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Internet of Things Designline
posted in January 2003
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Maxim's supervisory ICs triple up for portable apps
Product News  
1/30/2003   Post a comment
Maxim Integrated Products says its MAX6736-MAX6745 dual- and triple-voltage microprocessor supervisory family for monitoring supply voltages from 0.9 to 5 V is the smallest and lowest-powered (6 microamps) of its kind.
LED drivers keep pace with light
Product News  
1/30/2003   Post a comment
ON Semiconductor says its NCP5008 and NCP5009 white-LED drivers are among the first to accommodate external phototransistor feedback to provide automatic adjustment of LED brightness according to ambient light.
Passives makers actively eliminate lead
Product News  
1/30/2003   Post a comment
Driven by the European Union's move to ban lead in electronic assemblies by 2006 as well as a similar move in Japan, many passive-component manufacturers are well ahead of the deadline to phase out lead in electronic components.
Dc/dc chip set improves 48- to 1-V conversion
Product News  
1/30/2003   Post a comment
National Semiconductor Corp.'s LM5041/LM5101 controllerdriver chip set takes a giant step toward achieving very high efficiency in 48-V to sub-1-volt dc/dc power conversion.
ADSL2 Helps Slash Power in Broadband Designs
News & Analysis  
1/30/2003   Post a comment
As ADSL deployments continue to grow, power consumption will remain a key concern in DSL equipment designs. The ITU's new ADSL2 specs address this issue head-on, delivering two new power management modes.
Mixed-Signal PLD builds multi-voltage power supply
News & Analysis  
1/30/2003   Post a comment
Proponents of programmable analog have long argued that their utility extends way beyond prototype development for analog circuits. In this promotional article, a Lattice Semiconductor engineer shows how a programmable mixed-signal device - one combining both programmable logic and programmable analog functions - can serve as a multifunction power supply controller, integrating many sequencing, monitoring and supervisory functions with a single device.
Searching for the right keys
News & Analysis  
1/29/2003   Post a comment
The advertisers were right. That car you're driving is not your father's automobile. It's a large and increasingly complex network of electronic subsystems and components.The transformation reflects a quiet but ongoing revolution in automotive design. Features that not long ago were considered ground-breaking, like automatic braking systems, electronic ignition systems, airbag restraints, and rear-seat video entertainment, are now accepted as standard. An old friend, John Mayer, has this report.
Low audio amplifier PSSR saves LDO costs in GSM cellular phones
News & Analysis  
1/29/2003   Post a comment
GSM handsets generate RF noise and lower-frequency harmonics that penetrate all the subsystems. How can anyone think about 3G when you earphone is howling? An On Semi apps engineer examines the specs that can cut noise - and save you the cost of an LDO.
Simulating the XFP Electrical Interface: Part 2
Design How-To  
1/29/2003   Post a comment
EM simulations play a vital role in interconnect design for XFP optical systems. This two-part series covers the simulation of the microstip traces, XFP connector, BGA package, and the end-to-end channel.
Understanding the 3G-324M Spec: Part 2
Design How-To  
1/28/2003   Post a comment
Although an all IP wireless network is years away, designers must build systems today that support video and other multimedia. Through the 3G-324M spec, designers tap into the existing circuit-switched network to deliver these services.
SV-AV10 Audio/Video Recorder: The Whole World In Your Hands
Teardown  
1/27/2003   Post a comment
While not yet meeting the needs of most quality-sensitive picture takers and movie makers, Panasonic's SV-AV10 clears the way for a product category that combines a camcorder, digital still camera, audio player, voice recorder and movie viewer in a versatile, pocketable package.
Micron takes another swing at TCAMs
News & Analysis  
1/27/2003   Post a comment
TSMC closer to building China fab
News & Analysis  
1/27/2003   Post a comment
Searching for the right keys
News & Analysis  
1/27/2003   Post a comment
MIPS
News & Analysis  
1/27/2003   Post a comment
With StarFabric as an on-ramp, the PCI Express Advanced Switching is ready
News & Analysis  
1/27/2003   Post a comment
Last August, the StarFabric Trade Association (SFTA) and the PCI Express Advanced Switching (AS) Working Group announced plans to ensure interoperability between the StarFabric architecture and emerging PCI Express AS interconnect standards.
Speed demands accurate models
News & Analysis  
1/27/2003   Post a comment
The complexity in simulating a backplane system has increased dramatically over the past few years.
Signal skew managed dynamically
News & Analysis  
1/27/2003   Post a comment
In the evolution cycles of chip design, developers have continually sought to design smaller, faster chips that consume less power.
Royalty-free HyperTransport makes good on chip-to-chip bandwidth
News & Analysis  
1/27/2003   Post a comment
As next generation processors rev up to multi-GHz clock rates, and outside-the-box I/O technologies exceed 10 Gbit/second data rates, the last thing a designer needs inside the box is a myriad of slow, wide and costly system, processor and I/O buses.
Next-generation backplanes: Are we talking 5Gig or 10Gig?
