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posted in December 2006
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Last minute deals open opportunities for 2007 and beyond
Blog  
12/31/2006   Post a comment
In the week between Christmas and New Year, a semiconductor equipment company purchased an EDA company, and an EDA company increased its ESL expertise with the acquisition of a British company. And both events have given pundits cause for judgments, predictions, and the usual doomsday scenario. I thought the combined news exciting and full of promise.
Centralized storage caching fixes the EDA compute bottleneck
Design How-To  
12/31/2006   Post a comment
EDA environments, with their demanding data intensive applications, often experience the pain of I/O bottlenecks. Scalable caching appliances deliver high capacity, high performance cache as a shared network service to accelerate data center performance. They connect to the network via standard Gigabit Ethernet, complementing existing storage to provide very high throughput and real time data access.
In chips, private equity became a buyer's game
Product News  
12/30/2006   Post a comment
One of the biggest stories of 2006 seemed to come out of nowhere but really didn't: the surge in private-equity buyouts of major chip vendors.
China drives home standards
News & Analysis  
12/30/2006   Post a comment
It's been a roller-coaster ride for homegrown technology in China, but little will deter the Chinese from pushing ahead with their efforts to introduce standards.
Readers chase the bare facts in 2006
News & Analysis  
12/30/2006   Post a comment
Restructurings, microprocessors and nakedness--literal and otherwise. Those were the themes that dominated the year in stories, as judged by viewer traffic on EETimes.com.
FCC approves AT&T-BellSouth merger
News & Analysis  
12/30/2006   Post a comment
The FCC approves the merger of AT&T and BellSouth after company agrees to repatriating BellSouth jobs, providing cheap Internet access, and assuring "net Neutrality" in packet delivery.
Circular plastic connector is Ethernet enabled
Product News  
12/29/2006   Post a comment
Tyco has expanded its Circular Plastic Connector product line with the introduction of the Series 45 circular connectors for Ethernet communication applications.
Arrow buys U.K. IT distributor InTechnology
News & Analysis  
12/29/2006   Post a comment
Arrow Electronics Inc. said today it has completed its acquisition of the storage and security distribution business of InTechnology plc for approximately $80 million. The deal will allow Arrow's Enterprise Computing Solutions division to make further inroads into the United Kingdom, Europe's second-largest IT market.
WiMAX Forum releases frequency-availability database
News & Analysis  
12/29/2006   Post a comment
The database includes frequency, regulatory and technical information such as guard band requirements for 75 countries.
PowerDsine investors approve sale to Microsemi
News & Analysis  
12/29/2006   Post a comment
Shareholders of PowerDsine Ltd. have approved the acquisition of the specialist developer and maker of chips and modules for Power over Ethernet applications by Microsemi Corporation for $245 million.
Apple clears Jobs, but says phony records created
News & Analysis  
12/29/2006   Post a comment
Apple Computer filed much-anticipated reports with the U.S. Securities and Exchange Commission Friday (Dec. 29), saying its CEO Steve Jobs committed no wrongdoing in its options backdating scandal but that evidence surfaced of phony records that had been created to show a directors meeting that had never taken place.
Apple restates, acknowledges faked documents
News & Analysis  
12/29/2006   Post a comment
In regulatory filings, Apple Computer recognized additional non-cash stock-based compensation expense of $84 million after tax, including $4 million, $7 million and $10 million in fiscal years 2006, 2005 and 2004, respectively. The company acknowledged that it faked documentation of a special meeting of its board pertaining to a 2001 options grant to CEO Steve Jobs.
Laptop cooler offers choice between maximum cooling, minimum noise
Product News  
12/29/2006   Post a comment
Antec has introduced a small portable cooler that prevents overheating in laptop computers by using two ball-bearing blowers to direct cool air across the base of the notebook computer.
Xilinx ships industry's largest 65-nm FPGA
Product News  
12/29/2006   Post a comment
Xilinx started to ship the LX330, a 65-nm FPGA that is said to deliver 65% more logic than the largest 90-nm device. Xilinx fab partners UMC and Toshiba have quickly ramped 65-nm production, producing excellent yields that have enabled the chip vendor to deliver the complete 65-nm Virtex-5 LX platform on time and over one year ahead of its competition.
Top 8 DTV stories of 2006
Design How-To  
12/29/2006   Post a comment
The most popular How To stories of 2006 in Digital TV DesignLine
Dual-slot, hot swap controller simplifies PCI Express connection
Product News  
12/29/2006   Post a comment
Linear Technology's LTC4242, a narrow, dual-slot PCI Express hot swap controller for mid-range networking or storage servers and embedded applications, eliminates complex software interfaces, yet provides a rugged and compact solution for independently controlling the main supplies and the auxiliary supply on two slots.
Top auto electronics stories of 2006
Design How-To  
12/29/2006   Post a comment
From cosmic rays damaging electronics to the FlexRay protocol's impact on auto safety, here are the stories electronic engineers thought were tops for the year.
Light pipes come in many colors
Product News  
12/29/2006   Post a comment
Elma Electronic offers light pipes for front panel enclosure applications in a variety of colors. The LEDs transfer light to the front panel with a translucent and intense coloration and can emit light even when embedded deeper within a panel.
Engineer's guide to HDMI ESD protection: Part 1
Design How-To  
12/29/2006   Post a comment
Circuit manufacturers continue to decrease the minimum dimensions of the transistors, interconnections, and the insulation layers in their devices. This results in smaller structures for higher speed devices, which are more susceptible to breakdown damage at lower energy levels. An examination of system ESD protection design issues, and common misunderstandings about ESD protection components for HDMI (or other) I/O ICs.
Counting down top stories of 2006: No. 1
News & Analysis  
12/29/2006   Post a comment
In our No. 1 story of 2006, Silicon Valley editor Mark LaPedus details a claim by IBM Corp. and the Georgia Institute of Technology that they broke the silicon speed record, thanks in part to a "frozen chip." IBM and Georgia Tech said that they demonstrated the first silicon-based chip capable of operating at frequencies above 500 GHz by cryogenically "freezing" the circuit to minus 451 degrees Fahrenheit.
800-watt AC/DC can be configured and supplied next day
Product News  
12/29/2006   Post a comment
Users can specify next day delivery on custom orders for UNIPOWER's QuiQPLUS, a modular AC/DC power source that provides up to 800 watts from up to eight outputs.
Hedge fund urges Cypress to reorg, go private
News & Analysis  
12/28/2006   Post a comment
Los Angeles-based hedge fund Chapman Capital has written a letter to the board of directors of Cypress Semiconductor urging the company to reorganize itself and become a private company through leveraged buyout.
Analyst Gary Smith: top 10 EDA topics for 2007
News & Analysis  
12/28/2006   Post a comment
Veteran EDA analyst Gary Smith explains his "top ten" list of hot EDA topics for 2007, including electronic system level (ESL), design for manufacturability (DFM), IP reuse, analog/RF, globalization, and multi-core systems on chip.
CoCreate's new PLM tool suite 'changes the rules'
Product News  
12/28/2006   Post a comment
Innovation is the lifeblood of companies in the fast-moving electronics industry, yet the very process of product development can become a roadblock to beating a competitor to market. CoCreate Software Inc., a product lifecycle management software provider, is trying to eliminate those design bottlenecks using an approach to 3D product development the company calls "dynamic modeling."
Epoxy resin adheres to many substrate materials
Product News  
12/28/2006   Post a comment
Master Bond has successfully completed in use trial testing for its EP21TDC-2AN epoxy resin compound. This cured compound is used for high performance bonding, coating, and encapsulation.
Reflections of 2006 - Part 2
Blog  
12/28/2006   Post a comment
At time of the year, we have a tendency to reflect and look back on the events of the past year. I'm not just talking about the most popular stories that folks like you read such as "The Promise of 1080p," but the major trends and developments in the CE and semiconductor industries.
Intel ordered to produce evidence
News & Analysis  
12/28/2006   Post a comment
A U.S. District Court in Delaware has ordered Intel to produce documents and other evidence related to its business conduct outside of the U.S., according to a statement issued by Advanced Micro Devices.
Apple faked options grant documents, reports say
News & Analysis  
12/28/2006   Post a comment
Apple Computer gave CEO Steve Jobs 7.5 million unauthorized stock options in 2001 and later falsified records to make it appear as though its board of directors met to approve the grant, according to reports.
Study: Despite growth, Indian embedded industry faces threats
News & Analysis  
12/28/2006   Post a comment
India's $2.53 billion embedded software industry, while enjoying rapid growth, faces a number of challenges related to a shortage of relevant skills, according to a new study.
40-amp driver-MOSFET cuts power losses by 20 percent
Product News  
12/28/2006   Post a comment
Renesas Technology's R2J20602NP 40-amp driver-MOSFET claims the industry's highest efficiency, cutting power losses by more than 20 percent compared to the company's first generation product.
Stahlin offers updated enclosure product catalog
Product News  
12/28/2006   Post a comment
Stahlin offers an updated product catalog of its non-metallic enclosures and accessories. The catalog also provides information on choosing the right enclosure material, cutting and drilling non-metallic enclosures and a full chemical resistance table.
MEMS: Yesterday to tomorrow at Analog Devices
Product News  
12/28/2006   Post a comment
Startup companies are touting MEMS as a new growth area for ICs. But Analog Devices says it has been pioneering MEMS chips since 1989 and has shipped hundreds of millions of units.
Encapsulant developed for image sensor assembly
Product News  
12/28/2006   Post a comment
Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications. The Hysol FP5110 material is said to provide excellent adhesion to both 2- and 3-layer flexible printed circuits.
Best of the Best: The top eight features of 2006
Design How-To  
12/28/2006   1 comment
The top eight feature articles of 2006 hold no surprises: power optimization, memory architectures and the migration to next-gen interfaces such as HSDPA have top priority.
Philips sells APM manufacturing unit to Lite-On
News & Analysis  
12/28/2006   Post a comment
Royal Philips Electronics is selling the manufacturing operations of its Automotive Playback Modules (APM) business to Lite-On IT Corporation of Taiwan. Philips said the remainder of the APM operations, which are no longer seen as core to the conglomerate, would be transferred to a joint-venture between the two companies that will operate under the name Philips & Lite-On Digital Solutions, or PLDS.
Philips sells APM manufacturing unit to Lite-On
News & Analysis  
12/28/2006   Post a comment
Royal Philips Electronics is selling the manufacturing operations of its Automotive Playback Modules (APM) business to Lite-On IT Corporation of Taiwan. Terms of the deal were not disclosed.
Analyst: Back-end memory testing could tighten in '07
News & Analysis  
12/28/2006   Post a comment
The back-end memory testing industry may become tighter in the second half of 2007, as memory packaging and testing companies struggle to keep pace with a changing and rapidly growing market, according to a report by market researcher DRAMeXchange.
Report: Powerchip denies selling fab to Vanguard
News & Analysis  
12/28/2006   Post a comment
Taiwan's Powerchip Semiconductor said in a filing to the Taiwan Stock Exchange that reports that it is planning to sell its eight-inch-wafer plant to Vanguard International Semiconductor are pure speculation, according to a Forbes.com report.
Counting down top stories of 2006: No. 2
News & Analysis  
12/28/2006   Post a comment
Our No. 2 story for 2006, written by London editor Peter Clarke, described the ARM9-based asynchronous processor developed by ARM Holdings plc and Handshake Solutions NV, a subsidiary of Royal Philips Electronics subsidiary. The ARM996HS is thought to be the first commercial clockless processor and is said to be particularly suited to use as an automotive microcontroller.
Octal load-control switches simplify automotive designs
Product News  
12/28/2006   Post a comment
Providing versatile and board-efficient power distribution, Freescale Semiconductor's MC338xx and MC3399x octal serial switch ICs for automotive electronics control up to sixteen loads.
Formal provider OneSpin opens U.S. office
News & Analysis  
12/28/2006   Post a comment
OneSpin Solutions, a formal verification spinoff from Infineon in Germany, has opened a U.S. office in Sunnyvale, Calif. to boost sales of its Module Verifier and Equivalence Checker products.
Former KLA-Tencor CEO Tompkins resigns from board
News & Analysis  
12/27/2006   Post a comment
Jon Tompkins, former chairman and CEO of fab equipment supplier KLA-Tencor, resigned from the company's board of directors Dec. 21, according to a regulatory filing. Tompkins is the fourth high-ranking official to abruptly sever ties with KLA-Tencor since the company was implicated in a scandal over historical stock options grants.
WiBree Quiz: Five easy facts
Design How-To  
12/27/2006   Post a comment
What you don't know about this new wireless protocol could cost you your next promotion.
Tutorial: Linear Feedback Shift Registers (LFSRs) - Part 2
Design How-To  
12/27/2006   Post a comment
In which we discover how to access the LFSR's previous value, how to cycle through 2^n values (instead of 2^n - 1), and how LFSRs may be of interest for FIFO applications.
QuickLogic provides power comparison resource package
Product News  
12/27/2006   Post a comment
Demo platform, whitepaper, and microsite compares leading low power programmable logic from QuickLogic, Xilinx, Altera, and Lattice Semiconductor.
Defining the difference in perforated screens for video projectors
Design How-To  
12/27/2006   Post a comment
If the pursuit of digital cinema drove the focus on picture quality over the last decade, today the home cinema industry has picked up the charge and is some notable cases goes beyond the scope of the original mandate. Seeking out the "perfect picture" for the home cinema is our Holy Grail.
Multi-threaded design tackles SoC performance bottlenecks: Part 2
Design How-To  
12/27/2006   Post a comment
Coupling processor operation closely to bus and other computational demands leads to a dramatic increase in automotive vision system processor efficiency. With further tuning, optimizing the bus to work closely with the hardware threads improves performance and provides a more controllable, measurable, and predictable system latency.
Mentor confirms ESL buy with SpiraTech
News & Analysis  
12/27/2006   Post a comment
Mentor Graphics has confirmed its acquisition of SpiraTech, an electronic system level (ESL) tool provider whose tools are based on a proprietary assertion-based language.
U.S. turns to the Czech Republic for R&D
News & Analysis  
12/27/2006   Post a comment
Over 60 percent of the 2006 foreign direct investments in the Czech Republic announced by U.S.-based companies are R&D projects in innovation industries, according to data collected by CzechInvest, an agency of the Ministry of Industry & Trade of the Czech Republic.
Warren Buffett to buy distributor TTI
News & Analysis  
12/27/2006   Post a comment
TTI Inc., one of the world's largest distributors of passive and electromechanical components, is being acquired by Berkshire Hathaway, billionaire Warren Buffet's investment vehicle. Terms of the deal, which includes TTI's catalog based distribution business, Mouser Electronics, were not disclosed.
Page 1 / 11   >   >>


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