Plugging the laser gap News & Analysis 3/3/2008 Post a comment Researchers at Binghamton University claim to have devised a strategy to bridge the lasing gap with new materials and architectures that could enable applications not now possible.
European chip sales hold firm in Jan 08 News & Analysis 3/3/2008 Post a comment Chip sales in Europe for January 2008 held up best of the four regions tracked by the Semiconductor Industry Association (SIA), with a decrease of only 2.5 percent compared with December 2007. The SIA said the overall month-on-month decrease was 3.6 per cent, with worldwide semiconductor sales worth $21.49 billion.
Firecracker speeds Blackfin designs Product News 3/3/2008 Post a comment Avnet subsidiary Silica has introduced a versatile development platform around Analog Devices's Blackfin processor family. The platform, dubbed Firecracker, functions as a universal tool for Blackfin developers of all flavors. Fully verified functional modules eliminate the need to design in detail common embedded subsystems.
Filtronic completes disposal of compound semis unit News & Analysis 3/3/2008 Post a comment Filtronic plc (Shipley, England) has completed the disposal of its compound semiconductor division, including the manufacturing facility at Newton Aycliffe, England, to RF Micro Devices (Greensboro, N.C.) for approximately £12.5 million in cash.
Safety, security set to drive embedded apps Design How-To 3/3/2008 Post a comment There may be as many ways to implement safety and security features in embedded applications as there are engineers working on the challenge, but it is becoming a key topic as fail-safe and security technologies migrate to applications well away from the traditionally security- and safety-conscious military-aerospace and automotive sectors.
Under the Hood: Evolution of the smart phone Teardown 3/3/2008 1 comment It is interesting to look at the different ways that HTC and Nokia, two companies that have very competitive and successful smart-phone offerings, arrived at their latest products. HTC used its background as a PDA manufacturer to create the TyTN 2, essentially incorporating phone functionality into a PDA. Nokia came into the smart-phone market from cell phones, so it needed to find ways to increase functionality without substantially increasing the size of its latest phone, the N95.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments