Ontario microwave startup raises $8 million News & Analysis 11/25/2010 11 comments Peraso Technologies Inc., a fabless chip company working on millimeter-wave radio transceiver technology, has raised C$8 million (about $7.9 million) in an equity financing round led by Celtic House Venture Partners.
Sitara ARM processor supports Profibus Product News 11/25/2010 12 comments Texas Instruments Inc. has announced the availability of its AM1810 Sitara ARM processor, which integrates an ARM9 processor core with a Profibus interface. Profibus is a popular fieldbus used for communications between factory automation equipment.
NXP's Mifare to add NFC support to SIMs News & Analysis 11/25/2010 10 comments NXP Semiconductors NV has struck a licensing deal so that its 13.56-MHz Mifare contactless smart card technology to be integrated into the Universal Integrated Circuit Card (UICC) smart card format of Gemalto NV used in mobile terminals in GSM and UMTS (European 3G) mobile communications networks.
CMOS optical pulse compressor debuts News & Analysis 11/24/2010 8 comments Silicon photonic pulse compressors to be used for optical time division multiplexing in future on-chip silicon photonics were demonstrated on CMOS chips by researchers at the University of California at San Diego.
The evolution of design methodology Blog 11/24/2010 8 comments In nature, long periods of relatively stable environments are occasionally punctuated by large-scale changes that are the catalyst for evolution to create a large variety of mutations, and then for natural selection to weed out the unsuccessful ones. The environment in which design methodology lives is similar.
D&R readies Intelligent Project Architect Product News 11/24/2010 Post a comment Design & Reuse SA (D&R) has delivered Intelligent Project Architect (IPA) as part of its IP management platform. It is suitable for IP-based collaborative design project between geographically distributed teams using various revision control systems.
Infineon signs Chinese IGBT deal News & Analysis 11/24/2010 5 comments Infineon Technologies AG has signed a license agreement with Xinjiang Goldwind Science and Technology Co. Ltd., a Chinese manufacturer of wind power equipments allowing the company to make core components for wind turbines.
Automotive MEMS sales rebound, says iSuppli News & Analysis 11/24/2010 6 comments Driven by the sharp rebound in the automotive production and inventory rebuilding, the market for automotive microelectromechanical system (MEMS) sensors will grow to record size in 2010, according to market research firm iSuppli.
Is IBM moving to fab-lite, research heavy? News & Analysis 11/24/2010 16 comments IBM appears set to gradually back away from semiconductor manufacturing and to rely for its leading-edge silicon on Samsung and GlobalFoundries as foundry suppliers. Both Samsung and GlobalFoundries are set to have wafer fabs for foundry operations in the United States, which could help cement relations.
North American PCB book-to-bill slips News & Analysis 11/24/2010 3 comments The book-to-bill ratio for the North American rigid PCB industry in October 2010 fell below parity to 0.98, according to the Association Connecting Electronics Industries, a standards body for the electronics industry known as the IPC.
Case study: High-Level Synthesis – Ready for prime-time? Design How-To 11/24/2010 7 comments This article describes how TI implemented a Transaction-Level Model (TLM) based design and verification methodology utilizing Cadence C-to-Silicon Compiler on a Queue Manager design. It quantifies the results versus a traditional RTL-based methodology, highlighting both the benefits and remaining challenges of adopting a TLM design and verification flow utilizing C-to-Silicon Compiler.
Car Wi-Fi shipments projected to soar News & Analysis 11/23/2010 7 comments Shipments of built-in car Wi-Fi systems are set to soar by more than 40 fold by 2017, as automakers increasingly view wireless connectivity as a key competitive differentiator, according to market research firm iSuppli.
Walkman R.I.P., Audi sound Audio DesignLine Blog 11/23/2010 6 comments My take on the fate of the Walkman (maybe it should be renamed the "WalkingDeadman") and on the efforts by Audi - and other companies - to find the "right sound" for their products.
Analog Devices claims MEMS patent win News & Analysis 11/23/2010 6 comments Analog Devices Inc. has said that U.S. International Trade Commission has ruled patents belonging to Knowles Electronics LLC invalid. As a result Administrative Law Judge Robert K. Rogers Jr. has quashed attempts to stop ADI from importing or selling its microphones in the United States.
LTX-Credence misses estimates News & Analysis 11/23/2010 Post a comment Automated test equipment vendor LTX-Credence—set to merge with Verigy—reported sales for the quarter ended Oct. 31 that fell short of consensus analysts' expectations.
Adesto adds Nelson Chan to board News & Analysis 11/23/2010 Post a comment Adesto Technologies Corp., a startup developing Conductive Bridge RAM (CBRAM) technology has announced that Nelson C. Chan has been appointed to its board of directors, effective October 12, 2010.
Mirics, ArcSoft team for Latin American TV News & Analysis 11/23/2010 Post a comment PC-TV software-plus-silicon company Mirics Semiconductor Ltd. has announced that it is working with ArcSoft to enable viewers in Latin America to watch broadcast high definition television (HDTV) on their PCs.
Balancing and achieving key supply-design objectives Design How-To 11/23/2010 Post a comment Balancing and achieving key supply-design objectives Maximizing efficiency in a low-profile form factor is a non-trivial challenge for even the most experienced power supply designers. Some examples of systems requiring low-profile power supply designs include: flat panel displays, rack mounted computer equipment and telecom and aerospace chassis-mounted assemblies.
Audi on the search for the right sound News & Analysis 11/22/2010 5 comments While the absence of noise associated with electric vehicles is a relief for many, cars gliding along in almost perfect silence represent a potential source of danger. Audi, like many other OEMs, is now trying to find the ideal sound for its e-cars.
Wolfson selected by Movidius for mobile 3D News & Analysis 11/22/2010 Post a comment Wolfson Microelectronics has been selected by mobile multimedia processing specialist Movidius to deliver audio performance and power management to its Myriad 3D platform reference and development boards.
ADI tops estimates, but sees slowdown News & Analysis 11/22/2010 Post a comment Analog Devices reported sales for the quarter ending Oct. 30 that beat consensus analysts' expectations, but the company said it expects sales to decline sequentially in the current quarter.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.