SPIE: EUV sources behind schedule News & Analysis 2/28/2011 4 comments Extreme ultraviolet (EUV) lithography is making progress, but the power source for the technology is behind schedule, warned keynote speakers at the SPIE Advanced Lithography conference here.
Intel: 450-mm wafers must wait on 10-nm Research 2/28/2011 12 comments The 10-nm process node appears to be the ideal point for the adoption of manufacturing on 450-mm diameter wafers, according Leonard Hobbs, head of research for Intel Ireland. Speaking at the Industry Strategy Symposium here (ISS Europe) he also indicated that the transition could not come sooner and could be pushed later, depending on the efficacy of industry collaboration.
CUDA 4.0 aims to ease parallel programming News & Analysis 2/28/2011 Post a comment Version 4.0 of Nvidia's CUDA toolkit for developing parallel applications using the company's graphics processors includes new features designed to make parallel programming easier and enable more developers to port their applications to graphics processor units.
Synopsys says IP supports PCIe 3.0 News & Analysis 2/28/2011 Post a comment EDA and IP vendor Synopsys its DesignWare IP supports the final version of the PCI Express 3.0 base specification recently released by the PCI Special Interest Group.
Optimal team sizes for chip projects Blog 2/28/2011 Post a comment Chip design projects demand a threshold number of engineers to meet schedule targets, yet, there's a point at which adding resources yields little, if any, additional development throughput.
ISS: ST's Bozotti cheers for European chips News & Analysis 2/28/2011 10 comments Carlo Bozotti, president and chief executive officer of STMicroelectronics, provided a keynote address to the Industry Strategy Symposium (ISS Europe) held here by industry body SEMI, which contained a commitment to European chip making – but only just.
The case against Thunderbolt News & Analysis 2/28/2011 21 comments Intel's Thunderbolt is leaving some people feeling burned the chip giant is launching a new interface rather than giving its full attention to an existing one—USB.
Evolution of manufacturing closure for advanced nodes (Part 2) Design How-To 2/28/2011 Post a comment Starting at the 40/45nm design node, DRC/DFM closure emerged as a significant new challenge to IC designers. No longer could manufacturing concerns be effectively handled with the traditional design-then-verify flow. This trend is expected to continue and worsen at the 32nm and 22nm nodes, where manufacturing closure may become a serious bottleneck in design schedules.
Startup rolls complementary litho News & Analysis 2/28/2011 6 comments At the SPIE Advanced Lithography conference here, maskless startup Multibeam Corp. will outline more details about its ongoing efforts to commercialize its so-called Complementary E-Beam Lithography (CEBL) technology in the market.
ST boosts bipolar power transistor current by 50 Percent Product News 2/27/2011 Post a comment The 3STR1630 NPN transistor from STMicroelectronics is the first member in a new family of high-performance bipolar power transistors manufactured using a new low-voltage planar technology. This technology incorporates a double-metal process that allows the cell density to be almost doubled without requiring the use of sophisticated photolithography equipment. In addition to increasing the current capability by about 50 percent for the same die size, the double-metal process enables transistors
SYSGO's SSV RTOS PikeOS offers Android Personality Product News 2/26/2011 Post a comment SYSGO has announced that its Safe and Secure Virtualization (SSV) product PikeOS now supports the Android operating system as a guest OS, or 'Personality'. PikeOS technology enables Android apps to run concurrently with other executive environments having more real-time, safety and/or security constraints on the same hardware device, and allows strict partitioning between critical and non-critical applications.
Nvidia, Atmel, STMicro found in Motorola Xoom News & Analysis 2/26/2011 19 comments In addition to a dual-core Tegra 2 applications processor from Nvidia, Motorola Mobility's Xoom media tablet includes a four-chip touch screen controller solution from Atmel and MEMS sensors from AKM Semiconductor, Kionx, STMicroelectronics and Bosch Sensortec, according to IHS iSuppli.
Change shuffles PCB EDA vendor rankings News & Analysis 2/25/2011 8 comments Zuken vaulted to the No. 2 position in sales among providers of printed circuit board EDA tools as the result of a clarification of the firm's revenues, according to Gary Smith EDA.
Security penetrates the clouds News & Analysis 2/25/2011 9 comments Information technology security provider SafeNet recently adapted its encryption, authentication and virtualization security suites to run on cloud computers.
IR to buy CHiL for $75 million News & Analysis 2/25/2011 Post a comment International Rectifier Corp. has agreed to acquire CHiL Semiconductor Corp. (CHiL) for $75 million in cash, subject to working capital adjustments.
Report from EDSFair 2011 Blog 2/25/2011 Post a comment At this year's ESDFair, EVE SA (Palaiseau, France) conducted a survey to determine chip design and verification trends in Japan. Check out what attendees told EVE's booth staff!
On Semi to expand Oregon fab News & Analysis 2/24/2011 8 comments On Semiconductor Corp. plans to invest more than $30 million to expand capacity and capabilities at its 8-inch wafer manufacturing facility in Gresham, Oregon.
Mentor beats estimates, eyes $1 billion mark News & Analysis 2/24/2011 5 comments EDA vendors Mentor Graphics and Magma Design Automation reported quarterly results that beat consensus analysts' expectations, with Mentor posting record annual revenue and saying it expects to become a $1 billion company in the current fiscal year.
Applied beats Street News & Analysis 2/24/2011 Post a comment Applied Materials Inc. reported sales of $2.69 billion for the first quarter, compared to $2.89 billion in the previous quarter and $1.85 billion a year ago.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments