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posted in March 2002
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Diverse IP cranks noise control headaches
News & Analysis  
3/25/2002   Post a comment
If you ask designers of high-speed printed-circuit boards about signal integrity, chances are they know all about the interactions of "aggressors" and "victims" and the nasty things that can happen to logic signals clocked at near-gigahertz rates.
IXYS to appeal injunction of products based on Samsung-IR settlement
News & Analysis  
3/25/2002   Post a comment
SANTA CLARA, Calif.--Power semiconductor supplier IXYS Corp. here announced a court decision binding the company to an injunction entered in a settlement between Samsung Electronics Co. Ltd. and International Rectifier Corp. Samsung in South Korea is a major silicon foundry supplier to IXYS, and the decision affects certain MOSFET devices sold by the company in the U.S. market.
Low-k war rages despite slow progress; Applied plans 'Black Diamond II'
News & Analysis  
3/22/2002   Post a comment
SANTA CLARA, Calif. -- Low-k dielectric technology is probably one of the hottest-contested growth potentials in the chip industry that's still stuck in low gear, when it comes to actually generating sales.
32-bit controllers hit the mainstream
News & Analysis  
3/22/2002   Post a comment
Once confined to a few niche markets, microcontroller vendors are suddenly clamoring to take the lead in offering general-purpose MCUs based on 32-bit processor cores — a trend that promises to raise the performance bar, at minimal cost, for a range of embedded systems.
TI's analog business hits a bump
News & Analysis  
3/22/2002   Post a comment
Texas Instruments Inc. has grown accustomed to sitting atop the analog IC and DSP pecking order. But now the company's No. 1 analog status is endangered, due principally to its overexposure to the electronics industry's communications sector, which fell into a well in 2001.
Sony expected to use IBM architecture in PlayStation 3
News & Analysis  
3/22/2002   Post a comment
Sony will use IBM Microelectronics' Cell architecture for its PlayStation 3 launch slated for next year, according to sources close to the collaboration.
AXT to supply InGaN LEDs to Agilent for cell-phone backlighting systems
News & Analysis  
3/22/2002   Post a comment
FREMONT, Calif. -- AXT Inc. here today announced it will manufacture and supply indium-gallium-nitride (InGaN) LEDs to Agilent Technologies Inc. for use in cellular-phone backlighting systems and other applications.
Applied's optimism gains momentum as execs brief analysts
News & Analysis  
3/22/2002   Post a comment
SANTA CLARA, Calif. -- The outlook for semiconductor capital equipment seems to be getting better by the minute. Applied Materials Inc.'s 2002 outlook turned from "cautiously optimistic" and somewhat guarded to slightly more upbeat between the time of the company's annual meeting on Thursday morning and the afternoon briefing for financial analysts.
Fujitsu confims it will spin off its LCD operation
News & Analysis  
3/22/2002   Post a comment
Fujitsu Ltd. on Friday confirmed it was spinning off its LCD operation into a separate subsidiary, Fujitsu Display Technologies Corp., which will begin business June 1.
IC tester segment sees hope in above-parity book-to-bill
News & Analysis  
3/22/2002   Post a comment
SAN JOSE -- Suppliers of automatic test equipment (ATE) are beginning to see some positive signs after a horrific year in 2001, but many vendors believe the real growth will not occur until 2003.
China to build two fabs per year, but challenges exist, says Applied VP
News & Analysis  
3/22/2002   Post a comment
SANTA CLARA, Calif. -- Applied Materials Inc. is expecting China's aggressive chip makers to build at least two new wafer fabs per year in the near term this decade and the semiconductor equipment giant is aiming to push its China revenues to $1 billion by 2005, an executive told analysts during a briefing here.
A Great DATE in the City of Lights for Chip Designers
Design How-To  
3/22/2002   Post a comment
Paris—City of Lights, fine food, great wine, and...leading-edge chip-design activities? Certainement, mon ami. At the annual DATE conference in Paris Jim Lipman, TechOnLine's roving Content Director, finds out that Paris in the springtime is, indeed, an excellent place to learn about the latest EDA and SoC products.
