Design Con 2015
Breaking News
Internet of Things Designline
posted in February 2009
<<   <   Page 3 / 17   >   >>
Aerco : Circular connectors offer high performance and high density
News & Analysis  
2/25/2009   Post a comment
New from Aerco is the Deutsch Wildcat series, a range of high quality circular connectors that combines the performance levels of D38999 connectors with the compact size of the Deutsch MMC range.
Tela Innovations acquires Blaze DFM
News & Analysis  
2/25/2009   Post a comment
Tela Innovations announced it has acquired Blaze DFM.
GlobTek : 50 W supply has 2nd variable output
News & Analysis  
2/25/2009   Post a comment
GlobTek’s GS-1549 design delivers up to 50 W of continuous output power and has dual regulated outputs: +12 Vdc at 2 A and variable 10 to 100 Vdc at 26 W.
IBM et AMD en piste pour le 16-nm EUV avec des machines ASML
News & Analysis  
2/25/2009   Post a comment
ASML annonce avoir produit des composants 28-nm avec son outil en R&D de lithographie EUV. Avec cet outil et d'autres à venir, AMD, IBM et d'autres vont se lancer dans le EUV pour des puces 22-nm et 15-nm
Molex : 85 Ohm backplane connector supports Intel QPI standard
Product News  
2/25/2009   Post a comment
Molex’ Impact 85 Ohm backplane connector is designed to support the Intel Quick Path Interconnect (QPI) standard, PCI Express Generation 2.0 and 3.0, as well as any proprietary system design where 85 Ohm differential impedance is desired.
Vehicle electrification happens in truck market, study says
News & Analysis  
2/25/2009   Post a comment
Despite the ongoing hype about HEV and electric drives for passenger cars, the stage for vehicle 'electrification' is somewhere else. Market researcher Darnell Group says heavy-duty trucks are much more prone for alternative powertrain approaches.
ADI acquires 'smart grid' technology
Product News  
2/25/2009   Post a comment
Analog Devices Inc. has acquired a Canadian developer of power-line communications and other smart grid technologies.
Sematech, Asahi to devise EUV mask blanks
News & Analysis  
2/25/2009   Post a comment
Chip-making consortium Sematech has entered into a joint development partnership to accelerate mask blank commercialization with Asahi Glass Co. (AGC) of Japan.
IDC: IC market to fall 22 percent
News & Analysis  
2/25/2009   Post a comment
Another gloomy IC forecast: Following a revenue decline of 2 percent in 2008, IDC expects the chip market will fall by 22 percent in 2009.
Yokogawa : Mixed signal scope suits automotive bus testing
Product News  
2/25/2009   Post a comment
With the launch of the DLM2000 mixed-signal oscilloscope, Yokogawa is now able to offer a complete package of test & measurement solutions for analysing the serial bus systems that are increasingly being used in the automotive sector.
ADI buys 'smart-grid' firm
News & Analysis  
2/25/2009   Post a comment
Analog Devices Inc. (ADI) has acquired power-line communications technology from Domosys Corp., a company based in Quebec City, Canada.
IBM joins Danish EDISON Project to develop smart grid for electric vehicles
News & Analysis  
2/25/2009   Post a comment
IBM has become a new member of the EDISON research consortium, a Denmark-based collaborative aimed at developing an intelligent infrastructure that will make possible the large scale adoption of electric vehicles powered by sustainable energy.
Gartner réduit encore ses prévisions à moins 24 pourcent pour 2009
News & Analysis  
2/25/2009   Post a comment
Gartner Inc. a encore réduit ses prévisions pour le marché des semiconducteurs mondial en 2009 à $194.5 mds soit une baisse de 24.1 pourcent.
Market dims for mobile handset displays
Product News  
2/25/2009   Post a comment
Shipments of displays for mobile handsets will decline to 1.5 billion units in 2009, down 6.2 percent from 1.6 billion units in 2008, according to market research group iSuppli.
Sales up but losses widen at ARC
News & Analysis  
2/25/2009   Post a comment
ARC international (St Albans, England) increased revenues by 18 percent to £17 million for the year ended December 2008, with revenues from royalties steaming ahead by 61 percent to £7.9 million compared with the previous year. Licensing revenues, however, were flat at £7.3 million as the company cautioned that uncertainty in the semiconductor industry might affect the timing of new licence revenues and royalty volumes this year.
With power management, Dialog Semi bucks downtrend
News & Analysis  
2/25/2009   Post a comment
With its strategy to focus on power management solutions for mobile devices, Dialog Semiconductor (Kirchheim/Teck, Germany) had a home run in Q4 and the entire FY2008. The company remains optimistic for the crisis year 2009.
