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Content tagged with Microprocessor
posted in July 2010
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Infineon rolls wireless control receivers for automotive, consumer apps
Product News  
7/26/2010   Post a comment
Infineon Technologies AG announced it has introduced wireless control receivers that offer enhanced sensitivity, lower power consumption and flexible multi protocol support.
NetLogic four-chip module
News & Analysis  
7/26/2010   1 comment
NetLogic Microsystems has formally announced the XLP8128S, a four-chip module that links four of the company's quad-threaded, eight-core XLP832 network processors on its proprietary Inter-chip Coherency Interface for high-end networking systems.
6U CompactPCI processor blade sports Intel Core i7 and QM57 chipset
Product News  
7/23/2010   Post a comment
ADLINK Technology’s highly integrated cPCI-6510 series supports optional extended temperature ranges and incorporates two PMC sites and DDR3 memory with ECC.
NXP prices IPO to raise $700 million
News & Analysis  
7/23/2010   2 comments
In a reduction of the expected billion-dollar initial public offering NXP has priced its IPO offering of 34 million shares at between $18 and $21 each, to raise between $612 million and $714 million.
Freescale execs on debts, profit goals, supply constraints
News & Analysis  
7/23/2010   11 comments
Freescale Semiconductor said supply constraints will persist at least through early 2011, but sales and margins are improving.
Microsoft-ARM deal is a game-changer
News & Analysis  
7/23/2010   8 comments
Microsoft's move to take an architectural license from ARM means ARM support for Microsoft in consumer applications and Microsoft support for ARM in PCs is looking not only likely, but strategic for both companies.
Microsoft takes ARM architectural license
News & Analysis  
7/23/2010   6 comments
Microsoft has signed an architectural license agreement with ARM Holdings plc, giving the software giant access to the ARM processor architecture and the freedom to design its own 'ARM' chips.
IP vendor launches alliance on chip-to-chip interface
News & Analysis  
7/22/2010   1 comment
Memory and interface I/O IP vendor MoSys launched an alliance of semiconductor vendors supporting its GigaChip chip-chip communications interface.
Losses at ST-Ericsson hit ST's bottom line
News & Analysis  
7/22/2010   4 comments
Despite losses at ST-Ericsson, STMicroelectronics Inc.'s revenues for the second quarter of 2010 totaled $2.531 billion, up 8.9 percent sequentially and up 27 percent year-over-year.
Troubling gap seen in photomask industry
News & Analysis  
7/22/2010   Post a comment
The captive photomask shops were generally investing during the recent downturn, but it was a different story for the merchant players.
Battle rages on in RTP market
News & Analysis  
7/22/2010   1 comment
When Applied rolled out its next-generation, laser-based anneal system last year, there were fears among competitors that the company would further dominate the rapid thermal processing (RTP) equipment market.
SanDisk CEO Harari to retire
News & Analysis  
7/22/2010   2 comments
In a major surprise, Eli Harari, founder, chairman and chief executive of SanDisk Corp., will retire from his current positions.
Carsen claims legal victory over Amkor
News & Analysis  
7/22/2010   Post a comment
Carsem Sdn. Bhd. has claimed a victory over Amkor Technology Inc. in a bitter legal dispute.
Air Products CEO: Disappointed with Airgas
News & Analysis  
7/22/2010   Post a comment
Air Products and Chemicals Inc. has responded to the announcement by Airgas Inc.
Introduction to Networking--III
Design How-To  
7/22/2010   Post a comment
Networking is a new concept for many embedded engineers. The goal of this book, therefore, is to provide a bridge that spans from basic concepts to how to add networking functionality to an embedded design. This chapter provides a quick introduction to networking protocols and then moves rapidly to a discussion on TCP/IP over Ethernet, today’s preferred network technology combo with the widest usage in terms of the number of devices and applications.
Lead times: Damned if you do, damned if you don't
Blog  
7/22/2010   8 comments
Some chip makers are pulling in lead times, others are pushing them out. At least one Wall Street analyst sees both as red flags.
IBM unifies mainframe architecture in zEnterprise
News & Analysis  
7/22/2010   1 comment
IBM has announced what it labels as the most significant new mainframe systems architecture in the last 20 years. The zEnterprise mainframe design will allow workloads on mainframe, Power7 and System x servers to share resources and be managed as a single system.
LTE Physical Layer Overview - Part III
Design How-To  
7/22/2010   1 comment
This article presents an overview of the LTE physical layer with a focus on essential aspects of the physical layer for FDD mode which is the dominant mode of operation. It is hoped that this paper will serve as a useful introduction to practitioners involved in designing LTE based-networks and systems. Part III looks at physical channels.
SMIC extends Virage IP deal to 40-nm
News & Analysis  
7/22/2010   Post a comment
Intellectual property licensor Virage Logic Corp. and foundry Semiconductor Manufacturing International Corp. have extended their partnerhip to include a 40-nm low-leakage process (LL) technology.
India, Israel plan chip innovation fund
News & Analysis  
7/22/2010   2 comments
An Indian-Israeli innovation fund will underwrite research and development among chip design companies.
Advanced Energy sells mass flow control line
News & Analysis  
7/22/2010   Post a comment
Advanced Energy has entered into an agreement to sell its Aera mass flow control and related product lines.
Silicon Labs rolls wireless remote control SoC
Product News  
7/22/2010   2 comments
The EZradio system-on-chip ditches the quartz crystal in favor of auto-tuning circuitry that uses CMOS oscillators and variable capacitors to lock-in radio frequency without external components.
EVE plans 'vigorous' defense against Mentor claim
News & Analysis  
7/22/2010   Post a comment
French emulation technology vendor EVE said it would "vigorously" defend itself against a request brought by Mentor Graphics that Japan bar the importation of EVE products.
Elpida, Spansion ink NAND deal
News & Analysis  
7/21/2010   1 comment
Following its recent move out of bankruptcy, Spansion Inc. posted a drop in sales and announced its long-awaited deal with Japan's Elpida Memory Inc.
Corning to invest in China
News & Analysis  
7/21/2010   Post a comment
Corning Inc. will expand its LCD glass operations in China with a $965 million investment.
Nanya, Inotera see red, but raise capex
News & Analysis  
7/21/2010   Post a comment
Nanya Technology Corp. and its affliate, Inotera Memories Inc., posted quarterly losses, but the two firms raised their capital spending.
EUV: Gaining steam or more hype?
News & Analysis  
7/21/2010   4 comments
Extreme ultraviolet lithography (EUV) is gaining steam.
Cadence, ARM to develop ARM-optimized system realization solution
Product News  
7/21/2010   Post a comment
Cadence Design Systems Inc and ARM Ltd. announced an expanded collaboration to develop an optimized system realization solution for ARM processors.
Update: Applied scraps turnkey solar line, cuts jobs
News & Analysis  
7/21/2010   1 comment
As expected, Applied Materials Inc. will discontinue its SunFab turnkey line for manufacturing thin-film solar panels.
Analyst: ARM blocked from server market
News & Analysis  
7/21/2010   1 comment
The low power server will emerge in 2011, according to an industry analyst, but they will be based on Intel processors rather than ARM's.
VC funding fizzled in June, says GSA
News & Analysis  
7/21/2010   2 comments
June produced a downturn in funding activity for fabless, fabbed and semiconductor equipment companies, both by number of deals and their value, according to the Global Semiconductor Alliance.
ARM, TSMC refresh partnership, aim at 20-nm
News & Analysis  
7/21/2010   3 comments
Foundry chipmaker TSMC and ARM have signed an agreement that provides TSMC with access to ARM processors and enables the development of ARM physical IP across TSMC technology nodes down to 20-nm.
Lost in translation: Shanghai Embedded Systems Design Contest - Part 1
Blog  
7/21/2010   Post a comment
Stewart Christie reviews some highlights - and some lowlights - from his trip to Shanghai Jiao Tong University to be a judge in the 2010 Intel Cup Embedded System Design Contest.
Linear reports record sales
News & Analysis  
7/21/2010   2 comments
Linear Technology Corp. reported record sales amid the upturn.
Fab tool book-to-bill ratios up
News & Analysis  
7/20/2010   Post a comment
Japanese manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.40 in June, up from 1.13 in May, an industry group said.
ISuppli boosts iPad sales forecast
News & Analysis  
7/20/2010   1 comment
Market research firm iSuppli boosted its 2010 sales forecast for Apple iPad tablet, saying it now expects Apple to ship 12.9 million units this year, up from a previous forecast of 7.1 million.
Deciphering TI’s Q2 results, investor reaction
Blog  
7/20/2010   7 comments
Texas Instruments is adding capacity to whittle down analog lead times and boost market share. Are investors buying it?
Penn raises 2010 chip market forecast, cuts 2011
News & Analysis  
7/20/2010   7 comments
With signs of a strong second quarter for chip sales Malcolm Penn, founder and principal analyst with Future Horizons Ltd., has raised his forecast for growth in the global chip industry in 2010 to 36 percent, up from 31 percent, which he gave out in May 2010.
Probe-card rivals face legal battle
News & Analysis  
7/20/2010   2 comments
Two probe-card rivals face a legal battle.
Smart metal enables solid-state refrigerant
News & Analysis  
7/20/2010   7 comments
Thermally elastic smart metals can take the place of greenhouse gases used in conventional vapor compressor refrigeration technology by enabling a solid-state molecules to absorb or release heat by changing their shape.
XMOS names CEO
News & Analysis  
7/20/2010   2 comments
XMOS has announced the appointment of Terry Leeder as CEO. He replaces interim CEO Charles Cotton, who remains as a board member.
IBM, Hittite ink millimeter-wave deal
News & Analysis  
7/20/2010   1 comment
Hittite has entered into a joint development agreement with IBM Corp. related to millimeter-wave technology.
ARM, TSMC ink strategic agreement
News & Analysis  
7/20/2010   1 comment
ARM Holdings will provide TSMC with access to a broad range of ARM processors as part of a long-term strategic agreement that enables the development of ARM physical IP through the 20-nm technology node.
Atheros buys China firm
News & Analysis  
7/19/2010   2 comments
Atheros Communications Inc. has signed a definitive agreement to acquire Opulan Technologies Corp., a privately-held Chinese fabless semiconductor company.
Fab tool execs remain upbeat, nervous
News & Analysis  
7/19/2010   1 comment
At last week’s Semicon West trade show here, there were two camps regarding the current and future business outlook: the bulls and the bears.
Report: Intel, FTC reach settlement deal
News & Analysis  
7/19/2010   Post a comment
Intel has agreed to broad changes in the way it markets its graphics chips as part of a preliminary deal struck with the U.S. Federal Trade Commission to settle a suit brought against the No. 1 chip vendor last year, according to a report.
Chip industry Q2 to show 9.4% growth, says analyst
News & Analysis  
7/19/2010   1 comment
Analyst Mike Cowan is predicting the actual global sales of semiconductors in June will be $28.291 billion in June, equating to a three-month average of $25.23 billion and strong second-quarter sequential growth of 9.4 percent.
Germany backs Infineon ECU research with $6.2 million
News & Analysis  
7/19/2010   2 comments
Audi, Continental, Infineon Technologies and ZMD are being supported by the German government in their efforts to research ways to improve the analytic and diagnostic capability of electronic control units (ECUs) in automobiles.
Semicon: Rumors raise 450-mm profile
News & Analysis  
7/19/2010   2 comments
There were no major 450-mm announcements at Semicon, but there were indications that the technology is picking up steam.
Interview: HP's CTO of personal systems
News & Analysis  
7/19/2010   4 comments
The computer industry will create new categories of mobile and desktop products, according to Phil McKinney, head of HP's personal computing group.
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