Google's Deep Learning Comes to Movidius News & Analysis 1/27/2016 Post a comment Google will buy Movidius vision processing chips and license the entire Movidius software development environment. Google's goal is to expand its machine intelligence technology beyond the data center, by bringing it to mobile devices.
India Preps RISC-V Processors News & Analysis 1/27/2016 34 comments An India government lab expects to get up to $45 million to develop a 64-bit RISC-V microprocessor, while a team of academics is developing similar chips released as open source.
Create a Cardboard Energy Harvester News & Analysis 1/26/2016 26 comments École Polytechnique Fédérale de Lausanne, Switzerland has invented a cardboard energy harvester suitable for wireless push-button switches and other similar applications.
Qualcomm, TDK Prep $3bn RF Joint Venture News & Analysis 1/25/2016 Post a comment Qualcomm Inc. (San Diego, Calif.) and TDK Corp. (Tokyo, Japan) have agreed to form a joint venture – RF360 Holdings Singapore Pte. Ltd. – to deliver radio frequency modules and filters for multiple applications, including IoT, drones, robotics and automotive electronics.
Chip Stacks Take New Tacks News & Analysis 1/25/2016 4 comments Chip stacks will be key to advances in semiconductors, but in logic TSVs are waning while fan-out techniques and SiPs are on the rise.
Security Outlook Bleak, Improving News & Analysis 1/22/2016 1 comment The rise of the Internet of Things with more devices and data means many more security breaches are ahead but so are more secure SoCs, said an expert at DesignCon.
Multiphase Power Supplies: Not Just For High Current Blog 1/22/2016 Post a comment Power supplies with multiple phases have been traditionally used in applications such as servers, desktop personal computers and laptop computers. These systems require very high current, low-voltage supplies to power core processors. The currents in these applications can be in the hundreds of amperes. In recent years, designers of high-end audio systems have started to take advantage of the multiphase approach as well.
IoT Shoots for the Stars News & Analysis 1/21/2016 1 comment Arrayent, the inventor of the Connect Platform for Internet of Things brands such as Whirlpool, Pentair, Maytag Commercial Laundry, LiftMaster, and more just landed $15 million in Series C funding.
Sony To Use FD-SOI in Stacked Image Sensors News & Analysis 1/21/2016 4 comments At the FD-SOI Forum held here Thursday, the biggest FD-SOI news, which surfaced as chatter during coffee breaks at the Forum, is that Sony is looking to use FD-SOI for image signal processor on chip stack CMOS Image Sensors.
Over-The-Air Charging Is The Future News & Analysis 1/21/2016 9 comments The future of wireless charging doesn’t lie in current coil-based systems, which aren't "really revolutionary." Further, standardization won’t drive wireless charging adoption among consumers.
Intel Protege Pitches Wireless SoC for IoT News & Analysis 1/20/2016 Post a comment Fabless chip company Telink Semiconductor Co. Ltd. (Shanghai, China) has launched the TLSR8269 a system-on-chip intended to provide low power wireless connection for the Internet of Things applications in the smart home.
Can Chip Vendors Set Next-Big-Thing Agenda? Blog 1/19/2016 Post a comment During CES, I met with Etron Technology, whose new products are mostly built around Virtual Reality. It suddenly struck me that Etron isn’t really showing off chips. It’s demonstrating what VR can do for CE vendors.
Has Samsung Snagged Qualcomm Business with New Process? News & Analysis 1/15/2016 2 comments Samsung Electronics, which has been in a nip-and-tuck race with Taiwan Semiconductor Manufacturing Co. (TSMC) to win foundry orders with the world’s most advanced fabrication technology, may have grabbed all of Qualcomm’s business with a second-generation version of its 14nm FinFET process.
Consumers Feel Perils of Connectivity News & Analysis 1/14/2016 7 comments Connectivity is the main thing in the Internet of Things . But what if software updates, unbeknownst to users, go haywire, leaving people -- especially seniors, the ill and babies – inside in the cold?
Al Gore on China, Mobile Web News & Analysis 1/14/2016 4 comments The warming relationship between China and the U.S. is important for continued development of the mobile Internet, according to former vice president Al Gore. Yet new tech companies also play an important role in shaping the future world.
Qualcomm, TDK Prep $3bn RF Joint Venture News & Analysis 1/14/2016 Post a comment Qualcomm Inc. (San Diego, Calif.) and TDK Corp. (Tokyo, Japan) have agreed to form a joint venture – RF360 Holdings Singapore Pte. Ltd. – to deliver radio frequency modules and filters for multiple applications, including IoT, drones, robotics and automotive electronics.
6 Things to Know About HDR, 4K TV News & Analysis 1/14/2016 3 comments The consumer electronics world has just got some much-needed clarity on 4K Ultra High Definition TV. In parallel, the industry now faces a fresh format battle brewing over High Dynamic Range technology. Here are the six things you need to know about 4K, HDR.
All Aboard the Hardware Startup Train News & Analysis 1/13/2016 2 comments After years of software-based funding and tedious development, the crowdfunding tide is turning toward hardware. At International CES, held Jan. 6- 9, officials from Indiegogo said companies throughout the chip and gadget ecosystem are getting on board.
Chip Forecasts, Drivers Diverge News & Analysis 1/12/2016 5 comments Chip revenues could contract 3%, expand 4% or something in between this year, said analysts at the SEMI trade group's annual executive forum.
Ultra-Thin Sensors Flex for Medicine News & Analysis 1/12/2016 Post a comment The future of medical monitoring should be small, flexible and very, very thin according to wearable company MC10. The Massachusetts-based announced several flexible body-worn sensors at International CES, one of which is less than half the thickness of human hair.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments