NEC miniaturizes DPAK form factor Product News 2/26/2009 Post a comment After the introduction of its HSON-8 power transistor package, NEC Europe again rolls a new package form factor and design aiming at power devices in particular for automotive applications.
Embedded systems project to get $6.9 million from EU News & Analysis 2/26/2009 Post a comment Interested, a collaborative research project intended to bring embedded systems development tools together from European vendors, to create tool chains, is set to get a total of 5.4 million euro (about $6.9 million) of funding towards the cost.
First Solar sees breakthrough in manufacturing costs News & Analysis 2/26/2009 Post a comment Solar module manufacturer First Solar Inc. had both bright and subdued forecasts for the emerging solar industry, unsettling investors with suggestions that it expects demand to fall, competition to increase and huge financial challenges for the industry in the near future, as it revealed it had broken the $1/watt price barrier by reducing manufacturing costs to just $0.98/watt.
Analyst: Trio dominated GaAs device market in '08 News & Analysis 2/26/2009 Post a comment The market for Gallium Arsenide devices grew by 9 percent in 2008, according to market research group Strategy Analytics, with early estimates showing that RFMD, Skyworks and TriQuint further consolidated their position in the sector.
Standards needed to tap smart grid potential News & Analysis 2/25/2009 Post a comment The move to so-called smart electric grids will open new opportunities for communications companies in the energy sector, but it will require new standards, according to Jake MacLeod, chief technology officer with Bechtel Communications.
Credit Watch: Chartered's survival hinges on Temasek News & Analysis 2/25/2009 Post a comment A major ratings agency has downgraded Chartered Semiconductor Manufacturing Co. Ltd.'s bonds further into junk territory but the Singapore foundry's remains a viable player in the wafer business because of the support it can count on from parent Temasek Holdings Pte Ltd.
A tradeoff between microcontroller, DSP, FPGA and ASIC technologies Design How-To 2/25/2009 Post a comment This article reviews the relative strengths and weaknesses of microcontroller (MCU), digital signal processor (DSP), field programmable gate array (FPGA) and application-specific integrated circuit (ASIC) technologies for embedded applications, and proposes a customizable microcontroller as a cost-, performance- and power-effective tradeoff between them.
Home networking groups edge toward G.hn News & Analysis 2/25/2009 1 comment Three ad hoc groups promoting competing networking standards have formed liaisons with the Home Grid Forum, another step toward industry support for the ITU G.hn effort to create a single wired standard for home networks over powerline, coax and telephone lines.
Viewpoint: More to IP reuse than software tweaks Design How-To 2/25/2009 1 comment Platform-based design with heavy IP reuse will continue to proliferate as more functionality is included into tomorrow's chip, but differentiation through software alone falls short of power and performance requirements.
The Greenest Notebook Computer...Fact or Fiction? Design How-To 2/25/2009 Post a comment Apple has spent a great deal in advertising for their new line of eco-friendly notebooks. Michael Kirschner, President of Design Chain Associates, takes a look at how "green" the new line of Macbooks really are, and how other manufacturers must take notice on improving their own environmental performance when they are improving cost and technical performance.