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posted in February 2013
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Achronix is shipping 22nm Speedster22i FPGAs
Product News  
2/25/2013   Post a comment
Achronix Semiconductor Corporation has begun shipping their industry-leading Speedster22i HD1000 FPGAs to customers.
Full production of entire Xilinx Zynq-7000 All Programmable SoC family
Product News  
2/25/2013   Post a comment
The smartest solution with proven performance, lowest power and unmatched productivity.
Cypress announces revolutionary Gen5 TrueTouch controllers
Product News  
2/25/2013   Post a comment
In addition to unmatched performance with regard to noise, new devices enable in-cell stack-ups and deliver world’s best waterproofing.
Rise of smartphone reshapes cellphone IC rankings
Blog  
2/25/2013   2 comments
The competitive landscape of the handset core IC market has shifted dramatically over the past five years (though Qualcomm is still on top).
Qualcomm revs Gobi for LTE
Product How-To  
2/25/2013   2 comments
Fabless chip giant shows Gobi modem running LTE at up to 150 Mbits/s over 20 MHz and talks about software for the Internet of Things.
SystemVerilog - It’s official and it’s free
Blog  
2/25/2013   Post a comment
Accellera has announced that the revised version of the IEEE 1800™ "Standard SystemVerilog is now available through the IEEE Get Program…
Identify the best power supply for a test application
Design How-To  
2/25/2013   Post a comment
Power supplies are relatively simple, single-function DC devices designed to output controlled voltages, but there is much more to them than this description would suggest.
Dual layer helps ReRAM reach mainstream capacity
Design How-To  
2/25/2013   4 comments
Metal-oxide resistive RAM has reached close to the mainstream for array size with a two-layer, 32-Gbit nonvolatile memory prototype.
Will Android Out Cool Apple?
Blog  
2/25/2013   8 comments
Is Samsung timely or simply lucky with Galaxy? And why can't Nokia's Windows Mobile phones catch fire?
Using 3rd party IP in ASIC/SoC design
Design How-To  
2/25/2013   Post a comment
This article outlines some of the best practices for using the 3rd Party IP ecosystem as well as some of the common challenges in integrating and using 3rd party IPs in today’s high-end ASIC/SoCs.
Broadcom joins small-cell basestation fray at MWC
Design How-To  
2/25/2013   1 comment
Broadcom becomes the latest chip maker to announce SoCs competing for the emerging market of small-cell base stations.
What’s under the hood of Sony's PS4?
News & Analysis  
2/25/2013   9 comments
Although Sony did not show the PS4 game console, the spec sheets provide a glimpse of what’s inside in each unit.
ARM to demo GPU-compute at MWC
Design How-To  
2/25/2013   1 comment
Processor IP licensor plans to demonstrate a face detection GPU-compute application running on a Mali processor at the Mobile World Congress.
ARM sets next GPU target at 240 million units
Design How-To  
2/25/2013   Post a comment
Mali GPU shipments are expected to exceed 240 million units in 2013, a growth of about 60 percent from more than 150 million units shipped in 2012, according to ARM executives in the media processing division.
NOR flash market expected to contract again
Design How-To  
2/25/2013   2 comments
After contracting in 2012, the NOR flash market is expected to shrink again in both 2013 and 2014 as handsets turn to NAND.
Big Data streamlines fabs
News & Analysis  
2/25/2013   2 comments
Streamlined analytics in Microsoft's structured query language cut processing time for wafer fab data at AMD by 90 percent plus boost energy efficiency 10-times at Samsung.
Intel upgrades 32-nm SoC for smartphones
News & Analysis  
2/25/2013   5 comments
Intel will show an upgraded 32-nm processor for smartphones at Mobile World Congress and talk about an upcoming new 22-nm Atom core and SoC.
Dialog on the acquisition trail
Design How-To  
2/24/2013   4 comments
Mixed-signal fabless chip company is on the hunt for acquisitions, investment opportunities and whatever else is the best way to use its cash pile, which stood at $312 million as of the end of 2012.
Product How-To: Adding Class D audio to embedded systems in an unconventional way
Design How-To  
2/23/2013   2 comments
It's a snap to add Class D audio to any 32-bit embedded product using easy-to-use tools, such as those for the SiM3U1xx MCU family.
FPGA design heads into The Cloud
Design How-To  
2/22/2013   2 comments
This article examines the benefits and potential pitfalls of cloud computing in FPGA design from a practical, day-to-day viewpoint.
Ethernet's 40th birthday sparks reunion at PARC
Blog  
2/22/2013   4 comments
Bob Metcalfe returned to Xerox PARC to promote an event celebrating the 40th anniversary of Ethernet being defined there—and met an old pal in the process.
London Calling: Security technology takes time
Blog  
2/22/2013   1 comment
Adding hardware-intrinsic security to a secure microcontroller takes time, but will be worth it in the end, according to NXP.
DESIGN West: Livin' La Vida Mobile
News & Analysis  
2/22/2013   1 comment
MLove Confestival founder Harald Neidhardt foresees "empathetic" electronics, which adapt their functions users' environments.
Anyone for a free breakfast next week?
Blog  
2/22/2013   Post a comment
Next week will be an exciting week as I head down to San Jose for the functional verification event of the year – DVCon. Catch me moderating a breakfast panel on Tuesday 7:00am…
Emulation Whack-a-Mole
Blog  
2/22/2013   2 comments
The FPGA prototyping and emulation market seems to be like Whack-a-Mole. As soon as one company is purchased, another one appears - this time Reflex CES...
