Breaking News
Internet of Things Designline
posted in April 2010
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Actel licenses cryptography technology
News & Analysis  
4/28/2010   Post a comment
Actel has licensed technology from Cryptography Research to enhance the security of its products against differential power analysis and other side-channel related attacks.
EE Times honors 2010 ACE Award winners
News & Analysis  
4/28/2010   Post a comment
EE Times honored the winners of the sixth ACE Awards at a reception in conjunction with the Embedded Systems Conference in San Jose, Calif.
Actel licenses cryptography technology
News & Analysis  
4/28/2010   Post a comment
Actel has licensed technology from Cryptography Research to enhance the security of its products against differential power analysis and other side-channel related attacks.
ESC - CebaFlex FPGA-based subsystem boards boost protocol processing up to 10x
Product News  
4/28/2010   Post a comment
CebaFlex FPGA-based subsystem boards boost protocol processing up to 10x. The PCIe-enabled CPU-offload solution reduces time to market, lowers power consumption, and increases ROI through fast and easy in-system upgrades.
Group forms multicore alliance
News & Analysis  
4/27/2010   1 comment
A new alliance has been formed in the multicore parallel processing and software development arena.
Multicore not up to snuff for basestations
News & Analysis  
4/27/2010   Post a comment
Multicore processors should be ideal for wireless base stations, but so far both the chips and their tools fall short of meeting engineers needs, according to a senior developer at HuaWei speaking at the Multicore Expo.
ESC keynoter Kaku beams audience back to the future
Blog  
4/27/2010   2 comments
Physicist Michio Kaku, keynote speaker at the Embedded Systems Conference in San Jose, offered his audience a feast of futurism, predicting extraordinary advances in medical technology, and science-fiction turned reality in areas like teleportation, invisibility and molecule-size computers.
Intel teams with partners on wireless health care apps
News & Analysis  
4/27/2010   Post a comment
At the Embedded Systems Conference here, LynuxWorks announced that it has combined efforts with Portwell, Inc. to deliver a proof-of-concept (PoC) wireless sensor platform based on Intel chips to the health care community.
Freescale MCUs pave SoC path to medical devices
News & Analysis  
4/27/2010   1 comment
Freescale took a system-on-chip approach for its Flexis medical microcontrollers, shown at ESC, integrating an analog front end for biosensors, LCD drivers and medically approved USB stack.
Video: LinuxWorks founder on embedded software
News & Analysis  
4/27/2010   Post a comment
Virtualization and security technology could be the focus of the next round of consolidation for an embedded software sector that is increasingly adopting Linux, according to Inder Singh, chairman of LynuxWorks, Inc.
EDAC elects AWR's CEO
News & Analysis  
4/27/2010   Post a comment
AWR Corp. announced that Dane Collins, the company's chief executive officer, has been elected to the Electronic Design Automation Consortium (EDAC) board of directors.
1-GSPS quad DAC yields design efficiency in wireless base stations
Product News  
4/27/2010   Post a comment
ADI says its 1-GSPS quad-channel DAC is an industry-first at this speed and integration level, and reduces PCB area by 20 percent compared to dual-channel options.
ESC - Synapse and Silicon Labs introduce complete solution for wireless mesh networking
Product News  
4/27/2010   Post a comment
Synapse and Silicon Labs introduce complete solution for wireless mesh networking. SNAP and Si1000 wireless MCU enable sub-GHz connectivity for smart meter, building automation, and personal medical devices.
NXT acquires Audium Semiconductor's IP to offer USB-powered loudspeakers
Product News  
4/27/2010   Post a comment
NXT plc announced the strategic purchase of the IP of Audium Semiconductor and associated assets. The company intends to use Audium ICs to produce complete audio platforms incorporating its Balanced Mode Radiator technology together with ultra-efficient power amplifiers.
EDA360: The Way Forward for Electronic Design
Design How-To  
4/27/2010   Post a comment
The Cadence EDA360 Vision Paper is a comprehensive call-to-action for the electronics industry to address a disruptive transformation--a shift in focus from design creation to integration.
ESC - Digi enables all M2M embedded products with out-of-the-box cloud connectivity
Product News  
4/27/2010   Post a comment
Digi International today announced that all Digi and Rabbit embedded products will be configured to easily connect to the iDigi "cloud" out of the box.
