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posted in January 2013
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Pericom launches clock generator family
Product News  
1/31/2013   Post a comment
Pericom’s latest HiFlex line targets cloud computing and networking applications.
Metal film resistor tailored for high-voltage, high-humidity applications
Product News  
1/31/2013   Post a comment
The RNV14 from Stackpole is a ¼ watt high voltage metal film resistor that is able to withstand environments with high moisture.
Hittite expands optical modulator driver product line
Product News  
1/31/2013   Post a comment
Hittite's latest 32 Gbps compact dual channel optical modulator driver swings 8Vp-p.
Silicon Valley Nation: The silicon generation
Blog  
1/31/2013   9 comments
At a documentary premier, the pioneers of the Silicon Valley watch how they transplanted innovation into orchards.
STEC releases pair of 2 TB SSDs
Product News  
1/31/2013   Post a comment
Both devices offer unlimited writes over the specified product lifespan.
Meet Test and Measurement World's Test Engineer of the Year
The Engineering Life - Around the Web  
1/31/2013   Post a comment
Peter Spitzer, a member of the TRICENTIS team since 2008, honored for his achievements.
Qualcomm lifts sales target after record quarter
News & Analysis  
1/31/2013   1 comment
Fabless giant boosts annual target by $400 million after reporting its best ever quarterly sales and profit.
USB 3.0 makes itself right at home
Engineering Investigations  
1/31/2013   1 comment
The latest connectivity technology promises to revolutionize electronics in the home.
Rambus rolls out LPDDR3 controller, interface
Product News  
1/31/2013   Post a comment
Memory architecture supports data rates of up to 3200 Mb/s.
Wafer demand increasing in 2013
Blog  
1/31/2013   Post a comment
Looking at the supply chain is a good way to see what demand is coming down the pipe. Semico believes that 2013 will see increased demand for wafers…
S2C's "Prototype Ready" interfaces library for rapid ASIC prototyping
News & Analysis  
1/31/2013   Post a comment
S2C boasts largest "Prototype Ready" interfaces library for Virtex-7 2000T FPGA-based rapid ASIC prototyping: 13 new modules include a new high-speed GTX peripheral category.
Yoshida in Madison: Don't declare BlackBerry DOA
Blog  
1/31/2013   10 comments
As the Android market turns into a giant playground for me-too products could it be such a bad development for BlackBerry to emerge?
IBM's Watson goes to college
News & Analysis  
1/31/2013   4 comments
A general-purpose version of the IBM Watson supercomputer that won on the game show Jeopardy will be installed at Rensselaer Polytechnic Institute.
First 25G boards may ride Panasonic’s Megtron-6
News & Analysis  
1/31/2013   2 comments
Panasonic could see a boost this year as the first printed circuit boards carrying 25 Gbit/second signals arrive thanks in part to its Megtron-6 material.
Interconnect system supports SAS 2.1, 3.0 protocol signaling
Product News  
1/31/2013   Post a comment
FCI has released its Mini-SAS HD internal board connectors and cable assemblies, which fulfills system designer needs for a high speed internal SAS compliant interconnect system.
Agilent and SiSoft team to bring jitter to IBIS
Blog  
1/31/2013   Post a comment
IBIS-AMI models used to design and optimize high-speed serial links have lacked comprehensive jitter-modeling parameters and were limited to simple, first-order models of transmitter output drivers and receiver input-termination behavior…
DesignCon: NI spotlights evolution in test
Design How-To  
1/30/2013   Post a comment
NI Fellow Mike Santori described the evolution of a system-level test architecture that makes heavy use of FPGAs and off the shelf technologies.
TI doubles memory in new MSP430 MCUs
Product News  
1/30/2013   Post a comment
MSP430F66xx devices provide more memory, analog integration, and device scalability for blood glucose meters, home automation, activity monitors, and low-power wireless applications.
Atmel, Exegin to offer wireless smart grid solutions
News & Analysis  
1/30/2013   Post a comment
License agreement provides smart grid OEMs the opportunity to utilize proven Atmel smart grid solutions with ZigBee support in mesh networks.
Mentor upgrades PCB analysis tool
Design How-To  
1/30/2013   Post a comment
New capabilities added to PCB analysis tool to improve speed, performance.
Silicon Valley Nation: Crowd-funding electronics innovation
Blog  
1/30/2013   1 comment
A part-timer R&B singer and biochemist is crowdfunding his idea for a better battery charger.
Energy Micro to showcase cool customer apps at embedded world
News & Analysis  
1/30/2013   Post a comment
Make sure you visit the folks from Energy Micro at Embedded World 2013 (Hall 1, Booth 523) and tell them "Max says Hi!"
STMicro brings smartphone style to simple appliances
Product News  
1/30/2013   Post a comment
Java environment optimized for STM32 microcontrollers heralds richer GUIs and faster time-to-market for basic electronic products.
Xilinx preps 20-nm IC tape-out
Design How-To  
1/30/2013   7 comments
FPGA company has announced it plans to tape-out its first IC to be made in 20-nm CMOS along with design-support in the second quarter of 2013.
EDA/IP weekly roundup – January 30th 2013
Blog  
1/30/2013   Post a comment
Cadence, EnSilica, Kilopass, Mentor, Oasys, Phoenix, ProPlus, Real Intent, S2C, Semico, SMIC, Synopsys, TSMC and Verific made the lineup today. See here for their news…
Chip market ready for steady rebound
News & Analysis  
1/30/2013   4 comments
Wireless communications will drive semiconductors in the long-term with global economy and chip market well aligned for several years growth, says analyst.