Gartner cuts IC forecast, sees 24% drop
News & Analysis  
2/25/2009   Post a comment
Gartner Inc. has cut its IC forecast--again. Worldwide semiconductor revenue is forecast to reach $194.5 billion in 2009, a 24.1 percent decline from 2008 revenue.
Molecular Imprints is upbeat about 2009
News & Analysis  
2/25/2009   Post a comment
Bucking the trend in the slumping equipment industry, Molecular Imprints Inc. (MII) is expected to grow and hire in 2009.
Innovation in a squeeze, says entrepreneur
News & Analysis  
2/24/2009   Post a comment
An increasingly risk averse climate—even in Silicon Valley—and an overburdened and poorly managed patent system are threatening innovation in electronics, according to Steve Perlman, a serial entrepreneur and one of many speakers at the upcoming Intellectual Property Symposium.
Updated: Initiative forms around e-beam direct write
News & Analysis  
2/24/2009   Post a comment
The eBeam Initiative, a multi-company effort dedicated to the advancement of e-beam direct-write technology for semiconductor prototyping and low-volume manufacturing, launched at the SPIE Advanced Lithography conference.
IBM, AMD push 16-nm EUV effort despite tool delay
News & Analysis  
2/24/2009   Post a comment
ASML Holding NV has slightly delayed the delivery schedule for its ''pre-production'' extreme ultraviolet (EUV) lithography tool by a quarter or so.
Applied joins 3-D group, inks FinFET deal with IBM
News & Analysis  
2/24/2009   Post a comment
Applied Materials Inc. is moving on two fronts, including FinFETs and 3-D devices.
Clock generator eliminates oscillators in networking systems
Product News  
2/24/2009   Post a comment
ADI's clock generator reduces cycle time and complexity in networking and communications systems.
COMMENTARY: Got Configuration Management?
Blog  
2/24/2009   2 comments
Companies that don't adopt appropriate configuration management technology will fail and fall by the wayside!
Viewpoint: Standard FPGA-based emulation will prevail
Blog  
2/24/2009   1 comment
Moving forward, the standard FPGA-based emulator will ultimately prevail. If nothing else, for economical reasons.
How to calculate maximum operating frequency for delay lines
Design How-To  
2/24/2009   Post a comment
This article discusses a simple way to calculate the maximum input frequency for fixed and programmable delay lines.
KLA-Tencor tips maskless technology
News & Analysis  
2/24/2009   2 comments
At the SPIE Advanced Lithography conference here, KLA-Tencor Corp. disclosed more details about its maskless lithography program.
Microsoft debuts cloud R&D team
News & Analysis  
2/24/2009   Post a comment
At its annual TechFest event, Microsoft Research will formally debut a new cloud computing R&D team that aims to raise the ease of use and lower the cost and power consumption of applications hosted by large data centers.
20 W chip attenuator for high power RF and microwave applications
News & Analysis  
2/24/2009   Post a comment
Portsmouth, RI — International Manufacturing Services has announced the availability of its high power 2010 size chip attenuator designated VGX-2010WA.
Tips and Tricks: Improve battery life--use ultra-low power audio codecs with signal processing
Design How-To  
2/24/2009   Post a comment
With the recent development of ultra-low power codecs with embedded mini-DSPs and powerful graphical programming tools, manufacturers are now meeting the complex requirements of portable device manufacturers.
Killer Robots -- Not a Joke!
Programmable Logic DesignLine Blog  
2/24/2009   6 comments
Some of the stuff that's going on around us makes me want to cry...
Different ways to present data
Programmable Logic DesignLine Blog  
2/24/2009   Post a comment
Here's an amazingly cool website that shows a wealth of different ways in which data can be graphically presented for maximum effect.
Robot theme park to break ground
Industrial Control DesignLine Blog  
2/24/2009   1 comment
Robot Land, a robot theme park housing entertainment, education and corporate facilities expects to be open to the public by 2013.
Analysis: BDTI benchmarks the CEVA-TeakLite-III
Design How-To  
2/24/2009   Post a comment
The CEVA-TeakLite-III turns in strong performance in a small, low-power package. Its 32-bit capabilities are also notable.
OLEDs fare well in current downturn
Product News  
2/24/2009   Post a comment
Active-matrix organic light-emitting diodes (AM OLEDs) have emerged as a diamond in the rough for the embatted display and electronics industries.
6-Watt LED driver with integrated DC-DC boost converter focuses on larger LCD panel backlighting applications
Product News  
2/24/2009   Post a comment
ON Semiconductor has introduced a new 6 W LED driver with an integrated, high-power DC-DC boost converter and on-chip diagnostics to maximize efficiency in larger, general purpose LCD panel backlighting applications.
How to control analog output from a CPLD using a pulse width modulator
Design How-To  
2/24/2009   2 comments
This article shows how a CPLD can replace a digital-to-analog converter, allowing it to drive an audio speaker or control things like LED intensity, motor speed, and servo position.
Optoelectronics set to benefit from BiCMOS manufacturing developments
Product News  
2/24/2009   Post a comment
Analog/mixed-signal foundry, X-FAB Silicon Foundries, has added several new options to its 0.6micrometer BiCMOS technology platform, two of which X-FAB boasts are 'first-of-a-kind capabilities' for the optoelectronics market.
Texas Instruments : Hot-swap managers suit 3 to 20 V voltage rails
Product News  
2/24/2009   Post a comment
Texas Instruments has introduced three hot-swap managers that help protect against over currents for voltage rails between 3 and 20 V and an operating current of up to 5 A.
16bit industrial DAC exemplifies integration trend
Product News  
2/24/2009   Post a comment
A 16bit, industrial digital-to-analog converter that incorporates a voltage-output amplifier, current-output amplifier, and pass transistors on the same silicon, is the latest offering from Maxim.
BOARDS: Direct Digital Synthesis Board offers higher speed, powerful signal generation
Product News  
2/24/2009   Post a comment
dSPACE has added new APU slave interface, enlarged memory, and new DSPs
Microchip : Low-voltage EEPROM offers two write-protect options
Product News  
2/24/2009   Post a comment
Microchip announces a series of I2C EEPROM devices that claim the lowest operating voltage available on the market.
HomePlug SoC set to debut at CeBIT
News & Analysis  
2/24/2009   Post a comment
SPiDCOM Technologies, a fabless chip group focusing on ICs and Linux-based software bundles for broadband access and home networks, is set to unveil its next generation HomePlug AV SoC at CeBIT, in Hannover, which kicks off March 3rd.
Après le laptop, voici le plugtop à $50
News & Analysis  
2/24/2009   Post a comment
Marvell Technology Group Ltd. a annoncé l'initiative appelée Plug Computing et un kit de développement à $99 utilisant son processeur Sheeva à 1,2GHz basé sur un coeur ARM.
Simplified clock generator architecture reduces cycle time and complexity in networking and communications systems
News & Analysis  
2/24/2009   Post a comment
Analog Devices has introduced a clock generator that simplifies clock design and reduces the need for oscillators in multi-standard networking and communications infrastructure systems, designated AD9551.
High-performance walk test solution simplifies quality assurance in mobile radio networks
News & Analysis  
2/24/2009   Post a comment
The ROMES2GO walk test solution from Rohde & Schwarz makes it easy to perform on-site coverage measurements of mobile radio networks.
Sinking stocks complicate high-tech recovery
News & Analysis  
2/24/2009   Post a comment
Many high-tech stocks have fallen by as much as 80 percent to 90 percent in the last 12 months, crushing their market value and potentially complicating recovery efforts by these companies, some of which may need to tap the investment markets for funds as cash hoards become depleted.
Sematech, TOK to devise EUV resists
News & Analysis  
2/24/2009   Post a comment
Chip-making consortium Sematech has signed a letter of intent with Japan's Tokyo Ohka Kogyo Co. Ltd. (TOK) to devise resists for extreme ultraviolet (EUV) lithography.
Analysis: Japan's electronics giants face inevitable breakup
News & Analysis  
2/24/2009   Post a comment
In order to survive what's now being billed as the worst global economic depression in decades, Japan's Big-5 high-tech companies will have to accelerate their reorganization efforts and merge, shutter or spin off non-profitable semiconductor, hard disk drive and system LSI businesses.
Top seven challenges for EUV litho
News & Analysis  
2/24/2009   Post a comment
During a presentation, Takaharu Miura, general manager for the 2nd Development Department Headquarters for Nikon Corp. (Tokyo), listed the top seven challenges for EUV:
<<   <   Page 3 / 17   >   >>


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Book Review: Deadly Odds by Allen Wyler
Max Maxfield
8 comments
Generally speaking, when it comes to settling down with a good book, I tend to gravitate towards science fiction and science fantasy. Having said this, I do spend a lot of time reading ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
13 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).