News & Analysis  
1/27/2003   Post a comment
Many of the today's backplanes were developed with then state-of-the-art 2.5Gig or 3.125G serdes technology.
Need for services displaces speed
News & Analysis  
1/27/2003   Post a comment
Designing communications equipment in the 1990s was all about speed.
How to apply SERDES performance to your design
News & Analysis  
1/27/2003   Post a comment
Designers feel comfortable designing with technologies that they are familiar with.
High-Speed Interconnects
News & Analysis  
1/27/2003   Post a comment
Harnessing the power of high speed interconnects with software
News & Analysis  
1/27/2003   Post a comment
As high-speed serial interconnects come of age, the distribution of processing power across multiple, independent, processing units has become easier and much more commonplace.
Common I/O design strategies for high-speed interfaces
News & Analysis  
1/27/2003   Post a comment
High-speed serial interfaces are proliferating in chips used in the metro communications application space.
Building the next-generation of extensible mesh fabrics
News & Analysis  
1/27/2003   Post a comment
High-speed serial fabrics are becoming commonplace in both proprietary and commercial off-the-shelf systems.
10 Gbit/sec: Breaking down the system design issues
News & Analysis  
1/27/2003   Post a comment
As performance levels increase to 10 Gbit/second line speeds, the traditional design challenges of achieving high performance while ensuring low power and low cost become increasingly difficult.
Advanced motor control ICs move into the driver's seat
Product News  
1/23/2003   Post a comment
Motor control applications are shifting into higher gear, buoyed by advances in the power ICs that turn on the motor, the microcontrollers that drive the system and the design tools needed to speed the system's time-to-market.
Dc/dc chips facilitate multiphasing on a large scale
Product News  
1/23/2003   Post a comment
International Rectifier's IR3081 control IC/IR3086 phase IC chip set, which uses the company's XPhase architecture for multiphase interleaved buck dc/dc converters, enables major scaling of an n-phase design.
Improving DQPSK Receiver Design for Satcom Apps
News & Analysis  
1/23/2003   Post a comment
Traditional design methodologies fall short in allowing designers to achieve the performance required in DQPSK receivers. To combat the problem designers must turn to a new design flow that combines a tops-down design with bottoms-up verification.
Baseline JPEG compression juggles image quality and size
News & Analysis  
1/23/2003   Post a comment
In this JPEG picture-processing tutorial - another of the many outstanding DSP-related stories on consumer algorithm processing slated for EE Times' January 6th Signals section -- Analog Devices engineers offer insight into the scanning and encoding techniques used to affect JPEG compression. Unlike other versions of the article, this one does the math.
CMOS op amp gives pulse generator low parts count
News & Analysis  
1/22/2003   1 comment
The natural choice for generating a pulse of variable frequency and duty cycle is a good bench-top pulse generator. If you don't have a generator or must build one into your system, however, you can do it with a few op amps and some external components. Maxim's Roger Griswold shows how.
Special Report: Choosing a DSP
Blog  
1/22/2003   Post a comment
Once upon a time, digital signal processors were used only as coprocessors in signal processing applications and programmed mostly in assembly. Today, DSPs are used in almost every application domain. From the nitty to the gritty, here's what to look for in a DSP
Floating gate trimming saves backend testing costs
News & Analysis  
1/22/2003   Post a comment
"Trimming semiconductors with floating gate technology is a state-of-the-art replacement for older mechanical potentiometer trimming."
Simulating the XFP Electrical Interface: Part 1
News & Analysis  
1/22/2003   Post a comment
EM simulations play a vital role in interconnect design for XFP optical systems. This two-part series covers the simulation of the microstip traces, XFP connector, BGA package, and the end-to-end channel.
LVDS, CML, ECL-differential interfaces with odd voltages
News & Analysis  
1/21/2003   Post a comment
While some interface technologies such as ECL and CML focus on ultra speed, others concentrate on multiple attributes. LVDS for example, offers both high-speed and low-power operation. National's interface expert, John Goldie, tells what you should know about some of today's popular high-speed differential interface technologies.
Components distributors hope it's Bluetooth's year
Product News  
1/21/2003   Post a comment
If there is an industry that needs the Next Big Thing to drive growth, electronic components is it. And in 2003, Bluetooth technology-enabled in cell phones, headsets, PDAs and even PCs and peripherals-could be the long-awaited driver. That possibility has not been lost on components distributors. Avnet, an earlier believer in Bluetooth, opened its first Bluetooth design center-under the auspices of Avnet Radio Frequency Design Services-in Singapore in May 2001. Avnet quickly began offering a Bl
Understanding the 3G-324M Spec: Part 1
News & Analysis  
1/21/2003   Post a comment
Although an all IP wireless network is years away, designers must build systems today that support video and other multimedia. Through the 3G-324M spec, designers tap into the existing circuit-switched network to deliver these services.
Lattice pioneers mixed-signal PLDs
News & Analysis  
1/20/2003   Post a comment
Page 1 / 4   >   >>


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