IPC reports lower bookings and shipments News & Analysis 4/29/2003 Post a comment The Association Connecting Electronics Industries (IPC) said its shipment and bookings indexes fell sharply in March from the year-ago month, indicating connector and printed-circuit board suppliers are still struggling with weak demand and excess production capacity.
Jitter Impacts on Equalized Link Performance: Part 3 Design How-To 4/29/2003 Post a comment There's no doubt that 5- to 6.25-Gbit/s backplanes will become the de-facto standard in the communication arena. But to get there, designers need to tackle some tough challenges. In Part 3 of this series, we'll lay out some test platforms that allow engineers to better analyze performance on higher-speed backplanes.
Multi-port memories evolve to meet SoC demands Design How-To 4/28/2003 Post a comment For designers charged with integrating a wide range of functions into system-on-chip (SoC) solutions, the cost and complexity of incorporating digital logic, processing, memory, and analog functions often prove inhibitive.
Embedded memories multiply inSoCs Design How-To 4/28/2003 Post a comment SRAMs have long been a system-on-chip mainstay, but both the size of the SRAM blocks and the number of them in a single SoC have started to increase explosively in the past year or so.
Small EMS shops hunt for design talent News & Analysis 4/28/2003 Post a comment Without in-house engineering expertise at their fingertips, a growing number of small EMS providers are reaching out to third-party firms or larger contract manufacturers to enhance their design capabilities.
JEDEC, memory test lab square off over specs News & Analysis 4/28/2003 Post a comment A confrontation over memory module testing is shaping up between the JEDEC Solid State Technology Association and an independent lab that performs motherboard compatibility testing for Advanced Micro Devices Inc. and Intel Corp.
Europe slaps hefty duty on Hynix DRAMs News & Analysis 4/28/2003 Post a comment The European Commission last week ruled that a provisional countervailing duty of 33% will be levied on imported DRAMs from Hynix Semiconductor Inc. as a penalty for what the commission said were illegal subsidies the chipmaker received from the Korean government.
In fact, as its semiconductor suppliers try to regain their footing and adopt new long-range business strategies, Japan is among the few markets expected to raise spending for new plants and equipment.
Loewe, Sharp join to make LCD TVs for Europe News & Analysis 4/28/2003 Post a comment German consumer electronics company Loewe Opta GmbH, has announced plans to further expand a collaboration agreement with Japanese liquid crystal display (LCD) maker, Sharp Corporation for the development and supply of LCD TVs to the European market.
Haltingly, Film Bows to the Digital Future News & Analysis 4/27/2003 Post a comment Kodak's Advantix Preview falls short of being a true hybrid digital/film camera. A complex and somewhat poorly implemented design, the camera seems more of a grudging acknowledgement that photography is moving from film toward cheaper, simpler and smaller digital-imaging alternatives.
PWM control chip handles higher heat Product News 4/24/2003 Post a comment Intersil Corp. has spun new versions of its Endura ISL6558 multiphase pulse-width modulation controller, making it available in an industrial temperature grade and in a near-chip-scale quad flat no-lead (QFN) package.
Lithium batteries eye PCs, autos Product News 4/24/2003 Post a comment With the energy density and capacity of rechargeable lithi-um-ion and lithium-polymer cells up by a quarter to a third over the past two and a half years, suppliers of Li-ion batteries are now tackling bigger and more varied applications that include larger and more capable PC-based systems, automobiles and military equipment.
Jitter Impacts on Equalized Link Performance: Part 2 Design How-To 4/24/2003 Post a comment There's no doubt that 5- to 6.25-Gbit/s backplanes will become the de-facto standard in the communication arena. But to get there, designers need to tackle some tough challenges. In Part 2 of this series, we'll examine the role deterministic jitter plays in emerging active backplane designs.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.