Under the Hood: Inside Microsoft's Xbox 360 Elite Teardown 4/30/2007 Post a comment In the wake of its Sony Playstation 3 and Nintendo Wii video teardowns, Semiconductor Insights kept the cameras rolling as it took apart the new Xbox 360 Elite to see just how Microsoft plans to stay competitive in the hotly contested, three-way gaming platform market.
CE growth to see 'significant slowdown' News & Analysis 4/25/2007 Post a comment CE growth may decelerate in the coming years, but a few areas will still be hot, such as PMP/MP3 players. But giants like Apple, Samsung and Sony will make it tough for the little guy to survive.
Will your next DSP be an ARM? Signal Processing DesignLine Blog 4/23/2007 Post a comment ARM's latest tool release makes it much easier to write DSP code for the ARM architecture. If you haven't considered using an ARM processor before, now may be the time.
North, South Korea planning IT forum News & Analysis 4/23/2007 Post a comment Following in the path of other emerging markets, North Korea is eager to get its hands on advanced technology and will hold a meeting with South Korea to forge closer tech ties.
UC Berkeley confirms $10 cell phone project News & Analysis 4/23/2007 1 comment How cheap is cheap? Try 10 bucks for a cell phone. UC Berkeley confirmed that it is, indeed, working on such a device, but it will be years before it gets to the serious engineering stage.
Intel SoC processor powers new consumer electronics generation Product News 4/23/2007 Post a comment Intel has unveiled a highly integrated media processor for the consumer electronics (CE) market segment that will power a new generation of devices, such as digital set top boxes and networked media players, and bring consumers advanced in-home information and entertainment services.
Green Hills toolkit supports Freescale's auto MCUs Product News 4/20/2007 Post a comment Components of the Green Hills Software development toolkit include: royalty-free real-time operating systems (RTOS), optimizing C/C++ compilers for Power Architecture, MULTI integrated development environment (IDE) with multicore debugger, virtual prototyping platform, TimeMachine tool suite and high-speed Nexus hardware probes.
Intel cranks 45nm ultramobile CPU News & Analysis 4/18/2007 Post a comment Intel Corp. is applying its 45nm process technology to a new processor designed for ultramobile PCs, a new class of mobile systems smaller than notebooks but larger and more feature rich than cellphones.
Intel tips more details on Itanium roadmap News & Analysis 4/17/2007 Post a comment Intel tipped more details about its Itanium processors today, committing to use of a new high-speed interconnect, the Common System Interconnect, on its high-end server microprocessors starting in 2008.
China launches satellite for rival to GPS News & Analysis 4/17/2007 Post a comment China launched its second navigation satellite over the weekend as part of a plan to build the country's "Compass" navigational system, which could emerge to rival America's Global Positioning System.
Via gains top-tier CPU win with HP China PC News & Analysis 4/13/2007 Post a comment Hewlett Packard is teaming up with Taiwan's Via Technologies to produce a low power desktop PC aimed at enterprise users in China. The deal is a break for tiny Via, which often struggles with larger rival Intel Corp. in the world's second largest PC market.
STMicro backs China's AVS codec News & Analysis 4/13/2007 Post a comment The dominoes are falling. Prompted by China Netcom's decision to use a domestically developed audio video codec in its IPTV rollout, STMicroelectronics is adding support into two of its chip families.
IBM readies direct chip-to-chip links News & Analysis 4/12/2007 Post a comment IBM Corp. said it has made advances in through-silicon via packaging that will allow it to ship production chips using the new interconnect in 2008. The technique is said to increase chip performance and power efficiency.
IBM readies direct chip-to-chip links News & Analysis 4/12/2007 Post a comment IBM Corp. said it has made advances in through-silicon via packaging that will allow it to ship production chips using the new interconnect in 2008 initially for power amplifiers in Wi-Fi and cellular chips and later to the Power processors used in its Blue Gene supercomputers.
Comparison of feedback implementations for digital audio amplifiers: Part 2 Design How-To 4/12/2007 Post a comment The ideal amplifier has a straightforward task. It must behave like a perfect voltage source, delivering the correct amplified output voltage to the load. Many factors combine to make this difficult to achieve. David Jones' "Comparison of feedback implementations for digital audio amplifiers" part 2 lays out alternatives for feedback.
Digital amplifier overview Design How-To 4/11/2007 1 comment A digital amplifier takes a digital input, which is typically in a linear Pulse Code Modulation (PCM) format, and performs a digital conversion to Pulse Width Modulation (PWM). This article provides a brief description of how a Class D Amplifier works.
Marvell chip supports Bluetooth, FM Product News 4/11/2007 Post a comment Marvell Technology Group rolled out a single-chip solution that combines Bluetooth core specification version 2.0 with Enhanced Data Rate-compliant baseband, a radio frequency transceiver and a worldwide FM radio receiver.
Analyst forecasts 18% chip sales growth in '08 News & Analysis 4/10/2007 Post a comment Strong end market growth and stabilizing average selling prices will drive semiconductor industry revenue to $316 billion in 2008, an increase of nearly 18 percent from projected 2007 chip industry sales, according to a forecast by market watcher Objective Analysis.
AMD cuts prices as it slashes costs News & Analysis 4/10/2007 Post a comment Price cuts on AMD's Athlon X2 dual core processors went into effect on the same day the chipmaker said it would miss its revenue target, due in part to lowered average selling prices and lower unit sales in the channel.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.