RF Design with Op Amps: Part 2 Design How-To 6/27/2007 Post a comment When high performance and stability are important in an application, op amps give the RF designer a powerful new tool in their arsenal to achieve system specifications. Read on to find out how.
Freescale launches multi-core communications platform Product News 6/27/2007 Post a comment Freescale Semiconductor has unveiled its Multi-core Communications Platform based on its PowerQUICC processor families. The architecture is designed to help customers more easily migrate to multi-core environments while preserving the value of legacy software investments.
Freescale flexes its muscles in 8/32-bit MCUs Product News 6/26/2007 Post a comment Freescale Semiconductor has started sampling a range of microcontrollers that it says will allow designers to upgrade easily from 8-bit to 32-bit capability with the same on-chip peripheral functions and tool sets.
Xilinx brings FlexRay to FPGA Product News 6/22/2007 Post a comment FPGA maker Xilinx has implemented FlexRay IP on its Spartan-3 Automotive FPGA family. The device interacts with the FlexRay middleware and protocol stack from Vector Informatik.
RF Design with Operational Amplifiers: Part I Design How-To 6/20/2007 2 comments Want to make the jump to using op amps but just don't have the time to figure out what you need to know? Then today is your lucky day! TI's Bruce Carter steps up with a two-part series to help with an explanation on the key things RF designers need to know about using op amps.
NXP connects cars to the outside world Product News 6/19/2007 Post a comment Chip maker NXP sees multiple opportunities to create new automotive applications through the combination of diverging communications technologies. These applications center on telematics and comfort electronics. Not in all cases, however, they will help to increase the driver's comfort.
Analysis: Intel must reinvent itself News & Analysis 6/19/2007 Post a comment In many respects, Intel Corp. is unlike any other company in the electronic-components industry. Aside from its overwhelming dominance of the microprocessor sector, the company outranks its competitors in one other area: expenditures on research and development and capital equipment.
Notebooks drive PC forecast up News & Analysis 6/18/2007 Post a comment Market watcher iSuppli Corp. raised its 2007 forecast a couple notches to 11.2 percent based on stronger than expected demand for notebook computers in the first half of the year.
Intel bets big on the ultramobile PC News & Analysis 6/18/2007 Post a comment Envisioning a computing environment populated with devices known variously as ultramobile PCs (UMPCs), mobile Internet devices (MIDs), and even "smartphones on steroids," Intel is introducing a chip architecture to enable Internet-focused, multimedia-enhanced, handheld gadgets powered by light, cool, energy-stingy chips. It's Intel's biggest repositioning since its drive into notebook-specific processors in 2000, which led to the Centrino chip.
Fab-lite Infineon to keep up R&D spend News & Analysis 6/18/2007 Post a comment Once a typical integrated device maker (IDM), Infineon Technologies AG is transforming itself into a fab-lite manufacturer – using foundry partners for a large proportion of its digital manufacturing and uses its own legacy fabs for RF, mixed-signal and more esoteric manufacturing. Christoph Hammerschmidt discussed the ramifications of this strategy with board member Hermann Eul.
Did you know?: R&D drives a giant's self-reinvention News & Analysis 6/18/2007 Post a comment In many respects, Intel Corp. is unlike any other company in the electronic-components industry. Aside from its overwhelming dominance of the microprocessor sector, the company outranks its competitors in one other area: expenditures on research and development and capital equipment.
Tiny Nintendo DS Lite drives volume Teardown 6/18/2007 Post a comment
Nintendo is enjoying a renaissance in gaming, so it seemed like a good time to peek into its current offering in portables. While a recent Nintendo Wii teardown by Portelligent tells a fascinating story of higher-end graphics and motion-sensing controllers, the lower-profile handheld game platforms are still a big part of the company's bottom line, and they're notable for their engineering.
NXP rolls fail-safe automotive chips Product News 6/18/2007 Post a comment Adressing increasingly complex in-car networking applications, NXP has introduced a family of fail-safe System Basis Chips (SBC), designed do communicate via LIN bus or CAN bus.
ARC buys Tenison for simulation capability News & Analysis 6/15/2007 Post a comment ARC International plc (Elstree, England), known as a supplier of configurable processor cores and subsystems, has said it has acquired Tenison Technology EDA Ltd. (Cambridge, England) system-level EDA company for about $2 million in cash.
Intel tips new details on Itanium News & Analysis 6/14/2007 Post a comment Intel Corp. will roll out next year Itanium and Xeon CPUs along with a common south bridge I/O chip using a new high-speed interconnect, beginning with the Tukwilla CPU.
ARM Cortex-M3 core powers 32-bit MCUs Product News 6/13/2007 Post a comment STMicroelectronics has announced a family of 32-bit flash microcontrollers based on the ARM Cortex-M3, a core with features specifically designed for embedded applications requiring a combination of high performance, low power and cost.
Build simple and inexpensive FlexRay nodes Design How-To 6/13/2007 Post a comment The FlexRay protocol provides time-triggered communication at rates 10 times that of CAN. With its nodes being critical pieces of the FlexRay-based design, how can an automotive electronics designer get one started?
Are PC chip sets passe? News & Analysis 6/13/2007 Post a comment A debate is heating up in some circles of the PC world about whether the venerable PC chip set will stay or fade away as process technology makes it increasingly feasible to bring its features on board the CPU.
Next billion PCs shipping soon News & Analysis 6/13/2007 Post a comment All the attention is on cell phones shipping a billion units annually, but the PC is also approaching a billion units " cumulatively over 27 years. Now the next billion are expected to ship within several years and mostly to emerging markets.
Are PC chip sets passe? News & Analysis 6/13/2007 Post a comment Process technology may mean that CPU and core logic integration is possible, but don't expect the venerable chip set to quietly fade away.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.