Diverse IP cranks noise control headaches News & Analysis 3/25/2002 Post a comment If you ask designers of high-speed printed-circuit boards about signal integrity, chances are they know all about the interactions of "aggressors" and "victims" and the nasty things that can happen to logic signals clocked at near-gigahertz rates.
IXYS to appeal injunction of products based on Samsung-IR settlement News & Analysis 3/25/2002 Post a comment SANTA CLARA, Calif.--Power semiconductor supplier IXYS Corp. here announced a court decision binding the company to an injunction entered in a settlement between Samsung Electronics Co. Ltd. and International Rectifier Corp. Samsung in South Korea is a major silicon foundry supplier to IXYS, and the decision affects certain MOSFET devices sold by the company in the U.S. market.
32-bit controllers hit the mainstream News & Analysis 3/22/2002 Post a comment Once confined to a few niche markets, microcontroller vendors are suddenly clamoring to take the lead in offering general-purpose MCUs based on 32-bit processor cores a trend that promises to raise the performance bar, at minimal cost, for a range of embedded systems.
TI's analog business hits a bump News & Analysis 3/22/2002 Post a comment Texas Instruments Inc. has grown accustomed to sitting atop the analog IC and DSP pecking order. But now the company's No. 1 analog status is endangered, due principally to its overexposure to the electronics industry's communications sector, which fell into a well in 2001.
Applied's optimism gains momentum as execs brief analysts News & Analysis 3/22/2002 Post a comment SANTA CLARA, Calif. -- The outlook for semiconductor capital equipment seems to be getting better by the minute. Applied Materials Inc.'s 2002 outlook turned from "cautiously optimistic" and somewhat guarded to slightly more upbeat between the time of the company's annual meeting on Thursday morning and the afternoon briefing for financial analysts.
China to build two fabs per year, but challenges exist, says Applied VP News & Analysis 3/22/2002 Post a comment SANTA CLARA, Calif. -- Applied Materials Inc. is expecting China's aggressive chip makers to build at least two new wafer fabs per year in the near term this decade and the semiconductor equipment giant is aiming to push its China revenues to $1 billion by 2005, an executive told analysts during a briefing here.
A Great DATE in the City of Lights for Chip Designers Design How-To 3/22/2002 Post a comment ParisCity of Lights, fine food, great wine, and...leading-edge chip-design activities? Certainement, mon ami. At the annual DATE conference in Paris Jim Lipman, TechOnLine's roving Content Director, finds out that Paris in the springtime is, indeed, an excellent place to learn about the latest EDA and SoC products.
Applied announces two-for-one stock split News & Analysis 3/21/2002 Post a comment SANTA CLARA, Calif.--During an annual shareholders' meeting here today, Applied Materials Inc. announced a two-for-one stock split. The split is expected to be distributed on April 16 to shareholders of record as of April 1.
Dialog Semi expects to recoup some money from U.K. foundry in IR purchase News & Analysis 3/21/2002 Post a comment KIRCHHEIM, Germany -- Dialog Semiconductor Plc today said it will receive about 6 million euros ($5.3 million) from International Rectifier Corp.'s acquisition of European Semiconductor Manufacturing Ltd., a sub-micron silicon foundry company based in Wales. On Monday, U.S.-based IR announced it was buying the assets of ESM for $81 million in cash to expand its production of mixed-signal and power semiconductors (see March 13 stor
Applied opens bigger development fab for 100-nm, below processes News & Analysis 3/21/2002 Post a comment SUNNYVALE, Calif. -- While many semiconductor makers are shutting down plants in California, Applied Materials Inc. here today bucked the trend and announced a new process-development wafer fab in Silicon Valley to pave the way for production of next-generation ICs at the 100-nm (0.10-micron) and below technology nodes.
Micron joins Samsung in the DDR400 game News & Analysis 3/20/2002 Post a comment A week after DDR400 samples of Samsung Electronic Co. were shown at the CeBIT computer show in Germany, Micron Technology Wednesday announced it has shipped its own DDR400 samples targeted for the PC market.
Fujitsu expected to spin off LCD division News & Analysis 3/20/2002 Post a comment Fujitsu Ltd. is imminently expected to announce that it will spin off its LCD division and combine it with an existing Yonago Fujitsu Ltd. subsidiary. A Fujitsu spokesman in the U.S. said he couldn't comment.
