Breaking News
Internet of Things Designline
posted in December 2011
Page 1 / 7   >   >>
Eurotech's Catalyst CV embedded computer with Intel Atom N2000 launches in Q2 2012
Product News  
12/31/2011   Post a comment
Eurotech's Catalyst CV embedded computer module is based on the Intel Atom processor N2000, and offers dual-core performance capabilities with enhanced multimedia and a greater choice of operating environments, while using very little power. 
Top 10 smartphone innovations of 2011
12/30/2011   26 comments
As smartphones become ever more ubiquitous and the speed of mobile innovation increases exponentially month by month, keeping track of the big innovations over a full year can seem a futile task. The changes, once recorded seem almost incremental when looked at through the year’s rear view mirror.
Tegal sells nanolayer deposition patents
News & Analysis  
12/30/2011   4 comments
Chip equipment vendor Tegal said it has sold more than 30 patents from its nanolayer deposition patent portfolio for about $3.6 million.
Kyocera offers lifetime LCD supply
News & Analysis  
12/30/2011   9 comments
A lifetime supply of liquid-crystal displays is being guaranteed to original equipment manufacturers by Kyocera, which recently extended its acquisition of LCD and touchscreen suppliers by purchasing Optrex.
Docomo, Fujitsu, Renesas: The triangle thickens
12/30/2011   7 comments
When NTT Docomo announced its plan for a new consortium with five companies for LTE products, the void that caught my eye was the conspicuous absence of Renesas Mobile from NTT Docomo’s list.
VersaLogic announces multi-I/O expansion modules for SUMIT products
Product News  
12/29/2011   Post a comment
VersaLogic Corp. has launched their M1 line of expansion modules, providing industry-standard I/O interfaces for SUMIT-based embedded systems.
How It Was: My first Lucid Dream
Programmable Logic DesignLine Blog  
12/29/2011   29 comments
Suffice it to say that this was an occasion I shall always remember…
Tessera subsidiary buys 73 MoSys patents
News & Analysis  
12/29/2011   4 comments
Invensas, a subsidiary of technology licensor Tessera Technologies, said it purchased 73 memory chip technology patents from MoSys for $35 million in cash.
EE Times' top ten cloud stories in 2011
News & Analysis  
12/29/2011   8 comments
The most popular cloud computing stories of 2011 were about big vendors jumping in and engineers coming to grips with this emerging space.
Chinese foundries confirm merger
News & Analysis  
12/29/2011   9 comments
Hua Hong Semiconductor and Grace Semiconductor Manufacturing, China's second and third largest foundries, said they completed a merger between the two companies.
UMC tips 0.11-micron aluminum BEOL process
News & Analysis  
12/29/2011   1 comment
UMC claimed to be the first foundry to provide a specialized 0.11-micron aluminum process in the company's 200-mm fabs.
Superbattery: The next great triumph of engineering
12/29/2011   39 comments
The next great engineering advancement in batteries is in the lab and it is tantalizingly close to solution.
What are the best “unknown” gems of science fiction? (Part 2)
Programmable Logic DesignLine Blog  
12/28/2011   22 comments
Here are a two more science fiction books that really influenced me when I first came across them…
EE Times 10 most read news stories of 2011
News & Analysis  
12/28/2011   5 comments
Here, we present the 10 most widely read news stories on in 2011.
Intel rolls 32-nm Atom, preps 22-nm Ivy Bridge
News & Analysis  
12/28/2011   12 comments
Intel rolled out 32 nm Atom chips for netbooks and embedded systems and is reportedly planning to release its 22 nm Ivy Bridge notebook and desktop CPUs in April.
Report: TSMC mulls New York investment
News & Analysis  
12/28/2011   30 comments
Foundry giant TSMC is considering making an investment in New York state, according to a report by Taiwan's Central News Agency.
Raspberry Pi foundation readies $25 PC for launch
News & Analysis  
12/28/2011   30 comments
British not-for-profit foundation Raspberry Pi has said its credit-card sized $25 PCs will become available for sale next month, once they emerge from final beta testing.
Intel's Medfield benchmarks leaked
News & Analysis  
12/27/2011   13 comments
Purported specifications and benchmarks of Intel’s upcoming 32nm Medfield platform have been leaked online, detailing performance figures set to rival if not beat current chip market leaders in the tablet space.
NTT Docomo tips fabless JV for mobile chips
News & Analysis  
12/27/2011   4 comments
NTT Docomo, Japan's largest wireless carrier, said it reached a basic agreement with five chip companies to establish a fabless joint venture to develop and sell semiconductors for handsets and other mobile devices.
An analyst's take on the Lam-Novellus deal
Semi Conscious  
12/27/2011   2 comments
Dean Freeman, a semiconductor capital equipment analyst at Gartner, offers his perspectives on Lam Research's proposed $3.3 billion acquisition of Novellus Systems.
Can Apple make a better Web TV?
News & Analysis  
12/27/2011   23 comments
Can Apple crystallize the emerging concept of a Web-connected TV into a must-have product as it has done with MP3 players, smartphones and tablets?
Soitec to acquire Alatech Semi
News & Analysis  
12/27/2011   Post a comment
Electronic materials vendor Soitec said it would acquire all of the outstanding shares of French chip equipment company Alatech Semiconductor by the end of January 2012.
Invest in mobile, not PC in 2012 say financial analysts
News & Analysis  
12/27/2011   13 comments
Investment bank Canaccord Genuity has unveiled its top tech picks for 2012, with Qualcomm and Apple topping the list, while investors were warned to be wary of buying Intel stock in the coming months.
Back Story
News & Analysis  
12/27/2011   6 comments
We have compiled our “Confidential Top 10,” the ten most well-read EE Times Confidential stories this year. We have also put together "back stories," illustrating what have motivated us to go after a specific story.
ESL, down under style
News & Analysis  
12/26/2011   2 comments
I love it when I discover new EDA companies, especially those in the ESL field. Introducing VWorks…
IHS: Wireless infrastructure gear market grew 9% in 2011
News & Analysis  
12/23/2011   5 comments
Global spending on wireless infrastructure equipment is set to return to growth in 2011 after two years of decline and stagnation, according to market research firm IHS iSuppli.
Ooooh! Custom-made leather “Messenger Bags” – I’m drooling with desire!
12/23/2011   4 comments
The tag-line for these custom leather goods is “They’ll fight over it when you’re dead” (I think they are correct)
Media struggles. 2012 will be key
12/23/2011   1 comment
How long have you been a reader of EDA Designline? Get involved if you don’t want to see it disappear, which is a real possibility…
Top 10 automotive electronics stories of 2011
Design How-To  
12/23/2011   3 comments
The top stories of the year underscore the great interest Automotive Designline readers have in hybrid and electric vehicles.
Broadcom takes Rambus license
News & Analysis  
12/22/2011   2 comments
Broadcom signed a patent license agreement giving the company access to Rambus technology in its ICs.
Pause for a moment and ponder this…
The Engineering Life - Around the Web  
12/22/2011   13 comments
As we are poised to enter the holiday season, let’s take a moment to pause for thought...
Touchscreens adopt on-cover over in-cell
News & Analysis  
12/22/2011   3 comments
LCD vendors worldwide are being pressured by smartphone and tablet makers to quickly integrate touch into the display itself, using in- or on-cell sensors, but slow development has prompted add-on touchscreen vendors to offer interim sensor-on-cover, touch-on-lens, and similar one-glass solutions, at least for 2012.
It looks like the joke is on me!
The Engineering Life - Around the Web  
12/22/2011   12 comments
Way back in the mists of time, I wrote a blog about a Free Cellphone Locator Website…
Is this the “Messenger Bag” for me?
12/22/2011   Post a comment
I’ve been inundated with suggestions following my blog: What’s the best “Messenger Bag” for me?
Inside Sony's Vita: IBM, Toshiba, Avago
News & Analysis  
12/22/2011   12 comments
IBM, Toshiba, Qualcomm and Avago won significant sockets inside Sony's Playstation Vita handheld game console, according to a teardown by UBM TechInsights.
Lead-free auto power MOSFETs come in standard TO packages
Product News  
12/22/2011   2 comments
Diffusion-soldering die-attach approach permits producing lead-free packages.
Engineering simulators for the iPad
Engineering Pop Culture!  
12/22/2011   21 comments
My old chum Alvin just emailed me to tell me about a bunch of iPad apps that have only recently been released...
Linear Technology LTC2863 RS485 transceivers
Product News  
12/22/2011   Post a comment
Linear Technology's latest RS485/RS422 transceivers eliminate field failures without the need of costly external protection devices.
Indian chip firm hits rare milestone
News & Analysis  
12/22/2011   11 comments
An announcement by Cosmic Circuits that it has shipped 12 million ICs so far didn't garner a lot of attention internationally, but made waves here because it marks the first time an Indian chip company has attained such numbers.
Molex’s CMC 154-circuit header in compliant-pin mount and 32- and 112-circuit solder-mount headers
Product News  
12/22/2011   Post a comment
Molex's CMC 154-circuit header in compliant-pin mount and 32- and 112-circuit solder-mount headers offer robust, sealed, wire-to-board connection systems for high-conductivity, high-vibration powertrain applications.
Accelerated Android 4.0 available on ARM development boards
News & Analysis  
12/22/2011   5 comments
Linaro, a not-for-profit engineering organization that works with open-source software for the ARM processor architecture, has announced downloadable builds of v4.0 of the Android operating system on development boards from Samsung and ST-Ericsson.
Power semi market to grow 5% in 2012, says IMS
News & Analysis  
12/22/2011   5 comments
The global power semiconductor market will grow by 5.0 percent in 2012 to $32 billion after growing by 3.7 percent in 2011, according to market research firm IMS Research.
Self-healing system repairs broken wires, traces
12/22/2011   13 comments
A team of University of Illinois engineers has developed a self-healing system that restores electrical conductivity to a cracked circuit. Liquid metal contained in microcapsules, released by the damage, fills in the gap in the circuit, restoring electrical flow.
Chip sales for smart meters set to double
News & Analysis  
12/21/2011   13 comments
Sales of semiconductors used in smart electricity meters are projected to grow to $1.1 billion in 2016 from $505.6 million in 2011, due to rapid growth expected for the devices, according to market research firm IHS iSuppli.
Micron posts loss on declining memory ASPs
News & Analysis  
12/21/2011   2 comments
U.S. memory chip vendor Micron Technology posted its second consecutive quarterly loss, saying declining average selling prices for memory chips outstripped shipment bit growth.
XIMEA introduces USB 3.0 5Gbps industrial camera
Product News  
12/21/2011   2 comments
XIMEA GmbH claims to set a new benchmark for high-speed industrial cameras with the introduction of the MQ series USB 3.0 SuperSpeed industrial machine vision cameras.
What are the best “unknown” gems of science fiction? (Part 1)
The Engineering Life - Around the Web  
12/21/2011   20 comments
There are some books that completely “blew my mind” when I was younger, but very few people I talk to about this sort of thing have heard about them...
10 notable blunders of 2011
News & Analysis  
12/21/2011   21 comments
As with any year, 2011 contained its share of blunders in the electronics world that will be remembered for years to come.
Compact 1.5 W DC/DC converters target high-vibration applications
Product News  
12/21/2011   Post a comment
An enclosed BPA package houses the transformer, control circuitry, and power switches for interconnect reliability.
DSOs have 2.4 Mpts memory and LAN interface
Product News  
12/21/2011   Post a comment
The 2540B and 2542B oscilloscopes from B&K Precision offer bandwidths of 60 MHz and 100 MHz respectively with 1 GSa/s sampling rates.
Page 1 / 7   >   >> Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Most Recent Comments
Like Us on Facebook
Special Video Section
Power can be a gating factor in success or failure of ...
Get to market faster and connect your next product to the ...
See how microQSFP is setting a new standard for tomorrow’s ...
The LTC3649 step-down regulator combines key features of a ...
Once the base layer of a design has been taped out, making ...
In this short video we show an LED light demo to ...
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
Wireless Power enables applications where it is difficult ...
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
The LT8602 has two high voltage buck regulators with an ...
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...