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posted in February 2005
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IBM, MII to devise dielectric materials for nano-imprint
News & Analysis  
2/28/2005   Post a comment
IBM Corp. and Molecular Imprints Inc. (MII) are jointly working on dielectric materials to propel the development of nano-imprint lithography for mainstream chip production.
RF Micro to discontinue WLAN chipset efforts
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2/28/2005   Post a comment
RF Micro Devices Inc. said that it will discontinue its internal "WiFi" or wireless local area networking (WLAN) chipset development efforts.
ARM, Synopsys collaborate on energy management
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2/28/2005   Post a comment
Synopsys Inc. and ARM Ltd. have jointly developed a low-power reference methodology for implementing ARM's energy manager technology in silicon.
Airespace, Kineto Wireless develop 802.11-GSM enterprise solution
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2/28/2005   Post a comment
Airespace Inc. and Kineto Wireless have demonstrated what they say is the first enterprise class solution for 802.11-GSM convergence, paving the way for the seamless delivery of high-performance mobile voice and data services over secure enterprise wireless networks.
Applied Materials settles patent suit against SPM
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2/28/2005   Post a comment
Semiconductor equipment supplier Applied Materials Inc. announced Monday (Feb. 28) that it has settled its patent lawsuit against Semiconductor Products Manufacturing, Inc. (SPM).
Unified methodology enables full-chip test
News & Analysis  
2/28/2005   Post a comment
Disconnected point tools don't provide a good design for test strategy. Cadence Design Systems' Mick Tegethoff (right) describes a "unified" full-chip approach that spans test specification, implementation, and verification.
Programmable power control addressed at Embedded Systems Conference
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2/28/2005   Post a comment
Summit Microelectronics announces that Tom DeLurio, applications engineering director, will present a paper titled, "Set-point Accuracy and Temperature Effects in Communications Equipment", at the Embedded Systems Conference
DRS wins $21.3 million to build Army computer systems
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2/28/2005   Post a comment
DRS Technologies Inc. has received a $21.3 million delivery order to provide Applique Computer Systems for the U.S. Army's Force XXI Battle Command, Brigade and Below (FBCB2) program.
Taos enhances light-to-digital converter performance
Product News  
2/28/2005   Post a comment
Texas Advanced Optoelectronic Solutions, Inc. (Taos) boosted the performance of two new light-to-digital converters to suit a wider range of applications.
AMD announces Open Platform Management Architecture spec
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2/28/2005   Post a comment
AMD Inc. has released an Open Platform Management Architecture (OPMA) specification that defines a common hardware interface between the server platform and its server management subsystem.
Le PDG de Cadence déclare que le marketing de la CAO doit changer
News & Analysis  
2/28/2005   Post a comment
A l’occasion d’une visite dans les centres indiens de Cadence situés à Noida, près de New Delhi, et à Bangalore, le Président-directeur général de Cadence, Michael J. Fister a déclaré que les entreprises de CAO allaient davantage prendre conscience des besoins du client et qu’elles n’allaient plus seulement représenter un secteur qui se permet des tentatives d’intimidation par des babillages technologiques.
Kontron schlägt Brücke zwischen PCI und PCI Express
News & Analysis  
2/28/2005   Post a comment
Kontron Embedded Modules stellt mit 'Pisa-Express' ein neues CPU-Slotkarten-Konzept vor, das sowohl PCI als auch PCI-Express über einen einzigen Half-Size-Slot ausführt. Damit knüpft der Hersteller an den Erfolg seiner Pisa-Familie an.
PoL converter packs big power into a small space
Product News  
2/28/2005   Post a comment
An ultra-integrated DC-to-DC converter for Point of Load (POL) applications from Enpirion offers 20W of output power, 6A of output current, and 92% peak efficiency power density of up to 700 Watts-per-cubic-inch, or 80 Watts-per-square inch.
Scope Wars: The closing bell?
Product News  
2/28/2005   Post a comment
eeProductCenter sounds the bell in the ongoing oscilloscope specsmanship battle between Agilent Technologies and Tektronix. If you haven't been following this instrumentation specs debate, here's your chance to catch up, with Agilent's latest retort to Tektronix now on-line.
MCU enables energy-efficient lighting systems
Product News  
2/28/2005   Post a comment
Freescale Semiconductor has hopes of penetrating smart fluorescent lighting applications that require power factor correction and/or high-resolution pulse width modulation with its newest 8-bit microcontroller line.
mPhase, Rutgers University expand nanotechnology battery research
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2/28/2005   Post a comment
mPhase Technologies Inc. said it will collaborate with Rutgers University to broaden the capabilities of its nanotechnology-based battery now under development.
Jef Raskin, Mac creator, dead at 61
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2/28/2005   Post a comment
Jef Raskin, creator of the Macintosh computer, died Feb. 26 at his home in Pacifica, Calif. Raskin was 61, and had recently been diagnosed with pancreatic cancer.
Engenio, Huawei Technologies team on data storage
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2/28/2005   Post a comment
Engenio Information Technologies and China-based Huawei Technologies Co. Ltd. have announced an OEM agreement to develop large-scale, modular data storage systems for the China market.
Advanced hard drives clamp mobiles' power drain
Teardown  
2/28/2005   Post a comment
The Apple iPod set a trend among portable handheld consumer devices: It was among the first battery-powered MP3 music players to use a microminiature hard drive. That was followed late last year in South Korea by the Samsung SPH-V5400, arguably the first camera phone to make use of a 1.5-Gbyte hard drive. Clearly there is a move toward replacing flash memory with hard-disk drives (HDDs) in portable devices to increase storage capacity in an effort to meet consumer demands for more songs, picture
Low-end cell leans on analog
Teardown  
2/28/2005   Post a comment
esigned primarily for the entry-level cell phone user and first launched in Brazil, Kyocera's K112 handset nevertheless supports a fairly rich feature set, including games, calculator, ring tones and an alarm-one of my favorite little extras. On a more technical note, the handset also features an internal antenna-an amazing bit of RF engineering in itself-to bypass all those breakage-prone stubs and whips.
Les PDG du secteur de la CAO affichent un optimisme modéré pour 2005
News & Analysis  
2/28/2005   Post a comment
Personne ne prévoit une croissance à deux chiffres du secteur de la CAO électronique, mais, en 2005, des recettes modestes devraient être enregistrées. Lors du Consortium sur la CAO, six PDG ont évoqué les nouveaux défis et les opportunités du secteur de la CAO.
RIT pushes 193-nm immersion lithography to 31-nm
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2/28/2005   Post a comment
During the SPIE Microlithography conference here this week, the Rochester Institute of Technology (RIT) is expected to claim the world's smallest images via 193-nm immersion lithography.
System-on-chip calls attention to higher power density
Product News  
2/28/2005   Post a comment
Product Review—Enpirion's latest device is promoted as a step-improvement over the company's EN5330 introduced last May (see eeproductcenter.com, ID#21100422 and ID#21100071), which was the first claimed power system-on-a-chip with an on-board output inductor for its synchronous buck PWM converter.
Cypress et Conexant offrent une solution TV sur PC avec alimentation USB
News & Analysis  
2/28/2005   Post a comment
Cypress Semiconductor et Conexant allient leurs forces technologiques en vue d’acheminer de la vidéo, de l’audio et des données vers un ordinateur hôte via une connexion USB 2.0 pour une lecture et un stockage immédiats. Ils annoncent d’ores et déjà la disponibilité du kit de référence USB 2.0 audio/vidéo et données CX25840/1/2/3 (AVD) de Conexant sur une solution USB « EA-USB FX2 » de Cypress.
MII debuts nano-imprint litho for sub-50-nm designs
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2/28/2005   Post a comment
Molecular Imprints Inc. (MII) rolled out its latest nano-imprint lithography tool that claims to offer sub-50-nm half-pitch resolution.
Sensor measures temperature with pinpoint accuracy
Product News  
2/28/2005   Post a comment
National Semiconductor Corp.'s TruTherm thermal management technology facilitates pinpoint-accurate temperature measurements for chips with integrated thermal diodes.
ASML, Nikon claim progress in immersion lithography
News & Analysis  
2/28/2005   Post a comment
During the SPIE Microlithography conference here this week, ASML Holding NV and Nikon Corp. are expected to present the latest results in their respective 193-nm immersion lithography programs.
Brion to debut 'algorithmic' lithography simulation
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2/28/2005   Post a comment
More details are surfacing about startup Brion Technologies Inc., which is apparently taking on KLA-Tencor Corp and Sigma-C in the lithography simulation software market.
RIT to describe solid immersion for 25-nm lithography
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2/28/2005   Post a comment
During the SPIE Microlithography conference here this week, the Rochester Institute of Technology (RIT) is expected to present a paper on solid immersion lithography for 25-nm designs and beyond.
Toolbox enables fixed-point design directly in MATLAB
Product News  
2/27/2005   Post a comment
Complete fixed-point design environment enables engineers to eliminate the time-consuming and error-prone process of creating and debugging fixed-point designs in the C programming language.
32-bit ARM9 based SoCs now available with OSE 5.0 operating system
Product News  
2/26/2005   Post a comment
Enea Embedded Technology is porting Version 5.0 of the OSE Real-Time Operating System to the LH7A400 ARM-based BlueStreak SoC to improve the performance of mobile terminal devices
Samsung to spend $2.1 billion on LCD plant
Product News  
2/26/2005   Post a comment
In what appears to be a move to outspend its rivals, Samsung Electronics Co. Ltd. on Friday said that it will invest a total of 2.08 trillion ($2.1 billion) in its second flat-panel display production line in Tanjeong, Korea.
IC offers drop-in GPS functionality for portable wireless devices
Product News  
2/26/2005   Post a comment
SiRF Integrates Baseband, RF, and Flash Into a Single Package for use in aided-GPS receivers.
W-CDMA power amplifier modules are optimized for efficiency
Product News  
2/26/2005   Post a comment
Designed to reduce average power consumption by 50%, Anadigics' new power amplifer (PA) family targets W-CDMA applications.
Ultratech ships laser thermal tools to IBM, Intel
News & Analysis  
2/25/2005   Post a comment
Ultratech Inc. has quietly shipped among its initial laser thermal processing (LTP) tools, reportedly to IBM Corp. and Intel Corp., according to Avinash Kant, an analyst with investment banking firm Adams Harkness Inc. (Boston).
Slow semiconductor growth seen for both '05, '06
News & Analysis  
2/25/2005   Post a comment
Semiconductor sales were robust in 2004, but concerns about inventory levels continue to shape the industry in 2005.
U.S. adopts smart card IDs
News & Analysis  
2/25/2005   Post a comment
The U.S. government has adopted new smart card-based identification cards for federal employees and contractors.
'Mobile Suica' phones board Japan's rail system
News & Analysis  
2/25/2005   Post a comment
Consumers here will soon be able to use their mobile phones on Japan's extensive railway network.
Philips revendique des avancées dans les mémoires non volatiles plastiques
News & Analysis  
2/25/2005   Post a comment
Des chercheurs de l’Université de Groningen (Pays-Bas) et des scientifiques de Philips Research ont publié, dans l’édition de mars de Nature Materials, des détails concernant une mémoire non volatile implémentée dans le plastique.
Low-Z driver ICs boost multiphase, motor designs
Product News  
2/25/2005   Post a comment
Four new high-speed, low-impedance n-channel MOSFET driver ICs from Siliconix are intended to improve high-current, single- and multiphase DC/DC switching power supply designs. One of the new drivers is specifically suited to brushless motor control applications.
Memcap va contribuer au consortium européen pour la sécurité aérospatiale (HASTAC)
News & Analysis  
2/25/2005   Post a comment
Memscap, spécialiste français des MEMS (systèmes micro-électromécaniques), vient d’être choisi pour participer au projet du Calendrier Stratégique Européen pour l’Aéronautique. Sa contribution concernera notamment la mise à disposition de son capteur de pression SP83 et de ses technologies associées.
IBM ups open-source efforts
News & Analysis  
2/25/2005   Post a comment
IBM Software is turning up the noise on its open-source contributions.
Full-bricks serve high-rail distributed power
Product News  
2/25/2005   Post a comment
Lambda's PAF600F280 family of full-brick DC/DC converters delivers 600 watts for distributed high-voltage DC power architectures as well as custom off-line power supplies. Working from a nominal 300-volt (200 to 400 V) input, the converters are available in 12-, 24-, 28- and 48-volt output versions.
Süss Microtec legt Aligner-Fertigung zusammen
News & Analysis  
2/25/2005   Post a comment
Der Halbleiterausrüster Suess Microtec will die Produktion seiner Mask Aligner auf den Standort München konzentrieren.
Study finds U.S. not keeping up with competitors
News & Analysis  
2/25/2005   Post a comment
A new study released by consultancy A.T. Kearney asserts that U.S. companies aren't keeping up with the pace of new competition from overseas companies in the technology and telecom markets.
Cadence CEO says EDA marketing must change
News & Analysis  
2/25/2005   Post a comment
EDA companies will be more cognizant of customer needs and rise above being an industry that is one indulging in technology babble, Cadence president and chief executive Michael J. Fister said in a visit to Cadence's India centers at Noida near New Delhi and Bangalore.
Pulse unveils RoHS compliance initiatives
Product News  
2/25/2005   Post a comment
Pulse, a Technitrol Company, has announced its plan for compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive. Under its compliance program, all new products will be designed to be RoHS compliant and existing products will be evaluated and upgraded to be compliant with both the material and production process requirements of RoHS. The conversion of Pulse production operations is in process and will be completed during 2005.
Adapter fits TSOP packages
Product News  
2/25/2005   Post a comment
Adapters.com has expanded its line of Chip-Changer adapters with the introduction of its newest device for 40- and 48-pin TSOP Type-I IC packages. These adapters offer engineers an alternative to scrapping existing boards due to part obsolescence and part allocations, as well as eliminate costly board revisions.
Micro-miniature transponder coil targets automotive apps
Product News  
2/25/2005   Post a comment
Perllo Technologies LLC and its manufacturing partner ECM Electronics Ltd. have introduced their new ECM63T transponder coil for direct tire pressure management system (TPMS) applications in the N. American automotive market. The National Highway Traffic Safety Administration (NHTSA) has set a deadline by 2008 that requires all lightweight cars and trucks to have a direct TPMS.
Lead-free inductors target automotive, industrial apps
Product News  
2/25/2005   Post a comment
Perllo Technologies LLC and manufacturing partner ECM Electronics Ltd. have introduced a new series of lead-free power inductors for automotive and industrial control applications. Developed to help power supply engineers design more power efficient circuits, the new compact ECxxC series provides better reflow solderability and higher current handling capability than other low-profile solutions, said the company.
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