Achieving Certified IP Quality Efficiently Design How-To 5/29/2007 Post a comment The increasing use of design IP has reduced design effort per gate for the chip designer, but it has had an inverse effect on the chip-level integration and functional verification effort. This article explains how using complete formal functional verification enables IP providers to certify highest IP quality, and to do so cost-effectively and with a high productivity.
Intel researchers focus on parallel software News & Analysis 5/25/2007 Post a comment With the rise of multicore CPUs the push for parallel software has become job number 1 for Intel's microprocessor R&D labs where researchers are developing domain-specific languages, as well as parallel versions of existing languages and applications.
Intel-ST deal: What it means News & Analysis 5/23/2007 Post a comment Now that Intel and STMicroelectronics have finally sealed the deal, here's a look at how the deal measures up and what it may mean for the rest of the industry.
Chip brands failing Intel, AMD News & Analysis 5/22/2007 Post a comment Core Duo, Core2 Duo, Pentium Dual Core, Fusion, CoreFusion. Confusion? That seems to be the mental state of consumers, based on a new report that says a dizzying array of chip brands isn't much help for buyers.
Chip brands failing Intel, AMD News & Analysis 5/22/2007 Post a comment What's in a name? Apparently not much, according to one survey that finds chip brands don't register as well with consumers as companies might think.
Intel gives deep dive on Penryn CPUs News & Analysis 5/21/2007 Post a comment Intel Corp. will provide a peak deeper inside its upcoming 45nm Penryn processors at the Microprocessor Forum this week, giving a deep dive inside some of the low power and media acceleration capabilities coming in the chips that will start shipping later this year.
How to use DSP caches, part 1 Design How-To 5/21/2007 Post a comment Part 1 of this two-part series introduces the fundamental concepts of cache memory, using the C64x DSP as an example. It explains why caches are needed, how caches communicate with main memory, and how to optimize cache performance.
Power shift in the laptop News & Analysis 5/21/2007 Post a comment Advanced Micro Devices Inc. and Intel Corp. are pulling neck-and-neck in the race to define the core high-end silicon for notebook computers as they edge out desktops as the dominant platform in client computing.
AMD's Puma chases Intel Centrino sockets News & Analysis 5/18/2007 Post a comment Advanced Micro Devices announced today its Griffin CPU, the first processor it has designed from the ground up for notebooks. AMD is pairing its new CPU with a chip set in a Puma platform that aims to take on Intel's Centrino chips for sockets in high-end notebooks.
ADCs operate at temperature up to 125°C Product News 5/17/2007 Post a comment Linear Technology developed the LTC1403AH, a 14-bit, 2.8 Msamples/s SAR ADC which operates over the automotive -40°C to +125°C temperature range. The LTC1403AH is powered from a single 2.7 V to 3.6 V supply, draws 14 mW at 2.8 Msamples/s, and is available in a small, 10-lead MSOP package.
Special Issue: Inside the Toyota Prius: Part 5 - Inverter/converter is Prius' power broker Teardown 5/14/2007 1 comment
The inverter/converter unit (ICU) is the ringmaster of all of the electrical conversion in the Prius. The hybrid's two motor generator units have distinct roles: MG1 recharges the high-voltage (approximately 200-V) nickel metal hydride battery pack located in the rear of the car and also applies direct power to drive the MG2 assembly. MG1 additionally serves as the electric motor used to start the gas engine portion of the power train. MG2 is the primary electric drive motor when energized and
Under the Hood: Tried-and-true design concepts drive Prius Teardown 5/14/2007 2 comments
Upon tearing apart a Toyota Prius--spanking new from the dealer--what strikes an engineer's eye is that this first parallel drive train gas/electric hybrid car is more like other modern vehicles than not. Ignore the large nickel-metal hydride battery tucked out of sight behind the rear seat; filter out the associated starter-motor-like
Special Issue: Airbag ASSPs: smart, sensitive Teardown 5/14/2007 Post a comment
Automotive airbag triggers incorporate a high degree of intelligence, as well as analog sensitivity and mixed-signal functionality. Today, smart airbags have occupant-detection features and inflate to variable volumes.
Special Issue: Rivalry in consoles is no game Teardown 5/14/2007 Post a comment
Videogame systems have come a long way from the days of a paddle and a bouncing ball. Interactive games, online play and realistic graphics have moved gaming from something that only kids play to a pastime that has entered many homes. Combined with computer games, this amounted to a $7.4 billion industry in 2006, almost triple the software sales of 1996. According to a recent Nielsen survey, 41.1 percent of
Under the Hood: Focus on Qualcomm and TI at 65 nm Teardown 5/14/2007 Post a comment
Given the significant market size for the cell phone industry and the different types of products available, it's not surprising that Qualcomm and Texas Instruments offer a number of different baseband solutions. Their semiconductor devices have been advancing to accommodate the wide variety of systems, taking into account different size, power consumption and functionality restrictions.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.