AMD, HP propose extensions for PCI Express 3.0 News & Analysis 7/31/2009 Post a comment Researchers from Advanced Micro Devices and Hewlett-Packard have written two extensions to the PCI Express 3.0 specification which aims to enable lower cost chips that could support multiple protocols and reduce processor overhead.
TU Dresden brings power efficient MPSoC to DAC News & Analysis 7/27/2009 Post a comment At the Design Automation Conference (DAC) that currently takes place in San Francisco, a group of researchers and chip designers from the Dresden Technical University present what they hope it could offer a solution for the challenge of modem signal processing for upcoming wireless communications generations.
Samsung, Intrinsity pump ARM to GHz rate News & Analysis 7/26/2009 Post a comment Samsung Electronics Co. and Intrinsity Inc. announced they have first silicon for Humming bird, an ARM Cortex A8 that runs at a GHz and delivers more than 2,000 Dhrystone Mips, competing with Intel Atom processors in an expanding market of mobile devices.
Cisco, Intel help power up smart grids News & Analysis 7/21/2009 1 comment A broad group of companies including giants Cisco Systems and Intel Corp. are rolling up their sleeves to help set standards and compete for Department of Energy grants to build smart electric grids.
ISuppli: IC inventories down to appropriate levels News & Analysis 7/20/2009 Post a comment Global semiconductor inventories have declined to appropriate levels following four consecutive quarters of reductions, clearing the way for stockpile rebuilding and higher sales in the second half of the year, according to market research firm iSuppli.
Intel keynoter offers pep talk, vision of better days News & Analysis 7/16/2009 Post a comment Anand Chandrasekher, senior vice president and general manager of Intel's Ultra Mobility Group, did his best to offer hope to beleaguered semiconductor equipment executives in a Semicon West keynote address, predicting that the convergence of communications and computing would mean big money for the industry in years to come.
Analysis: Intel slowly gears up for system-on-chips News & Analysis 7/9/2009 2 comments Intel Corp. isn't giving much detail on its two-year old initiative to become a systems-on-chip supplier, but interviews with executives and analysts show the company is making gradual progress laying the foundations to build competitive SoCs for cellphones, TVs, videogame consoles and communications gear.
Chrome OS gets mixed reactions News & Analysis 7/8/2009 1 comment Chip makers and most analysts gave a thumbs up to the concept of a Google Chrome operating system, but system makers--including the top customers of Microsoft Corp.--took a more guarded wait-and-see stance on the Windows alternative that aspires to make its way eventually into mainstream notebook and desktop computers.
L & T announces TI OMAP3530 reference board News & Analysis 7/7/2009 Post a comment GDA Technologies, a L & T Infotech subsidiary, has launched its Ti OMAP3530 reference board in Linux, WiNCE and Android flavors, aimed at OEMs making portable media players, navigation, internet and gaming devices.
Update: Chip bans hit OEM plans News & Analysis 7/1/2009 8 comments Systems makers are beginning to feel the bite of a limited exclusion order prohibiting the import of chips from six companies found to infringe two packaging patents of Tessera Technologies Inc.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.