Freescale plans basestation-on-chip News & Analysis 6/29/2010 2 comments Freescale Semiconductor plans to best its embedded communications competitors not just by depending on raw computing speed for its processors but by reaching the higher integration levels needed to put a "basestation on a chip," according to Lisa Su, senior vice president and general manager for networking and multimedia.
Samsung, TSMC hit by ITC complaint News & Analysis 6/28/2010 3 comments STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
CoorsTek buys ceramics unit for $245M News & Analysis 6/28/2010 Post a comment CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses News & Analysis 6/28/2010 1 comment Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi News & Analysis 6/28/2010 Post a comment Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Designing systems for extreme environments Design How-To 6/28/2010 Post a comment Designing embedded systems destined for extreme environments, such as 1 mile below the surface of an ocean, adds a layer of complexity and difficulty for the designer. Nate Holmes of National Instruments describes some common challenges and latest tools and approaches to issues like power and test that can aid designers in creating successful systems headed for tough spots.
Which type of "analog" designer are you? Blog 6/28/2010 4 comments There are engineers doing circuits the analog way, because they absolutely want to, or because they are forced to, or somewhere in-between; judging how much analog makes sense means stepping back and making objective assessments
Atmel completes sale of fab in France News & Analysis 6/24/2010 Post a comment Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
First look inside iPhone 4 Teardown 6/24/2010 6 comments You could call the new Apple iPhone 4 an iPad Nano because it uses at least six chips from the popular Apple tablet, according to analysts from UBM TechInsights that have done a teardown of the new smartphone, revealing it uses a MEMS gyro from STMicroelectronics.
China's $25 billion to boost domestic production, says analyst News & Analysis 6/24/2010 2 comments LONDON — The Chinese government is preparing to spend $25 billion on wafer fabs to boost domestic chip manufacturing over the next five years, according to market research company The Information Network. This is set to boost the proportion of local demand met by domestic wafer fabs and diminish Chinese chip imports, the analysis firm said
MIPS to restructure, align with Android News & Analysis 6/24/2010 Post a comment Processor IP licensor MIPS Technologies Inc. has announced a restructuring plan that will see it reduce headcount and incur a $1 million restructuring charge. The changes are expected to save company between $2 million and $2.4 million in annual expense, including the current financial year.
AMD x86 cores at Hot Chips News & Analysis 6/24/2010 Post a comment AMD is expected to steal the limelight at the annual Hot Chips conference when it describes two new x86 cores that mark the first major architectural advance for the company in several years.
Freescale CEO: 'Connected intelligence' beating recession News & Analysis 6/22/2010 Post a comment Freescale Semiconductor revealed its vision of the future of semiconductor technology at the Freescale Technology Forum, where CEO Richard Beyer predicted that the recession will continue to fade by virtue of the commercial success of what he called "connected intelligence."
Tilera, Quanta roll low power server News & Analysis 6/22/2010 3 comments Multicore processor designer Tilera Corp. announced it plans to ship a 200-core device in 2013 and demonstrated a 512-core server made by partner Quanta Computer Inc. using Tilera's current 64-core chip.
Sensors integrate ColdFire processor, MEMS accelerometer Product News 6/22/2010 1 comment Freescale Semiconductor new Xtrinsic family of smart MEMS sensors combine a 32-bit ColdFire microcontroller with on-chip algorithms for all the common operations like tap, touch, tilt and orientation, thereby streamlining designs and offloading the application processor, the company said.
Freescale's 64-bit Power core News & Analysis 6/22/2010 2 comments Freescale Semiconductor has designed its first 64-bit Power core and two integrated communications processors using it, likely outrunning Mips-based competitors such as Cavium and NetLogic, but still slightly behind in raw performance Intel's Xeon which is gaining market momentum.
ST chip measures power line current up to 70V Product News 6/22/2010 Post a comment ST's latest high-side current-sense amplifier simplifies the design of power management, monitoring and safety equipment by allowing direct and accurate measurement of current in power lines operating at up to 70V.
Trio forms 3-D chip alliance News & Analysis 6/21/2010 2 comments Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.