Applied announces two-for-one stock split
News & Analysis  
3/21/2002   Post a comment
SANTA CLARA, Calif.--During an annual shareholders' meeting here today, Applied Materials Inc. announced a two-for-one stock split. The split is expected to be distributed on April 16 to shareholders of record as of April 1.
Micron sales rise 52% from prior quarter due to 70% price increase
News & Analysis  
3/21/2002   Post a comment
OISE, Idaho--Micron Technology Inc. today reported a 52% sequential increase in revenues to $645.9 million in the company's second fiscal quarter, ended Feb. 28, compared to $423.9 million in the prior three-month period.
Apogee, STMicro team up to offer all-digital amplifier chips for audio
News & Analysis  
3/21/2002   Post a comment
NORWOOD, Mass.--Apogee Technology Inc. here today announced a joint development agreement with STMicroelectronics to apply an all-digital amplifier technology a new series of semiconductors that replace digital-to-analog converter (DAC) circuits in audio systems.
Dialog Semi expects to recoup some money from U.K. foundry in IR purchase
News & Analysis  
3/21/2002   Post a comment
KIRCHHEIM, Germany -- Dialog Semiconductor Plc today said it will receive about 6 million euros ($5.3 million) from International Rectifier Corp.'s acquisition of European Semiconductor Manufacturing Ltd., a sub-micron silicon foundry company based in Wales. On Monday, U.S.-based IR announced it was buying the assets of ESM for $81 million in cash to expand its production of mixed-signal and power semiconductors (see March 13 stor
Applied opens bigger development fab for 100-nm, below processes
News & Analysis  
3/21/2002   Post a comment
SUNNYVALE, Calif. -- While many semiconductor makers are shutting down plants in California, Applied Materials Inc. here today bucked the trend and announced a new process-development wafer fab in Silicon Valley to pave the way for production of next-generation ICs at the 100-nm (0.10-micron) and below technology nodes.
Rolling Out VoDSL Through Loop Emulation
News & Analysis  
3/21/2002   Post a comment
With revenues declining, DSL operators need to deliver voice services. Fortunately, the BLES spec is available to provide transparent voice services without sacrificing data performance.
Broadband Method for Measuring Complex Permittivity and Permeability of Film-Shaped Materials
Design How-To  
3/21/2002   Post a comment
Accurate measurement of thin-film properties is important for characterizing devices for chip and RF applications. Juan Hinojosa and colleagues from Spain's Universidad Politécnica de Cartagena describe a broadband technique for determining the complex permittivity and permeability of isotropic film-shaped materials using coplanar waveguide (CPW) transmission-line measurements.
Micron joins Samsung in the DDR400 game
News & Analysis  
3/20/2002   Post a comment
A week after DDR400 samples of Samsung Electronic Co. were shown at the CeBIT computer show in Germany, Micron Technology Wednesday announced it has shipped its own DDR400 samples targeted for the PC market.
Micron ships 400-DDR SDRAM samples, evaluates system performance
News & Analysis  
3/20/2002   Post a comment
BOISE, Idaho--Micron Technology Inc. today announced it has shipped its first samples of DDR-400 double-data rate SDRAMs to Silicon Integrated Systems Corp. in Taiwan for qualification on platforms using the SiS648 chip set.
Without mentioning Intel, Nikon says its 193-nm scanner made first 90-nm ICs
News & Analysis  
3/20/2002   Post a comment
BELMONT, Calif.--Without naming the chip maker, Nikon Precision Inc. today announced that its 193-nm and 248-nm scanners were used along with one of its i-line steppers to produce the industry's first fully functional ICs based on a 90-nm process technology.
Fujitsu expected to spin off LCD division
News & Analysis  
3/20/2002   Post a comment
Fujitsu Ltd. is imminently expected to announce that it will spin off its LCD division and combine it with an existing Yonago Fujitsu Ltd. subsidiary. A Fujitsu spokesman in the U.S. said he couldn't comment. Fujitsu along with many other Japanese active matrix LCD vendors has been struggling to compete with the Korean and Taiwan FPD juggernauts. Toshiba Corp. and Matsushita two weeks ago signed an agreement to combine their thin film transistor LCD operations. NEC a year ago opted to outsource
Motorola transfers PLL chip series to Lansdale Semiconductor
News & Analysis  
3/20/2002   Post a comment
TEMPE, Ariz. -- Motorola Inc. today announced it has sold the rights to its MC12000 series of phase-locked loop chips to Lansdale Semiconductor Inc. here as part of the company's ongoing efforts to downsize its IC manufacturing operations.
JMAR expects 40% sales grow in 2002 driven by X-ray litho demand
News & Analysis  
3/20/2002   Post a comment
SAN DIEGO--JMAR Technologies Inc. today predicted its revenues would grow almost 40% this year to about $26 million due to a substantial increase in demand for X-ray lithography systems. JMAR also said it expects to report a 5% sales drop to $18.7 million for 2001 because of the downturn in capital equipment spending.
QDR SRAM group says JEDEC spec supports future chip densities
News & Analysis  
3/20/2002   Post a comment
SAN JOSE -- The five development partners promoting Quad Data Rate (QDR) SRAMs today announced JEDEC approval of industry packaging standards for QDRII and Double Data RateII (DDRII) static RAM architectures. These devices are aimed at serving high-speed communications and are competing with rival format, called "SigmaRAM."
Intersil/Elantec merger to create new force in analog
News & Analysis  
3/20/2002   Post a comment
The new Intersil faces tough challenges in all its markets, Beyer said. In power management, there is Maxim and Linear Technology. In flat-panel drivers, there's Analog Devices and National Semiconductor. In optical storage, Intersil competes against Sony's internal development. And in WLAN, there's Agere.
Ibis increases throughput in SOI implanter by up to 100%
News & Analysis  
3/20/2002   Post a comment
DANVERS, Mass.-- Ibis Technology Corp. today officially rolled out its new i2000 oxygen ion implanter system, which is designed to significantly increase the throughput of substrate production lines making silicon-on-insulator (SOI) wafers.
Sirenza invests $7.5 million in InGaP/InP foundry
News & Analysis  
3/20/2002   Post a comment
SUNNYVALE, Calif.--Communications chip supplier Sirenza Microdevices Inc. here today announced a $7.5 million equity investment in Global Communication Semiconductors Inc., a Torrance, Calif.-based foundry company specializing in indium-gallium-phosphide (InGaP) and indium-phosphide (InP) heterojunction bipolar transistor (HBT) technologies.
Gyrator circuit adds audio signaling to flyback supplies
News & Analysis  
3/20/2002   Post a comment
An LTC engineer adds an audio output to a server power supply. The deceptively simple feedback circuit provides a surprising degree of accuracy for both voltage and current control.
Early indicators show 'uneven' bounce from downturn's bottom, says report
News & Analysis  
3/20/2002   Post a comment
SCOTTSDALE, Ariz. -- The integrated circuit business is now staging an apparent recovery, but the initial steps in the bounce-back are extremely uneven in IC markets when revenues are broken down into major product segments, observed IC Insights Inc. in its new March newsletter released this week.
Harmonic balance simulation speeds RF mixer design
Design How-To  
3/20/2002   Post a comment
Harmonic-balance simulators and electromagnetic analysis tools are becoming essential to RF mixer design. New balun structures for RFICs are key to matching impedances at high GHz-requencies. An AWR scientist offers some pointers on mixer-design using contemporary modeling tools.*
ATI posts 6% sequential sales growth and $3 million loss in quarter
News & Analysis  
3/20/2002   Post a comment
MARKHAM, Ontario--Graphics and video chip supplier ATI Technologies Inc. today reported a 6.4% sequential increase in revenues to $266 million in the company's fiscal second quarter, ended Feb. 28, compared to $250 million in the prior three-month period. ATI posted a net loss of $3 million for the period compared to a net loss of $10.3 million in prior quarter.
Designers urged to put logic check into code
News & Analysis  
3/20/2002   Post a comment
Checking logic embedded into the code that describes hardware is set to become a mainstream part of design.
RF MEMS begin to catch up
News & Analysis  
3/20/2002   Post a comment
Devices could go into production this year as the sector catches up with optoelectronics.
