Plugging the laser gap News & Analysis 3/3/2008 Post a comment Researchers at Binghamton University claim to have devised a strategy to bridge the lasing gap with new materials and architectures that could enable applications not now possible.
European chip sales hold firm in Jan 08 News & Analysis 3/3/2008 Post a comment Chip sales in Europe for January 2008 held up best of the four regions tracked by the Semiconductor Industry Association (SIA), with a decrease of only 2.5 percent compared with December 2007. The SIA said the overall month-on-month decrease was 3.6 per cent, with worldwide semiconductor sales worth $21.49 billion.
Firecracker speeds Blackfin designs Product News 3/3/2008 Post a comment Avnet subsidiary Silica has introduced a versatile development platform around Analog Devices's Blackfin processor family. The platform, dubbed Firecracker, functions as a universal tool for Blackfin developers of all flavors. Fully verified functional modules eliminate the need to design in detail common embedded subsystems.
Filtronic completes disposal of compound semis unit News & Analysis 3/3/2008 Post a comment Filtronic plc (Shipley, England) has completed the disposal of its compound semiconductor division, including the manufacturing facility at Newton Aycliffe, England, to RF Micro Devices (Greensboro, N.C.) for approximately £12.5 million in cash.
Safety, security set to drive embedded apps Design How-To 3/3/2008 Post a comment There may be as many ways to implement safety and security features in embedded applications as there are engineers working on the challenge, but it is becoming a key topic as fail-safe and security technologies migrate to applications well away from the traditionally security- and safety-conscious military-aerospace and automotive sectors.
Under the Hood: Evolution of the smart phone Teardown 3/3/2008 1 comment It is interesting to look at the different ways that HTC and Nokia, two companies that have very competitive and successful smart-phone offerings, arrived at their latest products. HTC used its background as a PDA manufacturer to create the TyTN 2, essentially incorporating phone functionality into a PDA. Nokia came into the smart-phone market from cell phones, so it needed to find ways to increase functionality without substantially increasing the size of its latest phone, the N95.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.