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Internet of Things Designline
posted in April 2003
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IPC reports lower bookings and shipments
News & Analysis  
4/29/2003   Post a comment
The Association Connecting Electronics Industries (IPC) said its shipment and bookings indexes fell sharply in March from the year-ago month, indicating connector and printed-circuit board suppliers are still struggling with weak demand and excess production capacity.
Infineon lays off 900, with more to come
News & Analysis  
4/29/2003   Post a comment
Infineon Technologies A.G. today announced a workforce reduction of 900 jobs due to "the continuing tense market situation."
Load disconnect protects lead-acid batteries from overcurrent/overdischarge
News & Analysis  
4/29/2003   Post a comment
"You know you're running too much current when your 12V car battery drops to less than 10.5 under load," say Maxim's applications team. A handy-dandy fusing circuit withstands 20V and 5A - and needs only 50 uA to run.
Jitter Impacts on Equalized Link Performance: Part 3
Design How-To  
4/29/2003   Post a comment
There's no doubt that 5- to 6.25-Gbit/s backplanes will become the de-facto standard in the communication arena. But to get there, designers need to tackle some tough challenges. In Part 3 of this series, we'll lay out some test platforms that allow engineers to better analyze performance on higher-speed backplanes.
Precision voltage reference uses EEPROM and floating gate trim
News & Analysis  
4/29/2003   Post a comment
A floating gate charge, controlled by EEPROMs, is capable of building references with 16-bit accuracy. Xicor's Jim McCreary explains the tunneling effects that can be used to control CMOS threshold voltages.
SoC Embedded Memories
Design How-To  
4/28/2003   Post a comment
Complex memories: the art of mixing traditional simulation with innovative verification solutions
Design How-To  
4/28/2003   Post a comment
Today, memory "blocks" occupy an increasing portion of system-on-chip (SoC) designs.
Infrastructure ASICs drive high-performance memory decisions
Design How-To  
4/28/2003   Post a comment
The current generation of networking infrastructure ASICs at the 130-nm process node provides a set of memory challenges that go well beyond the processor-centric designs of the past.
Better memory models support SoC verification tasks
Design How-To  
4/28/2003   Post a comment
While simulation models of standard off-the-shelf memory components have taken leaps and bounds forward with respect to functionality and debug capabilities, embedded memory models have not changed significantly for many years.
Watch out for compatiblity, complexity issues for future embedded Flash
Design How-To  
4/28/2003   Post a comment
With advances in deep submicron CMOS technology, more feature-rich integrated silicon devices are being used in consumer electronics, advanced communication and networking systems, computers, servers and virtually all electronic systems
Enhanced verification vital for embedded memory design
Design How-To  
4/28/2003   Post a comment
Increasing data throughput requirements continue to boost demand for more memory in highly integrated products.
Multi-port memories evolve to meet SoC demands
Design How-To  
4/28/2003   Post a comment
For designers charged with integrating a wide range of functions into system-on-chip (SoC) solutions, the cost and complexity of incorporating digital logic, processing, memory, and analog functions often prove inhibitive.
Memory overwhelms current verification techniques
Design How-To  
4/28/2003   Post a comment
The modern System-on-Chip (SoC) could reasonably be called an island of logic, surrounded by a sea of memory.
Embedded memories multiply inSoCs
Design How-To  
4/28/2003   Post a comment
SRAMs have long been a system-on-chip mainstay, but both the size of the SRAM blocks and the number of them in a single SoC have started to increase explosively in the past year or so.
BIST, BISR tools push up quality, yield
Design How-To  
4/28/2003   Post a comment
Today's nanometer system-on-chip (SoC) designs typically embed a very large number of memories that are extremely sensitive to many different hardware-production defects.
Overcoming timing, power bottlenecks
News & Analysis  
4/28/2003   Post a comment
In most SoC designs, embedded ROM, RAM or register file memories of various sizes consume up to 50 percent of die area.
Pressure is on third-party memory IP
Design How-To  
4/28/2003   Post a comment
As chip content grows in complexity, a corresponding, and dramatic, change is occurring in the semiconductor industry.
Samsung to upgrade Austin fab
News & Analysis  
4/28/2003   Post a comment
March chips sales rise 13%
News & Analysis  
4/28/2003   Post a comment
Small EMS shops hunt for design talent
News & Analysis  
4/28/2003   Post a comment
Without in-house engineering expertise at their fingertips, a growing number of small EMS providers are reaching out to third-party firms or larger contract manufacturers to enhance their design capabilities.
Update: Agilent unlocks ASIC vault and enters merchant market
News & Analysis  
4/28/2003   Post a comment
At a time when sharp competition for fewer and fewer new ASIC sockets is sending vendors in search of other avenues, Agilent Technologies Inc. is jumping into the market with both feet.
Challenged by AMD's Opteron, Intel to upgrade Itanium 2
News & Analysis  
4/28/2003   Post a comment
Not to be upstaged by archrival Advanced Micro Devices Inc.'s new Opteron microprocessor, Intel Corp. later this year will upgrade its 64-bit Itanium 2 MPU to run 32-bit x86 programs at about 1.5GHz.
JEDEC, memory test lab square off over specs
News & Analysis  
4/28/2003   Post a comment
A confrontation over memory module testing is shaping up between the JEDEC Solid State Technology Association and an independent lab that performs motherboard compatibility testing for Advanced Micro Devices Inc. and Intel Corp.
Europe slaps hefty duty on Hynix DRAMs
News & Analysis  
4/28/2003   Post a comment
The European Commission last week ruled that a provisional countervailing duty of 33% will be levied on imported DRAMs from Hynix Semiconductor Inc. as a penalty for what the commission said were illegal subsidies the chipmaker received from the Korean government.
NOR flash diehard, ST, enters NAND market with Hynix
News & Analysis  
4/28/2003   Post a comment
STMicroelectronics N.V. and Hynix Semiconductor Inc. last week jumped into the NAND flash memory market with plans to jointly develop 512Mbit parts within a few months, expanding the procurement options of storage equipment makers.
Japan's top chip suppliers kick up capital spending
News & Analysis  
4/28/2003   Post a comment
After a two-year hiatus, Japan's largest chipmakers are again hiking their capital investment budgets.