Chip makers 'flying blind'
News & Analysis  
4/27/2010   1 comment
Semiconductor companies can improve their supply chain visibility and extract additional value from the operations by increasing sales force effectiveness, boosting integration with external value chain partners, and optimizing planning and fulfillment processes.
ESC - IAR Embedded Workbench now supports ARM Cortex-M4
News & Analysis  
4/27/2010   Post a comment
The newest version of IAR Embedded Workbench adds software performance for Cortex-M4's signal processing.
Teradyne gets testy in test
News & Analysis  
4/27/2010   Post a comment
Teradyne Inc. was the ATE share leader in 2009, according to a report from Barclays Capital, which cited Gartner Inc. as its source.
ESC - IAR Systems pioneers low-power debugging
Product News  
4/27/2010   1 comment
IAR Systems has developed low-power debugging technology that marks significant advance in software development for low-power embedded systems.
IDT debuts power converter, timing chipset with coupled inductor technology
Product News  
4/27/2010   Post a comment
IDT has announced a new family of voltage regulators designed to help customers reduce their total system power loss by combining its timing portfolio with a multi-phase controller and featuring coupled inductor technology.
ARM posts record results in Q1
News & Analysis  
4/27/2010   Post a comment
Processor IP licensor ARM Holdings plc turned in record financial results for its first quarter of 2010 with revenues at $143.3 million up 19 percent on the revenue in the first quarter of 2009. The quarter saw ARM achieve its highest ever unit shipments leading to record royalty revenues, profits and net cash generation.
Study pegs Tek scope 'winner' in specific test tasks
News & Analysis  
4/27/2010   1 comment
A study by research firm Hansa|GCR concluded that among three scopes performing similar tasks the Tektronix MSO4000 mixed signal oscilloscope was preferred, according to a press release by Tektronix, Inc. by over two-thirds of the participants and was 53 percent faster in finding runts and glitches when debugging a design.
300-mm wafers drive silicon recovery
News & Analysis  
4/27/2010   Post a comment
Global demand for silicon used in semiconductor manufacturing is expected to rebound robustly in 2010, led by shipments of cutting-edge 300mm wafers.
TI to expand 300-mm analog fab
News & Analysis  
4/27/2010   Post a comment
Texas Instruments Inc. is expanding its 300-mm analog fab amid an upturn in the market.
LED driver features dynamic headroom control for high-power applications
Product News  
4/27/2010   Post a comment
National has started to sample what it says is the first LED driver with dynamic headroom control and multiple outputs for high-power applications that accurately and efficiently drives up to four strings of LEDs.
Green Hills forges alliances with Freescale, Cavium
Product News  
4/27/2010   Post a comment
Increased processor support, including multicore, is added to Integrity OS, IDE, debugging tools.
Fasten your seatbelt: go for a 32-GHz real-time, analog-bandwidth, oscilloscope ride
Product News  
4/27/2010   Post a comment
Agilent Infiniium 90000 X-Series family features 10 models (16 to 32 GHz); extremely low noise and jitter; sophisticated probe system; 40 application packages
ESC - Wi2Wi introduces industrial temp WLAN-Bluetooth module
Product News  
4/27/2010   Post a comment
The W2CBW009Di industrial temp WLAN-Bluetooth module from Wi2Wi measures a mere 16mm x 16mm x 2.1mm and operates in temps of -40C to +85C.
Large LCD TV market sweeps March ratings
News & Analysis  
4/27/2010   Post a comment
Large-area TFT-LCD panel shipment increased 23.8 percent month-to-month this past March to 56.87 milllion units—all time high, as revenue also increased 22.7 percent month-to-month to $7.23 billion.
ESC - Embed-X incorporates first Agile dev framework for critical software processes
News & Analysis  
4/27/2010   Post a comment
LDRA and Codice Software have partnered to create embedded ALM solution for Embed-X that applies Agile rapid development capabilities to rigorous certification processes.
ESC - LDRA adds Java language and certification support
News & Analysis  
4/27/2010   Post a comment
LDRA adds Java language and certification support to its tool suite, ensuring LDRA testing capabilities are available to companies integrating Java.
Intel to invest $177M in Guadalajara Design Center
News & Analysis  
4/27/2010   1 comment
Intel said it would invest $177 million over three years to expand its design center in Guadalajara, Mexico.
Group claims EUV light source record
News & Analysis  
4/27/2010   1 comment
Technology consortium Extreme Ultraviolet Lithography System Development Association (EUVA) of Japan claims to have achieved the world's highest output for an EUV light source: 104 Watts.
Lam Research: The etch king
News & Analysis  
4/27/2010   Post a comment
Lam Research Corp. remained the king in the overall etch equipment market in 2009, according to a report from Barclays Capital, which cited Gartner Inc. as its source.
TI beats estimates in Q1
News & Analysis  
4/26/2010   Post a comment
Texas Instruments Inc. reported first-quarter revenue of $3.21 billion, up 54 percent from a year ago and up 7 percent from the previous quarter.
Four automotive converters fit in a 25mm² IC
Product News  
4/26/2010   Post a comment
Maxim has announced an automotive-grade PMIC with two DC-DC converters, two LDO regulators, and a power-good reset output for voltage monitoring-all in a 5mm x 5mm footprint.
Applied rules in deposition equipment
News & Analysis  
4/26/2010   Post a comment
Applied Materials Inc. ruled the overall deposition equipment market in 2009, according to a report from Barclays Capital, which cited Gartner Inc. as its source.
Low-Power Intel Architecture Platform for In-Vehicle Infotainment - Part 1: Overview
Design How-To  
4/26/2010   Post a comment
Part 1 of this white paper presents an overview of the key technology blocks that make up the Intel-based IVI platform, as well as the challenges faced in optimizing and incorporating these into the platform.
Guide to Embedded Systems Architecture - Part 2: PPP state pseudocode and Internet Protocol
Design How-To  
4/26/2010   Post a comment
Part 2 of an excerpt from the book "Embedded Systems Architecture: A Comprehensive Guide for Engineers and Programmers" offers pseudocode examples for PPP Link Control Protocol states and a look at the IP networking layer protocol.
Netronome debuts cards, system for packet processing
Product News  
4/26/2010   Post a comment
Netronome will debut at the Multicore Expo two PCI Express Gen2 adapter cards and a chassis-based system using its 40-core network processor announced late last year at a time when rival Cavium Networks is expected to announce a 32-core device.
Vitesse expands broadcast video IC line
Product News  
4/26/2010   Post a comment
Vitesse recently expanded its broadcast video IC portfolio with what it claims is the industry's highest performance, lowest power, smallest footprint crosspoint switch.
Controller safeguards low voltage electronics from input power surges
Product News  
4/26/2010   Post a comment
Linear Technology has introduced the LTC4361, a 2.5V to 5.5V overvoltage and overcurrent protection controller designed to safeguard low voltage, portable electronics from damaging input voltage transients and current surges.
NTT, Renesas, others to devise mobile platform
News & Analysis  
4/26/2010   Post a comment
NTT Docomo, Renesas, Fujitsu, NEC, Panasonic Mobile and Sharp plan to jointly develop a new application platform for mobile phones.
Freescale takes aim at TI's DSP market
News & Analysis  
4/26/2010   2 comments
Aiming at the heart of DSP leader Texas Instruments' business, Freescale will show 45-nm, StarCore-based digital signal processors at the Embedded Systems Conference that reportedly outperform TI's equivalents but will sell for roughly half the price.
Philips sells EUV source unit to Ushio
News & Analysis  
4/26/2010   Post a comment
Japan's Ushio Inc. has acquired Royal Philips Electronics' extreme ultraviolet (EUV) light source business.
Samplify offers IQ compression for 4G conversion
News & Analysis  
4/26/2010   Post a comment
Samplify Systems Inc. (Santa Clara, Calif.), a provider of signal compression technology and ICs has announced Prism IQ compression technology optimized for wireless infrastructure applications using the Common Public Radio Interface (CPRI) standard.
ASML extends share lead in litho
News & Analysis  
4/26/2010   Post a comment
ASML Holding NV extended its market share lead over Nikon Corp. and Canon Inc. in lithography for 2009, according to a report from Barclays Capital, which cited Gartner Inc. as its source.
CebaTech rolls protocol acceleration subsystems
News & Analysis  
4/26/2010   Post a comment
Embedded system solutions provider CebaTech launched a series of PCI Express-enabled subsystem boards said to boost protocol processing performance in data networking and enterprise storage systems by up to 10 fold.
Tensilica launches third generation 8-MAC VLIW DSP core
Product News  
4/26/2010   Post a comment
Tensilica Inc. has introduced its third generation ConnX 545CK 8-MAC (multiply-accumulate) VLIW (very long instruction word) DSP core for SoC designs.
<<   <   Page 2 / 10   >   >>


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