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posted in April 2001
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Crosstalk vexes interface designs
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4/2/2001   Post a comment
Samsung becomes latest to join Quad Data Rate SRAM alliance
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SAN JOSE -- Samsung Electronics Co. Ltd. today (April 2) announced it was joining a co-development partnership for Quad Data Rate SRAMs. The Korean chip maker joins Cypress, Integrated Device Technology, Micron, and NEC in supporting QDR static RAMs for high-performance memories in applications requiring data rates over 200 MHz.
API revving up HyperTransport
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Seeking to advance use of the HyperTransport bus, which it is aggressively licensing, API Networks Inc. today is introducing a chip, the AP1011, for bridging the emerging technology to the PCI bus.
IDT and TI agree to source 3.3-V octal bus switch devices
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SANTA CLARA, Calif. -- Integrated Device Technology Inc. and Texas Instruments Inc. today (April 2) announced an agreement to become alternate sources for octal bus switch devices made with 3.3-volt crossbar low-voltage technology. These devices are used in networking, telecommunications, and enterprise infrastructure systems.
Ritek seeks foreign partners for organic LED venture
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HSINCHU, Taiwan -- Ritek Display said it is soliciting foreign partners to help share the cost of a large-scale production facility for full-color organic LED displays.
Samsung joins SRAM development organization
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Samsung Electronics Co, Ltd. today announced it has joined the Quad Data Rate (QDR) group to design and manufacture QDR static RAMs.
Texas Instruments and IDT extend second-source agreement
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Texas Instruments inc. and Integrated Device Technology, Inc. today announced an alternate source agreement on 3.3-volt crossbar low-voltage technology (CBTLV) bus switch devices for the networking, telecommunications and enterprise infrastructure markets.
Intel announces first 0.13-micron chips in 300-mm development fab
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HILLSBORO, Ore.--Intel Corp. today (April 2) announced it has produced its first 0.13-micron ICs on 300-mm wafers in a development fab here.
Vitesse to buy Danish chip designer for $104.8 million in stock
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HERLEV, Denmark--Vitesse Semiconductor Corp. of Camarillo, Calif., announced on Sunday (April 1) that it has agreed to acquire Exbit Technology A/S here to expand its technology for high-speed ICs for communications and networks.
Intel produces chips using 0.13-micron process
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Intel Corp., said it has produced its first chips using 0.13- micron technology at its 300mm wafer development fab in Hillsboro, Ore.
Toshiba to spin off San Jose MPU engineering division
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SAN JOSE -- Toshiba America Electronic Components Inc. here today (April 2) announced it was spinning off its San Jose-based microprocessor engineering division as a wholly owned subsidiary, called ArTile Microsystems Inc.
IDT acquires fabless chip firm in Shanghai
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SHANGHAI, China -- In a bold move to immediately expand in China and voice-communications chip markets, Integrated Device Technology Inc. today (April 2) announced it will spend $80 million in cash to acquire four-year-old Newave Semiconductor Corp., a fabless startup with more than 70 engineers based in the company's Shanghai design subsidiary.
Infineon teams with U.S. software developer in 3G wireless platforms
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MUNICH -- Infineon Technologies AG here today (April 2) announced a partnership with U.S.-based InterDigital Communications Corp. to develop software for third-generation (3G) mobile products based on ICs from the Munich chip company.
API NetWorks offers first bridge IC to link AMD's HyperTranport to PCI
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CONCORD, Mass.--API NetWorks Inc. here today (April 2) claimed to be the first to offer a high-speed bridge chip that connects the HyperTransport bus, promoted by Advanced Micro Devices Inc., to the widely used 32-bit PCI bus.
AMD introduces 900-MHz Duron processor
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Advanced Micro Devices Monday moved to cut into archrival Intel Corp.'s value-end PC dominance by unveiling a 900-MHz Duron processor, the highest speed MPU for this market segment.
Synopsys goes open source with verification language
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4/2/2001   Post a comment
Design automation company Synopsys has opened up its Vera verification language but, in contrast to recent moves in the sector, has gone for the open-source route instead of trying to get it adopted by standards bodies.
Beijing Electronics plans 8-inch fab after starting work on new 6-inch plant
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BEIJING -- A new chip maker in China, called Beijing Electrontics Holdings Co. Ltd. here, has started construction of a 6-inch wafer fab and with plans to build an 8-inch plant as well, according to Chinese government officials.
Internet Machines taps TI's 0.13-micron process for network processors, switch fabric ICs
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AGOURA HILLS, Calif. -- Fourteen-month-old Internet Machines Corp. here today (April 2) unveiled its strategy to supply protocol-independent network processors and high-speed switch fabric ICs, using 0.13-micron copper-chip foundry services at Texas Instruments Inc.
Anadigics buys photodiode maker to expand in fiber optic communications
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WARREN, N.J.--Anadigics Inc. today (April 2) announced it has acquired Telcom Devices Corp., a supplier of indium-phosphide photodiodes for telecommunications and data networking applications. The transaction has a potential value of up to $48 million, based on various performance targets contained in the purchase agreement.
IDT moves into China, telecom segments with $80 million purchase of Newave
News & Analysis  
4/2/2001   Post a comment
SHANGHAI, China -- In a bold move to immediately expand in China and voice-communications chip markets, Integrated Device Technology Inc. today (April 2) announced it will spend $80 million in cash to acquire four-year-old Newave Semiconductor Corp., a fabless startup with more than 70 engineers based in the company's Shanghai design subsidiary.
Foundry capacity heads to 50%
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4/2/2001   Post a comment
Manufacturing capacity at the world's biggest foundries is already dramatically down on the preceding quarter.
AVX focuses passive-array manufacture in Ireland
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Thanks to a rapid ramp-up in production volumes at its Republic of Ireland plant, AVX has decided to concentrate production of its passive component arrays at Coleraine and stop production in the US.
Reflections point to defects in ball-grid packages
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4/2/2001   Post a comment
Oregon-based TDA Systems has developed a time domain reflectometry (TDR) system to pinpoint faults in ball grid array (BGA) packages.
Vitesse to buy Danish chip designer for $104.8M in stock
News & Analysis  
4/2/2001   Post a comment
Vitesse Semiconductor Corp, Camarillo, Calif., announced Sunday that it has agreed to acquire Exbit Technology A/S.
Toshiba to spin off San Jose MPU engineering division
News & Analysis  
4/2/2001   Post a comment
Toshiba America Electronic Components, Inc. (TAEC) is spinning off its San Jose-based microprocessor engineering division as a wholly owned subsidiary called ArTile Microsystems Inc.
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In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.
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