.
Acer fires back at HP over patent dispute
News & Analysis  
3/29/2007   Post a comment
With sales booming, especially in the US, Acer Inc. finds itself the target of a patent infringement lawsuit from rival Hewlett-Packard. It isn't backing down.
Smart junction blocks ease the automotive wiring squeeze: Part 1 - The electronic distribution system problem and the MOSFET/IP solution
Design How-To  
3/28/2007   Post a comment
Applying technology and IP, junction block developers target both functionality and cost for a reliable design without any fuses or relays.
Intel to begin 45-nm production in second half
News & Analysis  
3/28/2007   Post a comment
Intel said its 45-nanometer Penryn family of processors would be in production during the second half of 2007. The company also provided a sneak peak at its next-generation 45-nm processor, codenamed Nehalem, which is set for production in 2008.
UPDATED: eeProductCenter tracks products at wireless, optical networking events
Product News  
3/27/2007   Post a comment
Stay tuned to eeProductCenter this week to keep pace with the latest product announcements coming out of the CTIA Wireless 2007 event in Orlando and OFC/NFOEC event in Anaheim.
Silicon Image rolls 2nd-generation SteelVines
Product News  
3/26/2007   Post a comment
Silicon Image announced the availability of a second generation of SteelVine storage processors that are, according to the company, designed to give motherboard and storage appliance manufacturers a more powerful and cost-effective solution, with lower power requirements and a smaller footprint.
Under the Hood: Handset adds twists for TV viewing
Teardown  
3/26/2007   Post a comment
As the sinkhole for ever-expanding feature sets, the cell phone never sleeps. Having moved well beyond voice to high-speed data, e-mail, cameras, music players and the like, the mobile just keeps on packing it in. The Samsung SGH-P920, for example, adds to an already impressive feature set the ability to receive Digital Video Broadcasting-Handheld television programming.

Defining a forward error correction algorithm
Design How-To  
3/26/2007   Post a comment
Pro-MPEG FEC (forward error correction) is a two-dimensional XOR algorithm with several possibilities determining the size of the data matrix. The FEC dictates that there be a minimum of at least one column and at least four rows, and a maximum of no more than 20 columns and and no more than 20 rows. The total number of packets in one matrix cannot exceed 100. In order to understand this simple FEC concept, if A and B are RTP packets, then the FEC packet associated with the {A, B} protection s
Designs that improve performance per watt
Design How-To  
3/26/2007   Post a comment
We've come to expect faster, cheaper and more functionality from our computing devices but cost of computing has made both large and small users pay attention to what's inside. Here's how to design with a more holistic energy approach for processors, drives, power supplies, and displays.
BenQ rejects $634M claim from bankrupt mobile unit
News & Analysis  
3/26/2007   Post a comment
Taiwan consumer electronics maker BenQ Corp. has rejected claims that it owes $634 million to creditors of its bankrupt German mobile phone unit.
SMIC scouting private equity infusion, report says
News & Analysis  
3/26/2007   Post a comment
Rumors swirl that Chinese foundry Semiconductor Manufacturing International Corp. is trying to stir interest in the private equity community for a 20 percent stake in its struggling business.
Intel confirms $2.5 billion fab in China
News & Analysis  
3/26/2007   Post a comment
Intel Corp. confirmed Monday that it will build a 300mm wafer fab in the northern Chinese city of Dalian.
Intel already has US gov't approval on China fab
News & Analysis  
3/25/2007   Post a comment
Intel Corp. has already obtained permission from the US government to build an advanced fab in China, according to a source familiar with the company's plan.
QuickLogic's ArcticLink - programmable devices tailored for the mobile market
Product News  
3/23/2007   Post a comment
Fully integrated host controllers provide multiple connectivity options; programmable fabric supports additional peripheral connectivity provides maximum design flexibility.
Digital controllers provide control for on-off temperature, time/temperature applications
Product News  
3/23/2007   Post a comment
Zytron Control Products launched the Series 1900 of digital controllers which provide control for on-off temperature, time/temperature and timing control applications.
US may back down on tech export policy
News & Analysis  
3/23/2007   Post a comment
The U.S. government is taking a second look at controversial plan to tighten export controls on technology shipped to China and is indicating that it may back down
Hua Hong NEC to boost capacity
News & Analysis  
3/23/2007   Post a comment
Foundry Hua Hong NEC Electronics Co. said it will increase capacity by 50 percent this year by adding to its 200-mm wafer lines.
Applied Materials opening China R&D center
News & Analysis  
3/22/2007   Post a comment
Applied Materials Inc. is planning to invest $83 million to ramp up its first product development center in China, which opens Friday.
For low-power design, speak two languages
News & Analysis  
3/22/2007   Post a comment
It's looking like the impasse between camps supporting Common Power Format and Unified Power Format means that chip designers will need to familiarize themselves with both or hope that translators can make the task easier.
Single-ended design with Digital Amplifiers
Design How-To  
3/21/2007   Post a comment
In practice, single-ended amplifier audio performance data, including power-on pops, signal-to-noise ratio (SNR), PSRR, and THD+N, are quite good with only a small degradation in audio performance from that of BTL.
Putting FPGAs to Work in Software Radio Systems, Part 2
Design How-To  
3/21/2007   Post a comment
Part 2 of this popular series traces the use of FPGA products through several application examples, discussing how to take advantage of different design options.
Microcontrollers target motors and motion control
Product News  
3/20/2007   Post a comment
Luminary Micro reports that it has released the world's first and only silicon implementation of Cortex-M3 with five new Stellaris microcontrollers.
China trip by Intel CEO fuels fab rumors
News & Analysis  
3/20/2007   Post a comment
Intel Corp. chief executive Paul Otellini will travel to China next week, fueling speculation that Intel will confirm plans for a 12-inch wafer plant in the northern city of Dalian.
Gartner analyst says Intel fab is Chinese wishful thinking
News & Analysis  
3/20/2007   Post a comment
Bob Johnson, an analyst with Gartner Inc., has dismissed the idea of Intel Corp. putting down a trailing-edge 90-nm wafer fab in China as "wishful thinking" by Chinese authorities.
China firm wants in on One Laptop Per Child
News & Analysis  
3/20/2007   Post a comment
A Chinese company is hoping to leverage its position as a domestic firm to muscle in on the One Laptop Per Child project.
China trip by Intel CEO fuels fab rumors
News & Analysis  
3/20/2007   Post a comment
Intel Corp. is renting out the Great Hall of the People in Beijing next week, stirring more speculation about a plan to build a fab in the northern part of the country.
USB 2.0 high-speed host controllers provide multiple connectivity options
Product News  
3/19/2007   Post a comment
QuickLogic developed ArcticLink; a programmable connectivity solution platform targeting mobile devices. The platform reduces design time and risk by embedding high-performance controllers, a programmable fabric for implementing additional controllers and peripheral connectivity, as well as a selectable processor interface.
Teardown that Prius!
Automotive DesignLine Blog  
3/19/2007   Post a comment
Check out this video to see what it's like to take apart a hybrid vehicle--in about one minute.
Design for Variability
Design How-To  
3/19/2007   Post a comment
At nanometer technologies, variability is rapidly becoming one of the leading causes for chip failures and delayed schedules. However, there is significant confusion about the term "variability" in the design community today.
Actel and ARM announce the Cortex-M1 soft processor core
Product News  
3/19/2007   Post a comment
The Cortex-M1 is the first ARM processor designed from the ground-up for FPGAs.
BenQ chairman defends executive detained in raid