Piecing Together the Bluetooth/Mobile Phone Puzzle
News & Analysis  
3/20/2002   Post a comment
Mobile phones are seen as the biggest growth sector for Bluetooth radios. Embedding this radio in a mobile architecture, however, causes big RF and software integration challenges.
Chip gear index continues slow climb with higher orders, billings
News & Analysis  
3/19/2002   Post a comment
SAN JOSE -- Orders and billings for chip production systems continued to climb out of the basement in February with North American-based suppliers posting a 0.87 book-to-bill ratio last month, said the Semiconductor Equipment and Materials International (SEMI) trade group today. A ratio of 0.87 means suppliers were receiving $87 worth of new orders for every $100 of products billed.
Kemet consolidating capacitor operations
News & Analysis  
3/19/2002   Post a comment
Kemet Corp., Greenville, SC., is consolidating the opertions of its organic capacitors and solid aluminum organic capacitors.
Proof of cancer link in fab workers still missing, says SIA panel
News & Analysis  
3/19/2002   Post a comment
SAN JOSE -- An advisory committee has concluded there is no affirmative evidence of increased cancer risk in wafer fab workers, but the panel also said there is insufficient data to decide whether or not exposure to chemicals and other hazardous materials in chip plants could be a factor in cancer cases.
IC fab capacity shrinks as chip makers close older plants
News & Analysis  
3/19/2002   Post a comment
SAN JOSE -- Worldwide IC wafer processing capacity declined 3.4% in the fourth quarter of 2001 from an all-time high in Q3 last year as integrated circuit manufacturers accelerated the closing of older and obsolete fabrication plants, according to new data from the Semiconductor Industry Association.
Canon will emphasize partnerships in lithography to reach No. 1 position
News & Analysis  
3/19/2002   Post a comment
SAN JOSE -- Canon Inc. today said it will place greater emphasis on partnerships in lithography and wafer-processing technologies as it continues to pursue a corporate goal of becoming No. l in exposure tools for chip production.
MRT promises counter suit in patent fight with Genesis Microchip
News & Analysis  
3/19/2002   Post a comment
SUNNYVALE, Calif.--Media Reality Technologies Inc. promised to "vigorously fight" a U.S. patent infringement lawsuit filed by Genesis Microchip Inc., which is accusing MRT and two other companies of violating its technology for liquid-crystal display (LCD) controllers.
Metrowerks offers live 2.5G test
News & Analysis  
3/19/2002   Post a comment
Real-world networks will allow application developers to check projects and avoid embarassing launch bugs.
Mentor eyes hardware emulation for mainstream prototyping
News & Analysis  
3/19/2002   Post a comment
CEO Wally Rhines outlines new strategy as company closes on Ikos takeover.
Applied's 'all-in-one' dielectric etcher integrates steps for copper interconnects
News & Analysis  
3/19/2002   Post a comment
SANTA CLARA, Calif.--Applied Materials Inc. today rolled out a new "all-in-one" tool for etching steps in copper interconnect processes, integrating low-k dielectric etch, photoresist strip, and barrier removal into a single system.
FCRAM 101 Part 1: Understanding the Basics
News & Analysis  
3/19/2002   Post a comment
Memory architectures are becoming a bottleneck in today's networking designs. The FCRAM architecture has emerged as one solution to this problem. Part 1 of this two-part set takes a detailed look at the FCRAM architecture.
Intel has dual processor Pentium III Tualatin
News & Analysis  
3/19/2002   Post a comment
Intel Corp. on Tuesday unveiled its first dual processor Pentium III Tualatin 800MHz blade server chips, its highest- performance chip yet for the ultra-dense low power servers.
Powerchip licenses 0.10-micron process from Mitsubishi
News & Analysis  
3/19/2002   Post a comment
HSINCHU,Taiwan -- Mitsubishi Electric Corp. has agreed to license its latest process technologies to Taiwan's Powerchip Semiconductor Corp., underscoring the Japanese firm's interest in the memory IC market.
Samsung unveils multichip package for 3G phones
News & Analysis  
3/19/2002   Post a comment
Samsung Electronics Co. Monday introduced what it claimed is the highest density multichip package (MCP) including a 128-megabit SDRAM, a 256-Mbit NAND flash and and an optional 32-Mbit UtRAM.
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