Fujitsu along with many other Japanese active matrix LCD vendors has been struggling to compete with the Korean and Taiwan FPD juggernauts. Toshiba Corp. and Matsushita two weeks ago signed an agreement to combine their thin film transistor LCD operations. NEC a year ago opted to outsource
JMAR expects 40% sales grow in 2002 driven by X-ray litho demand News & Analysis 3/20/2002 Post a comment SAN DIEGO--JMAR Technologies Inc. today predicted its revenues would grow almost 40% this year to about $26 million due to a substantial increase in demand for X-ray lithography systems. JMAR also said it expects to report a 5% sales drop to $18.7 million for 2001 because of the downturn in capital equipment spending.
QDR SRAM group says JEDEC spec supports future chip densities News & Analysis 3/20/2002 Post a comment SAN JOSE -- The five development partners promoting Quad Data Rate (QDR) SRAMs today announced JEDEC approval of industry packaging standards for QDRII and Double Data RateII (DDRII) static RAM architectures. These devices are aimed at serving high-speed communications and are competing with rival format, called "SigmaRAM."
Intersil/Elantec merger to create new force in analog News & Analysis 3/20/2002 Post a comment
The new Intersil faces tough challenges in all its markets, Beyer said. In power management, there is Maxim and Linear Technology. In flat-panel drivers, there's Analog Devices and National Semiconductor. In optical storage, Intersil competes against Sony's internal development. And in WLAN, there's Agere.
Sirenza invests $7.5 million in InGaP/InP foundry News & Analysis 3/20/2002 Post a comment SUNNYVALE, Calif.--Communications chip supplier Sirenza Microdevices Inc. here today announced a $7.5 million equity investment in Global Communication Semiconductors Inc., a Torrance, Calif.-based foundry company specializing in indium-gallium-phosphide (InGaP) and indium-phosphide (InP) heterojunction bipolar transistor (HBT) technologies.
Harmonic balance simulation speeds RF mixer design Design How-To 3/20/2002 Post a comment Harmonic-balance simulators and electromagnetic analysis tools are becoming essential to RF mixer design. New balun structures for RFICs are key to matching impedances at high GHz-requencies. An AWR scientist offers some pointers on mixer-design using contemporary modeling tools.*
ATI posts 6% sequential sales growth and $3 million loss in quarter News & Analysis 3/20/2002 Post a comment MARKHAM, Ontario--Graphics and video chip supplier ATI Technologies Inc. today reported a 6.4% sequential increase in revenues to $266 million in the company's fiscal second quarter, ended Feb. 28, compared to $250 million in the prior three-month period. ATI posted a net loss of $3 million for the period compared to a net loss of $10.3 million in prior quarter.
Chip gear index continues slow climb with higher orders, billings News & Analysis 3/19/2002 Post a comment SAN JOSE -- Orders and billings for chip production systems continued to climb out of the basement in February with North American-based suppliers posting a 0.87 book-to-bill ratio last month, said the Semiconductor Equipment and Materials International (SEMI) trade group today. A ratio of 0.87 means suppliers were receiving $87 worth of new orders for every $100 of products billed.
Proof of cancer link in fab workers still missing, says SIA panel News & Analysis 3/19/2002 Post a comment SAN JOSE -- An advisory committee has concluded there is no affirmative evidence of increased cancer risk in wafer fab workers, but the panel also said there is insufficient data to decide whether or not exposure to chemicals and other hazardous materials in chip plants could be a factor in cancer cases.
IC fab capacity shrinks as chip makers close older plants News & Analysis 3/19/2002 Post a comment SAN JOSE -- Worldwide IC wafer processing capacity declined 3.4% in the fourth quarter of 2001 from an all-time high in Q3 last year as integrated circuit manufacturers accelerated the closing of older and obsolete fabrication plants, according to new data from the Semiconductor Industry Association.
FCRAM 101 Part 1: Understanding the Basics News & Analysis 3/19/2002 Post a comment Memory architectures are becoming a bottleneck in today's networking designs. The FCRAM architecture has emerged as one solution to this problem. Part 1 of this two-part set takes a detailed look at the FCRAM architecture.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.