News & Analysis  
3/16/2007   Post a comment
BenQ Chairman KY Lee rushes to defend a senior executive detained in a police raid targeting insider trading and bonus irregularities.
UMC setting up support in Hyderabad
News & Analysis  
3/16/2007   Post a comment
Foundry United Microelectronics Corp is the latest to move a support office to India, following a similar move by Taiwan Semiconductor Manufacturing Co. last month.
Broadcom names CFO
News & Analysis  
3/15/2007   Post a comment
Fabless chip vendor Broadcom said that Eric Brandt would join the company later this month as senior vice president and chief financial officer.
AMD surges among iSuppli's top 25 IC vendors
News & Analysis  
3/15/2007   Post a comment
No. 1 semiconductor supplier Intel endured an 11.1 percent revenue decline in 2006 while smaller rival Advanced Micro Devices nearly doubled its sales, according to a final 2006 market share ranking released by market analyst iSuppli.
Atmel doubles Flash density on ARM7-powered MCUs
Product News  
3/15/2007   Post a comment
Atmel announced 512K byte dual-bank Flash memory extensions to its AT91SAM7S, SAM7X and SAM7XC microcontrollers based on the ARM7TDMI processor core.
IC Insights' top 25 IC firms: 'Haves versus have-nots'
News & Analysis  
3/14/2007   Post a comment
It was the haves versus the have-nots for top 25 IC suppliers in 2006, according to market research firm IC Insights Inc., which said six of last year's top 25 chip firms saw revenue growth of better than 35 percent while nearly one-third experienced below average growth of less than 9 percent.
Consumer and automotive electronics converge: Part 2 - A MOST implementation
Design How-To  
3/14/2007   Post a comment
To seamlessly move large amounts of audio, video, and control information to, from, and between electronic devices and automotive systems, a car needs to have a flexible and powerful communications backbone.
Brokerage fined for phony research on Intel
News & Analysis  
3/14/2007   Post a comment
Banc of America Securities has agreed to a $26 million settlement with the U.S. Securities and Exchange Commission (SEC) for issuing fraudulent reports on No. 1 semiconductor supplier Intel Corp.
Intel quad-core processor requires just 50-watts
Product News  
3/14/2007   Post a comment
Intel announced two energy-efficient 50-watt server processors that represent a 35- to nearly 60-percent decrease in power compared with its existing 80- and 120-watt quad-core server products.
Intel gets OK for $2.5 billion China fab
News & Analysis  
3/13/2007   Post a comment
China's top planning commission gives Intel the green light to spend $2.5 billion on a 12-inch wafer plant that would use 90 nanometer technology. It would be the first project of its kind in China.
India CE maker to spend $250M on chip facility
News & Analysis  
3/13/2007   Post a comment
Homegrown consumer electronics firm Videocon Ltd. says it will set up a semiconductor unit in India through a technology tie-up with an unnamed overseas company.
Under the Hood: Console is more than just a DVD player
Teardown  
3/12/2007   Post a comment
With so much attention focused on the Playstation and Wii game systems these days, ZapIt was able to come under the radar with a game box suited more for the whole family than just the younger generation.
Reference platform addresses telematics applications
Product News  
3/9/2007   Post a comment
TES Electronic Solutions has released its CDM/RP-DVTM telematics reference platform based on Texas Instruments' DM644x DaVinci processor.
Advanced interconnects drive intelligent vision applications: Part 2
Design How-To  
3/9/2007   Post a comment
Platform-centric methodology enables decoupling IP cores, early architecture exploration of data flow, and isolation of chip areas for rapid design updates. This part details socket monitoring, the interconnect environment, and seven vision-computing engines.
SanDisk licenses Moore Microprocessor patents
News & Analysis  
3/9/2007   Post a comment
SanDisk has become the latest semiconductor manufacturer to license the Moore Microprocessor Patent Portfolio from Patriot Scientific and The TPL Group, according to a statement issued by the entity that manages the portfolio. Financial terms of the agreement were not disclosed.
Media processing architecture scales from MP3 to HD video
Design How-To  
3/9/2007   Post a comment
Media processing architectures must span a huge range of complexity and be software-programmable. ARC's VRaptor Architecture takes a heterogeneous, multicore approach: multiple high-performance processors are connected to multiple SIMD processors and multiple DMA engines, and are complemented with domain-specific accelerators, all interconnected with low-overhead, low-latency active communications channels and local wide data buses.
AVR Flash MCUs optimized for Full-Speed USB peripherals
Product News  
3/9/2007   Post a comment
Atmel has expanded its family of AVR Flash microcontrollers (MCUs) with a pair of devices for high-volume USB applications, ranging from high-performance Human Interface Devices (HID) to wireless adaptors.
Digital camera processors deliver advanced video compression
Product News  
3/9/2007   Post a comment
Check out Zoran's tenth generation of COACH digital camera processors. These devices offer advanced video compression, DSLR-grade performance and high definition video recording.
Page 1 / 2   >   >>


EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Aging Brass: Cow Poop vs. Horse Doo-Doo
Max Maxfield
37 comments
As you may recall, one of the things I want to do with the brass panels I'm using in my Inamorata Prognostication Engine is to make them look really old. Since everything is being mounted ...

EDN Staff

11 Summer Vacation Spots for Engineers
EDN Staff
11 comments
This collection of places from technology history, museums, and modern marvels is a roadmap for an engineering adventure that will take you around the world. Here are just a few spots ...

Glen Chenier

Engineers Solve Analog/Digital Problem, Invent Creative Expletives
Glen Chenier
11 comments
- An analog engineer and a digital engineer join forces, use their respective skills, and pull a few bunnies out of a hat to troubleshoot a system with which they are completely ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
45 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Flash Poll
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)