Non-contacting rotary position sensors offer rotational life of 50 million cycles and more
Product News  
2/22/2013   Post a comment
Bourns has expanded its line of non-contacting rotary position sensors for operation in harsh environments.
Vishay integrates MEPIC resistor on a PCB substrate
Product News  
2/22/2013   Post a comment
Device offers joule or flash ignition for fast firing times down to 250 µs, and features firing energy down to 1.5 mJ.
And that's when I said "Doh!"
Engineering Pop Culture!  
2/22/2013   24 comments
You would not believe the wonderful little retro portable TV I just discovered at Mock Electronics.
Data compression IP reduces 3G/4G system costs
Product News  
2/22/2013   Post a comment
IDT’s patent-protected compression IP reduces system cost by enabling the use of low cost fiber to connect RRUs to baseband unit in wireless infrastructure.
ARM, Synopsys tape-out 20-nm Mali GPU
Design How-To  
2/22/2013   Post a comment
ARM, Synopsys tape-out 20-nm version of Mali T658 GPU demonstrating double-patterning support throughout the design flow.
AD5689R 16-bit D/A converter targets wide application range
Product News  
2/22/2013   Post a comment
With relative accuracy of ±2-LSB INL, 2-ppm/°C 2.5-V reference, and space saving packages, ADI’s nanoDAC+ converters allow analog designers to address a wider range of applications without having to trade off performance for footprint.
Toshiba tweak reduces SRAM standby power by 85%
Design How-To  
2/22/2013   2 comments
Japanese memory maker has developed a technique that could save power consumption in processors with embedded SRAM for applications such as smartphones.
Slideshow: ISSCC spotlights nanotubes, wireless comms
News & Analysis  
2/22/2013   9 comments
Carbon nanotubes, video processing, 60 GHz and processors featured among the highlights from this year's ISSCCC presentations.
Teardown: LED light shrinks size, cost with non-isolated driver
Design How-To  
2/22/2013   30 comments
What has changed in LED bulb design to allow the steep drop in prices that is happening? Tearing apart a LED bulb provides allows a look at some of the design trends in LED lighting, such as how the LEDs are placed within the bulb and what driver architecture is used.
Yoshida in NY: Sony snaps out of NIH syndrome
Blog  
2/22/2013   9 comments
For years Sony believed in the myth that the instinct to develop proprietary technologies or formats is deeply ingrained in the company’s DNA.
Qualcomm integrates RF for world LTE phone
Product How-To  
2/22/2013   2 comments
Fabless giant aims to ease the job of creating a phone that can roam LTE’s 40 global spectrum bands.
Apple iWatch, Google Glasses to lead wearable computing surge
Semi Conscious  
2/21/2013   6 comments
The rumored Apple smart watch and the augmented reality glasses being developed by Google are expected to be just the beginning for wearable gadgets.
My hat's off to Toshiba
Engineering Pop Culture!  
2/21/2013   12 comments
So many product test videos show the products only in a good light, so the fact that some of these videos show the products failing puts an interesting spin on things.
Xilinx' fully adaptive Gbps-class PtP microwave modem IP for backhaul apps
Product News  
2/21/2013   Post a comment
1024QAM microwave modem IP solution combines fully programmable hardware and API software for next-generation intelligent broadband wireless solutions.
Qualcomm dominates LTE modem chip market
Design How-To  
2/21/2013   2 comments
Qualcomm held 86 percent of the FDD-LTE modem market in 2012 and is set to continue its domination in 2013, according to Forward Concepts.
Reflex CES demos SoC FPGA-based system-on-module (SoM)
Product News  
2/21/2013   Post a comment
Demonstration at Embedded World 2013 (February 26-28, 2013, Nuremberg, Germany) highlights prototyping platform, data recorders, & customizable rugged systems.
Firmware developer's essential reading list
Blog  
2/21/2013   1 comment
Plenty of great sources exist for information on firmware design. Here are some of the best.
TI spins motors in minutes with sensorless, brushless DC motor drivers
Product News  
2/21/2013   3 comments
Integrated motor drivers accelerate product design by eliminating external components and software development.
Characterizing mixed-signal ICs for production
Design How-To  
2/21/2013   Post a comment
This article focuses on mixed-signal device characterization, examining statistical techniques that ensure repeatability of test results, including testing over an IC’s rated temperature extremes.
STMicroelectronics launches LIS3MDL single-chip magnetometer
Product News  
2/21/2013   Post a comment
High-performance magnetometer completes range of magnetic, acceleration and gyroscopic sensors delivering design flexibility.
ADLINK embedded systems support multiple operating systems
Product News  
2/21/2013   Post a comment
ADLINK’s latest Smart Panel series provides high-value cost/performance with a powerful CPU and multiple OS support.
Tessera, Amkor argue over $130-million
Design How-To  
2/21/2013   Post a comment
Packaging companies continue to argue even after an arbitration ruling on a now-terminated patent license agreement.
Performing audio synthesis, noise reduction in cars
Design How-To  
2/21/2013   Post a comment
Audio optimization has become a mainstream issue for today’s auto designers. From compensating for the absence of engine noise to keeping sound levels down in the vehicle interior, audio synthesis and noise suppression solutions can help.
Intel chooses Dialog PMIC for 'Bay Trail' processor
Design How-To  
2/21/2013   Post a comment
Anglo-German fabless chip company announces its DA6021 power management IC has been selected for an Atom processor platform for tablet computers.
Mentor buys MontaVista automotive infotainment software unit
Design How-To  
2/21/2013   2 comments
EDA and embedded software vendor says deal gives it a leg up in the market for in vehicle infotainment system development.
<<   <   Page 2 / 7   >   >>


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