In fact, as its semiconductor suppliers try to regain their footing and adopt new long-range business strategies, Japan is among the few markets expected to raise spending for new plants and equipment.

Loewe, Sharp join to make LCD TVs for Europe
News & Analysis  
4/28/2003   Post a comment
German consumer electronics company Loewe Opta GmbH, has announced plans to further expand a collaboration agreement with Japanese liquid crystal display (LCD) maker, Sharp Corporation for the development and supply of LCD TVs to the European market.
Haltingly, Film Bows to the Digital Future
News & Analysis  
4/27/2003   Post a comment
Kodak's Advantix Preview falls short of being a true hybrid digital/film camera. A complex and somewhat poorly implemented design, the camera seems more of a grudging acknowledgement that photography is moving from film toward cheaper, simpler and smaller digital-imaging alternatives.
Making hardware modules firmware-friendly
Design How-To  
4/25/2003   Post a comment
LSI Logic's "firmware friendly" engineer, David Fechser, shows you how to design abstract functional blocks in a way that facilitates firmware implementation.
LDOs tout 250-mV dropout voltage at 300 mA
Product News  
4/24/2003   Post a comment
Siliconix Inc. has packaged a pair of 300-milliamp low-noise, low-dropout (LDO) regulators in 3 x 3-mm PowerPAK MLP33s.
PWM control chip handles higher heat
Product News  
4/24/2003   Post a comment
Intersil Corp. has spun new versions of its Endura ISL6558 multiphase pulse-width modulation controller, making it available in an industrial temperature grade and in a near-chip-scale quad flat no-lead (QFN) package.
LCD power supplies deliver full output range
Product News  
4/24/2003   Post a comment
Maxim Integrated Products' MAX1997 and MAX1998 power supplies provide the voltages required for active-matrix, thin-film-transistor LCDs.
Dual-mode charge pumps drive four or six white LEDs
Product News  
4/24/2003   Post a comment
Advanced Analogic Technologies Inc.'s AAT3123/4 white-LED drivers are constant-frequency charge pump dc/dc converters that use a dual-mode load switch and fractional (1.5x) conversion to maximize efficiency for white-LED applications.
Lithium batteries eye PCs, autos
Product News  
4/24/2003   Post a comment
With the energy density and capacity of rechargeable lithi-um-ion and lithium-polymer cells up by a quarter to a third over the past two and a half years, suppliers of Li-ion batteries are now tackling bigger and more varied applications that include larger and more capable PC-based systems, automobiles and military equipment.
Jitter Impacts on Equalized Link Performance: Part 2
Design How-To  
4/24/2003   Post a comment
There's no doubt that 5- to 6.25-Gbit/s backplanes will become the de-facto standard in the communication arena. But to get there, designers need to tackle some tough challenges. In Part 2 of this series, we'll examine the role deterministic jitter plays in emerging active backplane designs.
Intersil results meet guidance
News & Analysis  
4/23/2003   Post a comment
Memory test lab says it will no longer ask customers to meet JEDEC specs
News & Analysis  
4/23/2003   Post a comment
Setting the stage for a confrontation with the JEDEC Solid State Technology Association, a leading memory module and motherboard test lab today said products submitted for its compatibility testing program will no longer be required to meet JEDEC design specifications.
Page 1 / 4   >   >>


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