Control system tackles helicopter vibration
Design How-To  
1/30/2013   1 comment
Active Vibration Control Systems are solving helicopter vibration problems. Here, Lord Corporation discusses their technology and benefits.
Audio line receiver impedance balancing using a 2nd diff amp
Design How-To  
1/30/2013   32 comments
When the design specification for a line receiver calls for high performance, an impedance-balanced input or predictable gain, the cross-coupled double-balanced configuration is a worthy contender.
Android processor core is royalty free
Design How-To  
1/30/2013   11 comments
Processor IP licensor has enhanced its line of cores with the BA25, which it claims has the highest code density in a processor that is suitable for running Linux and Android applications.
BioMEMS market to triple by 2018
Design How-To  
1/30/2013   Post a comment
Microsystem devices have a large presence in the healthcare market and their sales are expected to reach $6.6 billion by 2018, according to market research firm Yole Développement.
Collaborative Advantage: What is interoperability, really?
Blog  
1/30/2013   Post a comment
When industry leaders collaborate to create a standard, the reason always cited is “interoperability”. Yet do we really understand what is meant by this seemingly simple term?
Freescale attacks Cavium with security coprocessors
News & Analysis  
1/30/2013   Post a comment
Freescale’s C29x security co-processors will sell for as little as $99, significantly undercutting the Nitrox 3 from Cavium.
Freescale's financial losses widen
Design How-To  
1/30/2013   1 comment
Financial losses at Freescale continued to widen in the fourth quarter of 2012 but the company forecast the possibility of growth in 1Q13 as the benefits of a reorganization under a new CEO start to come through.
Ultra low power controllers get new benchmark
News & Analysis  
1/30/2013   2 comments
The Embedded Microprocessor Benchmark Consortium will release tools for measuring energy consumption on microcontrollers that last years on a single battery.
Could RIM really mount a comeback?
Semi Conscious  
1/30/2013   10 comments
IHS says Blackberry 10 is Research and Motion's last, best hope to challenge the smartphone powers that be.
TI hawks smarter grid SoCs
Design How-To  
1/30/2013   Post a comment
New portfolio of 60 integrated SoCs for smart grid and smart meter designs include software and reference designs that simplify engineering tasks.
Sub-2.3ms latency wireless guitar jack claimed better than wired
Product News  
1/30/2013   Post a comment
With a sub-2.3ms latency, Dutch developer Systec Designs claims its 'stageClix' wireless guitar jack - which employs Nordic RF technology - is the lowest latency digital wireless audio adapter of its kind available in the world and is actually superior in many ways to a traditional hard-wired guitar-to-amplifier cable link.
DAC delivers high-quality audio in small package
Product News  
1/30/2013   Post a comment
Wolfson Microelectronics plc has introduced the company's stereo digital-to-analog converter (DAC), the WM8533, which claims to provide outstanding audio performance in a small package size for a wide range of consumer electronic applications.
Tiny audio transducer delivers 80dBA SPL
Product News  
1/30/2013   Post a comment
Model TRSTE-5025 from Transducers USA is a surface mount audio transducer producing a very high sound pressure level of 80dBA minimum in a miniscule 5x5x2mm package.
Software tool identifies RF spectrum IMD frequencies
Product News  
1/30/2013   Post a comment
Launched by Kaltman Creations LLC, RF-intermodPRO is new software product that aids in calculating, predicting and identifying intermodulation interference of wireless devices.
HMI Tools Save Time and Cost in Auto Applications
Design How-To  
1/30/2013   Post a comment
HMI/GUI (Human Machine Interface/Graphics User Interface) tools enhance the system developer’s ability to input a design, develop and verify the application.
Low-power audio codec combines class-D amps for speakers, Class-G for headphones
Product News  
1/30/2013   Post a comment
Conexant Systems has launched an ultra low-power, I2S audio codec with integrated stereo class-D speaker amplifiers and power-efficient class-G headphone amplifiers.
Audio codec enhances smartphone sound quality
Product News  
1/30/2013   Post a comment
Dialog Semiconductor plc has unveiled a ultra low power audio codec, designed to provide full range, high fidelity audio capture and playback to a variety of portable devices and audio accessories.
DesignVision winners announced at DesignCon
The Engineering Life - Around the Web  
1/29/2013   Post a comment
Mix of winners ranges from feisty startups such as Upverter to industry luminaries such as Mentor Graphics, TE Connectivity and Teledyne LeCroy.
DesignCon: "Uncomplaining" engineers must demand better EDA tools
News & Analysis  
1/29/2013   11 comments
Jonah Alben, Nvidia engineering VP, sees longer, more difficult design cycles if tools-investment complacency lingers.
DesignVision award winners announced
Blog  
1/29/2013   Post a comment
Winners were selected based on three criteria: how well the product met the market’s vision and offered unique insight into customer needs; the originality of the solution and if it offered a new approach to meeting market needs; and the quality of the implementation and how well it fits the market requirements…
EU funds research on graphene, brain-like chips
Design How-To  
1/29/2013   Post a comment
EU's administrative arm earmarks $1.6 billion for two high-profile semiconductor research initiatives.
Sensor Platforms loses a high-profile executive
News & Analysis  
1/29/2013   1 comment
Ian Chen, an executive vice president at algorithmic software developer Sensor Platforms, abruptly left the company last week.
Using bullet-proof isoSPI data links to boost battery-management systems
Design How-To  
1/29/2013   Post a comment
IsoSPI provides a robust and simple means of remotely controlling standard SPI devices that formerly required an extra protocol adaptation to CANbus
Cadence announces updates for advanced nodes
Product News  
1/29/2013   Post a comment
Cadence has announced a new set of custom/analog capabilities designed specifically for the advanced technology nodes of 20 nanometers and below…
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