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posted in July 2009
AMD, HP propose extensions for PCI Express 3.0
News & Analysis  
7/31/2009   Post a comment
Researchers from Advanced Micro Devices and Hewlett-Packard have written two extensions to the PCI Express 3.0 specification which aims to enable lower cost chips that could support multiple protocols and reduce processor overhead.
Globalfoundries more advanced than TSMC, analyst says
News & Analysis  
7/31/2009   Post a comment
In the competitive foundry landscape, Globalfoundries might be not a leader in terms of volume, but in any case it is a leader in terms of technology, finds Gartner analyst Bob Johnson.
TU Dresden brings power efficient MPSoC to DAC
News & Analysis  
7/27/2009   Post a comment
At the Design Automation Conference (DAC) that currently takes place in San Francisco, a group of researchers and chip designers from the Dresden Technical University present what they hope it could offer a solution for the challenge of modem signal processing for upcoming wireless communications generations.
Samsung, Intrinsity pump ARM to GHz rate
News & Analysis  
7/26/2009   Post a comment
Samsung Electronics Co. and Intrinsity Inc. announced they have first silicon for Humming bird, an ARM Cortex A8 that runs at a GHz and delivers more than 2,000 Dhrystone Mips, competing with Intel Atom processors in an expanding market of mobile devices.
Engineer's suicide throws light on iPhone mania
News & Analysis  
7/23/2009   3 comments
A 25-year old engineer working for a company that assembles Apple iPhones reportedly took his life this week in the wake of losing a prototype of a future Apple handset.
ST-Ericsson raises sales, widens loss
News & Analysis  
7/23/2009   Post a comment
In the second quarter, ST-Ericsson benefited from customers re-stocking and the demand picking up in China. Nevertheless, the company widened its operating loss.
COMMENTARY - Multicore and ETX: Doing More with Less
Design How-To  
7/22/2009   Post a comment
With the development of multicore, applications using the ETX standard made a seamless jump in performance by shifting from one core to two allowing board designers to take advantage of multicore's 'more for less' foundation.
IDT : Video processor reduces compression artifacts
Product News  
7/22/2009   Post a comment
IDT has added the IDT HQV Vida to its Hollywood Quality Video (HQV) family of video processors.
Atmel : Radiation-hardened SPARC processor targets space applications
Product News  
7/22/2009   Post a comment
The AT697 Revision F delivers 90 MIPs at 100 MHz over full temperature and voltage ranges for only 0.7 W.
AMD narrows loss, beats revenue expectations
News & Analysis  
7/21/2009   Post a comment
Advanced Micro Devices beat consensus analyst expectations for the second quarter, posting a GAAP net loss of $330 million on revenue of $1.18 billion, the company said.
Intel cutting 294 manufacturing jobs in Ireland
News & Analysis  
7/21/2009   Post a comment
Intel announced it would eliminate 294 jobs in its Ireland fab operations and related service groups due to reduced demand for older 200-mm products manufactured there.
Cisco, Intel help power up smart grids
News & Analysis  
7/21/2009   1 comment
A broad group of companies including giants Cisco Systems and Intel Corp. are rolling up their sleeves to help set standards and compete for Department of Energy grants to build smart electric grids.
Analyst upgrades AMD ahead of Q2 results
News & Analysis  
7/20/2009   Post a comment
A Wall Street analyst upgraded his rating on Advanced Micro Devices, saying he expects the company to report strong second quarter results and third quarter guidance.
ISuppli: IC inventories down to appropriate levels
News & Analysis  
7/20/2009   Post a comment
Global semiconductor inventories have declined to appropriate levels following four consecutive quarters of reductions, clearing the way for stockpile rebuilding and higher sales in the second half of the year, according to market research firm iSuppli.
Low-power Intel Architecture Platform for In-vehicle Infotainment
Design How-To  
7/16/2009   Post a comment
Fast-changing connectivity and multimedia demands for in-car infotainment increasingly collide with the long development cycle in this industry. An in-vehicle infotainment platform optimized for automotive environments could gap the bridge between the divergent requirements.
Intel keynoter offers pep talk, vision of better days
News & Analysis  
7/16/2009   Post a comment
Anand Chandrasekher, senior vice president and general manager of Intel's Ultra Mobility Group, did his best to offer hope to beleaguered semiconductor equipment executives in a Semicon West keynote address, predicting that the convergence of communications and computing would mean big money for the industry in years to come.
Intel Q2 hurt by EU fine but sales beat estimates
News & Analysis  
7/14/2009   Post a comment
Intel Corp. beat analysts' revenue and net loss estimates in the second quarter and the company is projecting continuing improvements during the current quarter with margins growing as demand picks up across the industry.
MIPS CEO Bourgoin to step down
News & Analysis  
7/13/2009   Post a comment
John Bourgoin, president and CEO of MIPS Technologies Inc., is stepping down.
It's staycation time for U.S. electronics industry
Blog  
7/13/2009   Post a comment
The dog days of summer are at hand, and we remain under the unhealthful haze of a recession that has lingered like a stalled air mass over the economy.
Analysis: Intel slowly gears up for system-on-chips
News & Analysis  
7/9/2009   2 comments
Intel Corp. isn't giving much detail on its two-year old initiative to become a systems-on-chip supplier, but interviews with executives and analysts show the company is making gradual progress laying the foundations to build competitive SoCs for cellphones, TVs, videogame consoles and communications gear.
Chrome OS gets mixed reactions
News & Analysis  
7/8/2009   1 comment
Chip makers and most analysts gave a thumbs up to the concept of a Google Chrome operating system, but system makers--including the top customers of Microsoft Corp.--took a more guarded wait-and-see stance on the Windows alternative that aspires to make its way eventually into mainstream notebook and desktop computers.
NXP : ARM9-based MCUs are cost and power-efficient
Product News  
7/7/2009   Post a comment
NXP has expanded its ARM9-based product portfolio by adding the LPC314x and LPC315x devices to the LPC31xx series.
L & T announces TI OMAP3530 reference board
News & Analysis  
7/7/2009   Post a comment
GDA Technologies, a L & T Infotech subsidiary, has launched its Ti OMAP3530 reference board in Linux, WiNCE and Android flavors, aimed at OEMs making portable media players, navigation, internet and gaming devices.
A real-time HPC approach for optimizing Intel multi-core architectures (Part 3 of 3)
Design How-To  
7/6/2009   Post a comment
In this three part series, Dr. Algosa Vrancic and Jeff Meisel presents findings that demonstrate how a novel approach is allowing for real-time high-performance computing (HPC) in order to solve engineering problems with multi-core processors that were not possible only five years ago. Part 3 considers industry examples that employ this particular methodology.
What Cisco's 'CE 2.0' challenge means to consumer electronics market
News & Analysis  
7/6/2009   Post a comment
Cisco Systems is poised to build a template for what it calls the consumer electronics company "Version 2.0."
Design considerations when using programmable integer-N PLL ICs
Design How-To  
7/6/2009   2 comments
Understand how parameters of the PLL divisor loop affect performance
May 'actual' chip sales show W-shaped trend
News & Analysis  
7/6/2009   Post a comment
May's global market for semiconductors was $16.15 billion, down 20.2 percent from its value in May 2008, according to "actual" data from the World Semiconductor Trade Statistics (WSTS) organization.
Update: Chip bans hit OEM plans
News & Analysis  
7/1/2009   8 comments
Systems makers are beginning to feel the bite of a limited exclusion order prohibiting the import of chips from six companies found to infringe two packaging patents of Tessera Technologies Inc.
Innovasic rolls pin-compatible x86 and x88 embedded processors
Product News  
7/1/2009   Post a comment
Innovasic Semiconductor, a vendor focused on extended life semiconductors, has announced engineering samples are shipping for the IA186XL and IA188XL.


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Max Maxfield

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Martin Rowe
1 Comment
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