Last minute deals open opportunities for 2007 and beyond Blog 12/31/2006 Post a comment In the week between Christmas and New Year, a semiconductor equipment company purchased an EDA company, and an EDA company increased its ESL expertise with the acquisition of a British company. And both events have given pundits cause for judgments, predictions, and the usual doomsday scenario. I thought the combined news exciting and full of promise.
Centralized storage caching fixes the EDA compute bottleneck Design How-To 12/31/2006 Post a comment EDA environments, with their demanding data intensive applications, often experience the pain of I/O bottlenecks. Scalable caching appliances deliver high capacity, high performance cache as a shared network service to accelerate data center performance. They connect to the network via standard Gigabit Ethernet, complementing existing storage to provide very high throughput and real time data access.
China drives home standards News & Analysis 12/30/2006 Post a comment It's been a roller-coaster ride for homegrown technology in China, but little will deter the Chinese from pushing ahead with their efforts to introduce standards.
Readers chase the bare facts in 2006 News & Analysis 12/30/2006 Post a comment Restructurings, microprocessors and nakedness--literal and otherwise. Those were the themes that dominated the year in stories, as judged by viewer traffic on EETimes.com.
FCC approves AT&T-BellSouth merger News & Analysis 12/30/2006 Post a comment The FCC approves the merger of AT&T and BellSouth after company agrees to repatriating BellSouth jobs, providing cheap Internet access, and assuring "net Neutrality" in packet delivery.
Arrow buys U.K. IT distributor InTechnology News & Analysis 12/29/2006 Post a comment Arrow Electronics Inc. said today it has completed its acquisition of the storage and security distribution business of InTechnology plc for approximately $80 million. The deal will allow Arrow's Enterprise Computing Solutions division to make further inroads into the United Kingdom, Europe's second-largest IT market.
Apple clears Jobs, but says phony records created News & Analysis 12/29/2006 Post a comment Apple Computer filed much-anticipated reports with the U.S. Securities and Exchange Commission Friday (Dec. 29), saying its CEO Steve Jobs committed no wrongdoing in its options backdating scandal but that evidence surfaced of phony records that had been created to show a directors meeting that had never taken place.
Apple restates, acknowledges faked documents News & Analysis 12/29/2006 Post a comment In regulatory filings, Apple Computer recognized additional non-cash stock-based compensation expense of $84 million after tax, including $4 million, $7 million and $10 million in fiscal years 2006, 2005 and 2004, respectively. The company acknowledged that it faked documentation of a special meeting of its board pertaining to a 2001 options grant to CEO Steve Jobs.
Xilinx ships industry's largest 65-nm FPGA Product News 12/29/2006 Post a comment Xilinx started to ship the LX330, a 65-nm FPGA that is said to deliver 65% more logic than the largest 90-nm device. Xilinx fab partners UMC and Toshiba have quickly ramped 65-nm production, producing excellent yields that have enabled the chip vendor to deliver the complete 65-nm Virtex-5 LX platform on time and over one year ahead of its competition.
Dual-slot, hot swap controller simplifies PCI Express connection Product News 12/29/2006 Post a comment Linear Technology's LTC4242, a narrow, dual-slot PCI Express hot swap controller for mid-range networking or storage servers and embedded applications, eliminates complex software interfaces, yet provides a rugged and compact solution for independently controlling the main supplies and the auxiliary supply on two slots.
Light pipes come in many colors Product News 12/29/2006 Post a comment Elma Electronic offers light pipes for front panel enclosure applications in a variety of colors. The LEDs transfer light to the front panel with a translucent and intense coloration and can emit light even when embedded deeper within a panel.
Engineer's guide to HDMI ESD protection: Part 1 Design How-To 12/29/2006 Post a comment Circuit manufacturers continue to decrease the minimum dimensions of the transistors, interconnections, and the insulation layers in their devices. This results in smaller structures for higher speed devices, which are more susceptible to breakdown damage at lower energy levels. An examination of system ESD protection design issues, and common misunderstandings about ESD protection components for HDMI (or other) I/O ICs.
Counting down top stories of 2006: No. 1 News & Analysis 12/29/2006 Post a comment In our No. 1 story of 2006, Silicon Valley editor Mark LaPedus details a claim by IBM Corp. and the Georgia Institute of Technology that they broke the silicon speed record, thanks in part to a "frozen chip." IBM and Georgia Tech said that they demonstrated the first silicon-based chip capable of operating at frequencies above 500 GHz by cryogenically "freezing" the circuit to minus 451 degrees Fahrenheit.
Hedge fund urges Cypress to reorg, go private News & Analysis 12/28/2006 Post a comment Los Angeles-based hedge fund Chapman Capital has written a letter to the board of directors of Cypress Semiconductor urging the company to reorganize itself and become a private company through leveraged buyout.
Analyst Gary Smith: top 10 EDA topics for 2007 News & Analysis 12/28/2006 Post a comment Veteran EDA analyst Gary Smith explains his "top ten" list of hot EDA topics for 2007, including electronic system level (ESL), design for manufacturability (DFM), IP reuse, analog/RF, globalization, and multi-core systems on chip.
CoCreate's new PLM tool suite 'changes the rules' Product News 12/28/2006 Post a comment Innovation is the lifeblood of companies in the fast-moving electronics industry, yet the very process of product development can become a roadblock to beating a competitor to market. CoCreate Software Inc., a product lifecycle management software provider, is trying to eliminate those design bottlenecks using an approach to 3D product development the company calls "dynamic modeling."
Reflections of 2006 - Part 2 Blog 12/28/2006 Post a comment At time of the year, we have a tendency to reflect and look back on the events of the past year. I'm not just talking about the most popular stories that folks like you read such as "The Promise of 1080p," but the major trends and developments in the CE and semiconductor industries.
Intel ordered to produce evidence News & Analysis 12/28/2006 Post a comment A U.S. District Court in Delaware has ordered Intel to produce documents and other evidence related to its business conduct outside of the U.S., according to a statement issued by Advanced Micro Devices.
Stahlin offers updated enclosure product catalog Product News 12/28/2006 Post a comment Stahlin offers an updated product catalog of its non-metallic enclosures and accessories. The catalog also provides information on choosing the right enclosure material, cutting and drilling non-metallic enclosures and a full chemical resistance table.
Encapsulant developed for image sensor assembly Product News 12/28/2006 Post a comment Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications. The Hysol FP5110 material is said to provide excellent adhesion to both 2- and 3-layer flexible printed circuits.
Philips sells APM manufacturing unit to Lite-On News & Analysis 12/28/2006 Post a comment Royal Philips Electronics is selling the manufacturing operations of its Automotive Playback Modules (APM) business to Lite-On IT Corporation of Taiwan. Philips said the remainder of the APM operations, which are no longer seen as core to the conglomerate, would be transferred to a joint-venture between the two companies that will operate under the name Philips & Lite-On Digital Solutions, or PLDS.
Analyst: Back-end memory testing could tighten in '07 News & Analysis 12/28/2006 Post a comment The back-end memory testing industry may become tighter in the second half of 2007, as memory packaging and testing companies struggle to keep pace with a changing and rapidly growing market, according to a report by market researcher DRAMeXchange.
Report: Powerchip denies selling fab to Vanguard News & Analysis 12/28/2006 Post a comment Taiwan's Powerchip Semiconductor said in a filing to the Taiwan Stock Exchange that reports that it is planning to sell its eight-inch-wafer plant to Vanguard International Semiconductor are pure speculation, according to a Forbes.com report.
Counting down top stories of 2006: No. 2 News & Analysis 12/28/2006 Post a comment Our No. 2 story for 2006, written by London editor Peter Clarke, described the ARM9-based asynchronous processor developed by ARM Holdings plc and Handshake Solutions NV, a subsidiary of Royal Philips Electronics subsidiary. The ARM996HS is thought to be the first commercial clockless processor and is said to be particularly suited to use as an automotive microcontroller.
Formal provider OneSpin opens U.S. office News & Analysis 12/28/2006 Post a comment OneSpin Solutions, a formal verification spinoff from Infineon in Germany, has opened a U.S. office in Sunnyvale, Calif. to boost sales of its Module Verifier and Equivalence Checker products.
Former KLA-Tencor CEO Tompkins resigns from board News & Analysis 12/27/2006 Post a comment Jon Tompkins, former chairman and CEO of fab equipment supplier KLA-Tencor, resigned from the company's board of directors Dec. 21, according to a regulatory filing. Tompkins is the fourth high-ranking official to abruptly sever ties with KLA-Tencor since the company was implicated in a scandal over historical stock options grants.
Multi-threaded design tackles SoC performance bottlenecks: Part 2 Design How-To 12/27/2006 Post a comment Coupling processor operation closely to bus and other computational demands leads to a dramatic increase in automotive vision system processor efficiency. With further tuning, optimizing the bus to work closely with the hardware threads improves performance and provides a more controllable, measurable, and predictable system latency.
U.S. turns to the Czech Republic for R&D News & Analysis 12/27/2006 Post a comment Over 60 percent of the 2006 foreign direct investments in the Czech Republic announced by U.S.-based companies are R&D projects in innovation industries, according to data collected by CzechInvest, an agency of the Ministry of Industry & Trade of the Czech Republic.
Warren Buffett to buy distributor TTI News & Analysis 12/27/2006 Post a comment TTI Inc., one of the world's largest distributors of passive and electromechanical components, is being acquired by Berkshire Hathaway, billionaire Warren Buffet's investment vehicle. Terms of the deal, which includes TTI's catalog based distribution business, Mouser Electronics, were not disclosed.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.