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Internet of Things Designline
posted in October 2008
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PCB shipments down 3.1% in September
News & Analysis  
10/30/2008   Post a comment
IPC's PCB industry report for September 2008 indicates that shipments of rigid PCBs and flexible circuits decreased 3.1 percent from September 2007.
CEA supports new Energy Star TV spec
Product News  
10/30/2008   Post a comment
The Consumer Electronics Association (CEA) has announced support for the new ENERGY STAR specification for televisions, which takes effect on November 1, 2008. The new specification for the first time accounts for both active and standby power consumption across all types of televisions.
New DSP-FPGA development platform
Product News  
10/30/2008   Post a comment
Avnet, Xilinx, and Texas Instruments release the Avnet Spartan-3A DSP FPGA / DaVinci Development Platform.
Optical films deliver energy efficiency for LCD TVs, notebooks and monitors
Product News  
10/30/2008   Post a comment
3M's Optical Systems Division will demonstrate a number of energy-efficient exhibits at FPD International 2008 that feature the company's latest Vikuiti optical films for notebooks, handheld devices, monitors and LCD TVs.
Green Hills offers secure Wi-Fi platform
Product News  
10/30/2008   Post a comment
Green Hills Software has upgraded its Platform for Secure Wireless Devices with the latest 802.11A/B/G.
Sneak preview: The future of wireless
Blog  
10/30/2008   2 comments
Here's a solution that might bring software-defined radio to a handheld consumer device near you.
Motor connector targets wind power turbines
Product News  
10/30/2008   Post a comment
Tyco Electronics has introduced the HM.16 motor-mount connector that simplifies the installation and maintenance of wind power turbines.
Forbes: When Apple failed
News & Analysis  
10/30/2008   Post a comment
Here's Forbes reporter Alan Greenberg's take on the ESC teardowns of Apple's Newton and Pippin.
First Solar inks long-term module supply agreements totaling 525MW
News & Analysis  
10/30/2008   Post a comment
First Solar Inc., has entered into new long-term module supply agreements with Sorgenia Solar, a developer of large-scale, grid-connected solar power plants in Italy and extended module supply agreements with several of First Solar's existing customers including EDF Energies Nouvelles, Ecostream, Juwi and Phoenix Solar AG.
Atmel motor driver chips feature high reliability
Product News  
10/30/2008   Post a comment
For always-on applications that require high reliability in rough environments, Atmel has developed two new brushless dc motor driver chips. Application examples are fuel pumps, turbochargers and exhaust gas recirculation.
It's not the size of your...
Programmable Logic DesignLine Blog  
10/30/2008   Post a comment
In which we discover some amazing images that will boggle our minds...
Dresden-based technology center focuses on energy efficient organic semiconductor devices
News & Analysis  
10/30/2008   Post a comment
The Fraunhofer-Gesellschaft has opened the Center for Organic Materials and Electronic Devices Dresden (COMEDD) which is focusing on the development of processes for organic semiconductor devices such as organic solar cells and organic light-emitting diodes (OLEDs).
Next generation flywheel energy storage systems achieve UL listing
News & Analysis  
10/30/2008   Post a comment
The new VDC and VDC-XE Direct Connect DC power systems developed by high-speed energy storage flywheel systems manufacturer, VYCON, have been awarded Underwriters Laboratories Inc. (UL) listing.
Forbes: Cellphone inventor knocks iPhone
News & Analysis  
10/30/2008   Post a comment
Join the debate on Forbes.com about iPhone and cell-phone industry. Is Martin Cooper right about overly complex cell-phone products?
Freescale MCUs at the center of BMW X6 Chassis Management System
News & Analysis  
10/30/2008   Post a comment
In BMW's X6 luxury Sports Activity Coup, two Freescale 32-bit MCUs coordinate the interaction of the stability and performance control systems that contribute a big deal to the specific characteristics of the vehicle.
MEMC's CEO, president steps down
News & Analysis  
10/30/2008   Post a comment
Nabeel Gareeb, president and chief executive of MEMC Electronic Materials Inc., has resigned from the silicon wafer maker.
IBM's USB stick plugs into bank security
Product News  
10/30/2008   Post a comment
IBM has started trialing a device developed at its Zurich, Switzerland research centre that the company says could bring new levels of security to on-line banking.
TFT-LCD equipment spending to drop 21% in 2009
Product News  
10/30/2008   Post a comment
Although TFT-LCD equipment spending is still expected to reach record highs in 2008, spending is projected to fall off by 21% in 2009 due to falling panel prices, low fab utilization and global economic concerns, according to market research firm DisplaySearch.
Tyco : Motor connector targets wind power turbines
Product News  
10/30/2008   Post a comment
The HM.16 motor-mount connector from Tyco Electronics simplifies the installation and maintenance of wind power turbines.
PTC thermistors: Injection-molded heating elements
Product News  
10/30/2008   Post a comment
Epcos launched an innovative production technology which enables to produce injection-molded PTC thermistoprs in bnearly any shape.
Over-the-air TV gears for mobile, Web roles
News & Analysis  
10/30/2008   Post a comment
Proponents of over-the-air digital TV are gearing up for new mobile and Web offerings that could hit as early as next year, but even some implementers admit the effort faces a host of daunting challenges.
Inside Contactless to work with FIME on NFC interoperability
News & Analysis  
10/30/2008   Post a comment
Inside Contactless forms interoperability alliance for Near-Field Communications with terminal test specialist FIME.
Bozotti identifies four priorities at ST
Product News  
10/30/2008   Post a comment
Shortly after STMicroelectronics NV (Geneva, Switzerland) reported a third quarter net loss of $289 million, Carlo Bozotti, president and CEO of ST, highlighted four key priorities for the group.
AMD taps Bozzo to head Euro region
News & Analysis  
10/30/2008   Post a comment
AMD has appointed Alberto Bozzo as corporate vice president and general manager of its Europe, Middle East and Africa (EMEA) region.
Broadband quadrature modulator integrates automatic gain control
Product News  
10/30/2008   Post a comment
Operating over a 50-MHz to 2200-MHz frequency range, Analog Devices' ADL5386 supports high-data-rate complex modulation for next-generation communication infrastructure equipment.
Digital audio receiver IC integrates sample-rate converter
Product News  
10/30/2008   Post a comment
Cirrus Logic Inc. has introduced the CS8422, a 24-bit, 192 kHz digital audio receiver with a low-jitter PLL and integrated asynchronous sample rate converter.
Portable audio codec improves battery life
Product News  
10/30/2008   Post a comment
Cirrus Logic's audio codec consumes 5.1 mW of quiescent power in playback mode and features a bimodal, patent-pending Class H technology.
European, US sales hold back global chip growth
News & Analysis  
10/30/2008   Post a comment
The European and North American markets held back global semiconductor sales in September, according to the latest figures from the World Semiconductor Trade Statistics Organization (WSTS).
Chip sales up 1.6% in September on back of PC sales
News & Analysis  
10/30/2008   Post a comment
Worldwide sales of semiconductors, expressed as the three-month moving average, increased by 1.6 percent to $23 billion in September compared to sales of $22.6 billion in the corresponding period last year, according to the Semiconductor Industry Association(SIA).
Aixtron sales on target, orders decline
News & Analysis  
10/30/2008   Post a comment
Despite a difficult macroeconomic environment, semiconductor equipment vendor Aixtron (Aachen, Germany) has reiterated its sales targets for 2008. However, declining order entry forebodes tough investment climate.
Continental announces cost cutting program
News & Analysis  
10/30/2008   1 comment
Like most other automotive electronics suppliers, Continental AG (Hannover, Germany) sees stormy weather ahead as a result of the sudden drop in demand for cars. Along with its Q3 figures, the company announced a cost cutting program.
Texas Instruments : 1.8-V audio codec has an integrated miniDSP
Product News  
10/30/2008   Post a comment
Texas Instruments has introduced the TLV320AIC3254, a highly integrated audio codec that meets growing consumer demand for cost-efficient, feature-rich products with better audio quality and longer battery life.
Video: Lenny Lipton on 3DTV
Design How-To  
10/30/2008   1 comment
Stereo 3-D pioneer Lenny Lipton, the chief technology officer of RealD Cinema, discusses the technical and market challenges facing 3DTV in an interview at the Mann Chinese Theater in Hollywood.
HDMI gets nod as interface for 3DTV
Design How-To  
10/30/2008   2 comments
The Consumer Electronics Association has started standards work aimed at enabling home systems to play stereoscopic 3-D video, starting off with a planned upgrade for the standard behind the High Definition Multimedia Interface to make sure it is ready to carry stereo 3-D data.
Amkor's Q3 profit plummets
News & Analysis  
10/29/2008   Post a comment
Chip-packaging provider Amkor Technology saw its third quarter profit plummet to $34 million, down 48 percent from the second quarter and down 44 percent from the third quarter of 2007.
Silicon fiber optics debut
News & Analysis  
10/29/2008   Post a comment
By inserting crystalline silicon into the core of conventional optical fibers, Clemson University researchers hope to harness the embedded semiconductors to process optical signals.
Featured Product: Simulink Fixed Point 6 targets more accurate design, simulation
Product News  
10/29/2008   Post a comment
Simulink upgrade delivers capabilities for designing and simulating fixed-point systems and generating optimized code for implementation, while streamlining workflows.
Atmel swings to loss, rejects takeover bid
News & Analysis  
10/29/2008   Post a comment
Atmel posted a GAAP $4.7 million loss for the third quarter after reporting a profit in the same period of 2007. The company's board also rejected an unsolicited $2.3 billion bid to acquire the company by Microchip Technology and ON Semiconductor.
Intel increased MPU share in Q3, iSuppli says
News & Analysis  
10/29/2008   Post a comment
Intel increased its dominance over the worldwide microprocessor business in the third quarter, accounting for 80.4 percent of all revenue in the product category, according to market research firm iSuppli.
Clear Skies Solar announces $5.7-million solar energy project
Product News  
10/29/2008   Post a comment
Clear Skies Solar has announced a $5.7-million agreement with Achilles Chondronasios & Co. to develop and construct a 960-kilowatt solar power project in Larissa, Greece.
Axial Vector Energy to demo highly efficient motors for wind energy production
Product News  
10/29/2008   Post a comment
Axial Vector Energy Corp. (AVEC) has announced that it is scheduling special demonstrations of its highly efficient motors used in wind energy production for four major windmill energy producers.
TUV Rheinland releases test system for Zigbee Smart Energy products
News & Analysis  
10/29/2008   Post a comment
TUV Rheinland has released its customizable Automizer Test System, designed to test products that meet the ZigBee Smart Energy Public Application Profile.
Semantic search said to surpass Google
News & Analysis  
10/29/2008   Post a comment
Elsevier's illumin8 search engine uses a technology thesaurus to interpret the meaning of terms, and then summarizes results categorized in separate panes by organization, approach, benefit, author/inventor, company and product.
Customized campaign videos provide glimpse of targeted TV's future
Blog  
10/29/2008   Post a comment
The world's first individually customized political TV commercial?
Mosaid, Powerchip settle patent litigation
News & Analysis  
10/29/2008   Post a comment
Memory IP provider Mosaid Technologies said it has settled its patent infringement litigation with Powerchip Semiconductor and signed a patent license agreement with the Taiwanese provider of memory chips and foundry services.
Group develops car-to-car communication simulation tools
News & Analysis  
10/29/2008   Post a comment
Researchers of the Karlsruhe Institute of Technology (KIT) is developing simulation tools for car-to-car communications processes and its effect on traffic.
Mitsui Chemicals sets up new division to accelerate solar cell and battery developments
News & Analysis  
10/29/2008   Post a comment
To map out a business strategy and to spur the development of new materials for solar cells, fuel cells and secondary cells by promoting its R&D activities, Mitsui Chemicals Inc, has formed a new division, the Solar & Cell & Battery Components Development Department, under its Performance Materials Business Sector.
PLM, multidisciplinary simulation enable automotive mechatronics integration
Design How-To  
10/29/2008   Post a comment
With cars becoming "living rooms and laptops on wheels," managing mechatronics content from diverse sources is critical.
ST to suspend production due to slow demand in Q4
News & Analysis  
10/29/2008   Post a comment
STMicroelectronics NV (Geneva, Switzerland) reported that its fab utilization rate amounted to 85 percent in the third quarter of 2008. It is, however, expected to strongly decrease in the fourth quarter of 2008 and, possibly, in the first quarter of 2009.
New listing: 150-mm NXP fab in Northern France
News & Analysis  
10/29/2008   Post a comment
NXP Semiconductors has hired a realtor to help sell its integrated passives device business and related 150-mm fab in Caen, France.
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