Flextronics ordered to pay $14M to ex-employees News & Analysis 4/2/2010 Post a comment A French industrial tribunal has released a ruling ordering Singapore-based EMS provider Flextronics International Ltd. to pay 11 million euros ($14.8 million) in compensation to former employees on its site of Chateaudun, France.
Spansion claims progress in emergence from Chapter 11 News & Analysis 4/2/2010 Post a comment Spansion Inc. has said that the U.S. Bankruptcy Court for the District of Delaware has issued a decision regarding Spansion's reorganization plan that sets aside a number of objections to the plan and provides guidance on the remaining issues.
At least two more WiMax handsets coming in 2010 News & Analysis 4/1/2010 Post a comment At least two more WiMax handsets are expected to emerge this year, according to the company that designed silicon inside the EVO 4G handset recently announced by Sprint, and they will be joined by prototype phones for the Long Term Evolution network that will be demonstrated as early as May by China Mobile.
Smartphones: A new calling for DRAMs? News & Analysis 4/1/2010 2 comments The average amount of DRAM used in smartphones is set to rise by more than a factor of 10, growing to 1.3-Gbytes by 2014, up from 123-Mbytes in 2009, according to iSuppli Corp.
Keep alternative energy engineering clean: from politics SmartEnergy Designline Blog 4/1/2010 6 comments We were brainstorming on ideas for the up-coming EETimes Digital Edition on Alternative Energy (mark your calendar: it debuts June 7th) and I realized after just a few minutes that it's really hard to discuss Alternative Energy without raising political hackles, no matter how much you try and focus on the engineering aspects.
Firms explore electroless plating for solar cells News & Analysis 4/1/2010 Post a comment The College of Nanoscale Science and Engineering (CNSE) of the University at Albany, N.Y. and Technic Inc. have announced an R&D partnership that is designed to enable critical improvements in manufacturing processes for solar cells.
Europe backs thermally-aware EDA project News & Analysis 4/1/2010 1 comment Europe's big three chip makers STMicroelectronics, Infineon Technologies and NXP are all taking part in a three-year European collaborative research project to try and improve thermal-awareness and thermal effect modeling within IC design.
Konica Minolta selects EVE's ZeBU Product News 4/1/2010 Post a comment Japan's Konica Minolta Technology Center Inc. announced it has licensed ZeBu emulation platform from EVE SA (Palaiseau, France) to accelerate the validation of its image processing LSI designs.
Power management IC vendor files for $91M IPO News & Analysis 4/1/2010 Post a comment Power management IC vendor Alpha & Omega Semiconductor filed a registration statement with the U.S. Securities and Exchange Commission for an initial public offering worth about $91 million, according to a report.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.