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posted in February 2010
<<   <   Page 13 / 13
High brightness blue and green 5mm through-hole LEDs
Product News  
2/1/2010   Post a comment
Avago Technologies launched a new series of high brightness blue and green 5mm through-hole LEDs for use in electronic sign and signal applications.
Tensilica targets high quality audio and smartphones with HiFi EP DSP core
Product News  
2/1/2010   Post a comment
Tensilica introduced HiFi EP, a superset of the HiFi 2 architecture that is optimized for simultaneous multichannel codec support and continuously expanding audio pre- and post-processing.
Full-year chip sales fell 9% in 2009, says SIA
News & Analysis  
2/1/2010   1 comment
Global semiconductor sales were $226.3 billion in 2009, a decline of 9 percent from 2008 when sales were $248.6 billion, according to the Semiconductor Industry Association (SIA). The full-year decline was as had been expected in the last month but much less than had been predicted in the first months of 2009.
PC, phone demand strong in 2010, says SIA's Scalise
News & Analysis  
2/1/2010   Post a comment
Units sales of PCs and cellphones will grow in the low-to-mid teens of percent in 2010, providing a "solid platform for chip sales," according to George Scalise, president of the Semiconductor Industry Association.
Advanced probes, instrument take digital test console to full PCI Express 3.0 evaluation regime
Product News  
2/1/2010   Post a comment
Advanced probes, instrument take digital test console to full PCI Express 3.0 evaluation regime
Over-the-air Testing of MIMO Mobile Terminals (Part 3 of 3)
Design How-To  
2/1/2010   Post a comment
This white paper discusses the issues related to testing of multiantenna multiple-input, multiple-output mobile terminals
The differential-signal advantage for communications system design
Design How-To  
2/1/2010   Post a comment
Understand how differential signal chains and architectures can improve system performance in challenging applications
Fundamentals of designing with MOSFET power switches
Design How-To  
2/1/2010   2 comments
Understand how to use these basic, versatile, essential discrete components
Nujira starts to roll out Coolteq.L silicon
News & Analysis  
2/1/2010   Post a comment
Nujira Ltd. (Cambridge, England) has said it intends to demonstrate the world's most efficient RF power amplifier for 3G/4G at Mobile World Congress which takes place in Barcelona, Feb. 15 to 18. The demonstration is based on Nujira's Coolteq.L silicon.
Graphics chips shipments to rise 27% in 2010, says analyst
News & Analysis  
2/1/2010   Post a comment
Some 544 million graphics chips will ship in 2010, up 27.9 percent on the 425.4 million shipped in 2009, according to market analyst Jon Peddie Research (Tiburon, Calif.).
Austriamicrosystems extends design collaboration with Cadence for mixed-signal SoC designs
News & Analysis  
2/1/2010   Post a comment
austriamicrosystems has broadened the company's deployment of electronic design technology from Cadence Design Systems Inc., by selecting the Cadence Encounter Digital Implementation System for the digital part of its designs.
D&R launches IP_SoC 2010 World Tour
News & Analysis  
2/1/2010   Post a comment
Design & Reuse SA (D&R), a global collaboration network for sharing system-on-chip design resources, announced it is exporting its IP-SoC conference and exhibition concept to the world.
Synfora adds C++ support to PICO HLS tools
Product News  
2/1/2010   Post a comment
Synthesis tool vendor Synfora Inc. announced it has extended support for C++ language in its PICO Extreme and PICO Extreme FPGA C synthesis tools.
Black Sand acquires power amplifier IP from Silicon Labs
News & Analysis  
2/1/2010   Post a comment
Black Sand Technologies Inc. (Austin, Texas), a specialist in CMOS power amplifier technology for wireless applications, has said it has acquired a patent portfolio related to CMOS power amplifiers from Silicon Laboratories Inc. (Austin, Texas).
Altera to offer partial reconfiguration at 28-nm
Product News  
2/1/2010   Post a comment
FPGA vendor Altera plans to introduce several innovations for its first 28-nm chips, including partial reconfiguration, 28-gigabit-per-second transceivers and embedded hard intellectual property blocks, the company said. b
Rumor mill: B'com, Cavium eye Teknovus acquisition
News & Analysis  
2/1/2010   1 comment
Chatter in the rumor mill says Broadcom Corp. or Cavium Networks may be about to acquire startup Teknovus Inc. for its passive optical networking technology, just as Marvell is expected to roll out its first PON products this week.
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