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Internet of Things Designline
posted in April 2012
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Smart memory seen as cure for user-interface bottlenecks
News & Analysis  
4/30/2012   4 comments
Spansion CEO John Kispert said smart memory will be needed to wean advanced user-interfaces off cloud connectivity dependence.
Micron, Hynix poised to gain NAND share, says IHS
News & Analysis  
4/30/2012   2 comments
Micron Technology and SK Hynix narrowed the gap in NAND flash memory with market leaders Samsung and Toshiba in the fourth quarter of 2011, according to a report by market research firm IHS iSuppli.
TriQuint Semi cuts jobs
News & Analysis  
4/30/2012   Post a comment
TriQuint Semiconductor cut about 70 jobs in Florida and plans to also cut jobs in Costa Rica as part of a plan to restructure the company's SAW filter manufacturing operations.
IDT buying PLX Tech for $330 million
News & Analysis  
4/30/2012   6 comments
IDT said it signed a definitive agreement to acquire connectivity chip vendor PLX Technology in a cash and stock deal were about $330 million.
Embedded TLC flash controller targets smart phones, tablets
Product News  
4/30/2012   Post a comment
DensBits’ DB3610 offers more than 10,000 P/E cycles on 2Xnm triple-level-cell devices.
New memory packaging IP packs multi-gigabit capacity in a small form factor
Product News  
4/30/2012   Post a comment
Invensas targets notebook and tablet applications with DIMM-in-a-package solution based on xFD Technology.
NeoPhotonics deals with Rusnano, plans facilities in Russia
News & Analysis  
4/30/2012   Post a comment
Russian government entity Rusnano has acquired 4.97 million newly-issued common shares of San Jose, Calif.-based NeoPhotonics Corp. in a private placement transaction worth $39.8 million.
Ericsson adds new dev boards to 3E Gold Design Kit
Product News  
4/30/2012   Post a comment
Ericsson has launched two new development board kits, the ROA1285068 and ROA1285077, for its 3E Gold Design Kit.
PCM Progress Report No. 7: A view of Samsung's 8-Gb array
Design How-To  
4/30/2012   3 comments
Our PCM analyst takes a look at the data released on Samsung's 8-Gb array and what it means for the technology.
Amazing time-lapse shots from Cassini and Voyager
Engineering Pop Culture!  
4/30/2012   6 comments
Words like mesmerizing, stunning, inspiring come to mind watching this time-lapse video of images from the Cassini and Voyager space probes.
Java's father says Oracle is “in the right”
Blog  
4/30/2012   13 comments
James Gosling, the father of Java, publically came out in favor of Oracle in its suit against Google’s Android, igniting a lively debate
Samsung tapes out Gigahertz+ ARM Cortex-A15 processor
Product News  
4/30/2012   Post a comment
Hardened core used in industry's first ARM Cortex-A15 processor-based SoC for mobile computing devices.
Sophisticated thermal management solutions cool hi-rel systems - Part 2
Design How-To  
4/30/2012   1 comment
Choosing design options requires skill, real-world expertise and a critical focus on data points relevant to application and environment
Researchers prototype implantable microphone for de
News & Analysis  
4/30/2012   6 comments
A proof-of-concept prototype microphone implanted in the middle ear promises to partly offset the need for wearing an outer hearing aid.
Innovative IC can't trap lightning, but can let you know it's coming
Product News  
4/30/2012   10 comments
Austriamicrosystems AS3935 Franklin Lightning Sensor IC senses approach via analog circuitry plus waveform-analysis algorithms
NXP today: 'Practically a Chinese company'
News & Analysis  
4/30/2012   33 comments
Rick Clemmer, NXP’s CEO, said last week, NXP today is “practically a Chinese company.” NXP makes more money in China than in any other single country. Further, the Dutch company employs 8,000 people in China.
Gore starts business, develops tests for portable electronics
News & Analysis  
4/30/2012   1 comment
Gore has created a new business unit, Gore Portable Electronic Vents, to concentrate on solutions to protect portable devices from water, dust and dirt ingress while maintaining the integrity of sound transmission.
Power 108: Powering forward
Blog  
4/30/2012   Post a comment
In this blog, we take a look at where people think power will be in three years and ten years time. What do you think?
Hierarchical methods for power intent specification
Design How-To  
4/30/2012   Post a comment
The intent of this design article is to provide a comprehensive tutorial on both the value of and the “how to” in using a hierarchical low-power design methodology...
Here comes silicene, possible graphene replacement
Research  
4/30/2012   12 comments
Science researchers have reported the growth of a single layer of silicon on top of silver, in a hexagonal 2-D form of silicon similar to the graphene form of carbon.
Broadcom rolls two-port 100G switch
News & Analysis  
4/30/2012   2 comments
Broadcom brings to Interop 2012 next week its BCM88650, a high-end switching fabric that sports two 100G ports and also can be flexibly used for 10 and 40G nets.
Huawei to give Intel LTE development support in China
News & Analysis  
4/30/2012   4 comments
Intel's aspirations selling chips for mobile equipment have received a boost with the news that Huawei has agreed to work with Intel on the testing and rapid deployment of the time division duplex format applied to Long Term Evolution standard.
2012 chip market to grow 7%, says analyst
News & Analysis  
4/30/2012   1 comment
Growth in the semiconductor market will accelerate in the second half of 2012 and achieve an annual percentage figure of 6 to 7 percent, according to Mali Venkatesan, research manager for semiconductors at International Data Corp.
Microelectronic sensing system enables in-flight arrow ballistics measurement
Design How-To  
4/30/2012   4 comments
Packing MEMS and more in your arrow leads to an unusual data-acquisition system
Heliatek pushes organic solar cell efficiency higher
News & Analysis  
4/29/2012   4 comments
Heliatek GmbH (Dresden, Germany), a startup developing organic solar cells, has pushed the record efficiency for organic solar cells higher, achieving an efficiency of 10.7 percent in a 1.1 square centimeter tandem cell. The efficiency was measured by indepdendent test house SGS SA (Geneva Switzerland).
PolyCore upgrades multicore development tool
Product News  
4/29/2012   3 comments
PolyCore Software Inc. (Burlingame, Calif.) has upgraded its Poly-Platform tool to version 2.0 with the inclusion of Poly-Mapper which provides control of memory used for messaging in multi-core software.
VIA Labs VL812 USB 3.0 Hub Controller features low power, low cost
Product News  
4/28/2012   Post a comment
The VL812 USB 3.0 hub controller from Via Labs, Inc., incorporates a new low-power design featuring an industry-first integrated 5V DC-DC switching regulator.
Win a pit walk at the Indy 500
Automotive DesignLine Blog  
4/28/2012   3 comments
Or at four other IndyCar races.
Switching buck regulators optimized for infotainment
Product News  
4/27/2012   Post a comment
Automotive devices operate at 2 MHz and offer high conversion ratios.
Fairchild, Power Integrations found to infringe patents
News & Analysis  
4/27/2012   5 comments
A jury in U.S. federal court found that Fairchild Semiconductor and Power Integrations infringed on each others' patents.
ST’s SPIRIT1 wireless transceiver cuts power budget 50% in smart meter apps
Product News  
4/27/2012   Post a comment
STMicroelectronics has launched a high-performance, ultra-low-power wireless transceiver for Automatic Meter Infrastructure and other wireless sensor node applications.
Check out MAKE's Hardware Innovation Workshop!
The Engineering Life - Around the Web  
4/27/2012   Post a comment
I just received an email from Sherry Huss, who is Maker-in-Chief over at Make Magazine and Maker Faire.
Engineer down! Someone needs our help!
Engineering Pop Culture!  
4/27/2012   33 comments
I just received an email from someone who we will call Dave (because that's his name). Dave says...
Music out of the blue
RF & Microwave Designline Blog  
4/27/2012   3 comments
I love Bluetooth. Little did I know, seventeen years ago when I was assigned my first project to write about the origins of Bluetooth and the viking that inspired the name that it would bring so much joy and convenience to my life
Win a trip to the Indy 500
News & Analysis  
4/27/2012   6 comments
Circuit-protection maker Littelfuse is sending five engineers to the big Memorial Day race.
A/D Converter -> FPGA -> D/A Converter: The JESD204/A/B Standard – “Where the rubber meets the road”
Blog  
4/27/2012   10 comments
JESD204B will create opportunities for a wide range of data-crunching systems that require high throughput and on-the-fly processing flexibility.
Power modules without a baseplate: a reliable and cost-effective solution
Design How-To  
4/27/2012   Post a comment
Understand the differences in performance, reliability, and cost of using a non-baseplate power module
Xilinx unveils vivado design suite for the next decade of 'All Programmable' devices
Design How-To  
4/27/2012   2 comments
State-of-the-art EDA technologies and methods underlie a new tool suite that will radically improve design productivity and quality of results...
A modeling approach for power integrity simulation in 3D-IC designs
Design How-To  
4/27/2012   Post a comment
Designing reliable three-dimensional (3D) system-on-chips (SoCs) is extremely complex, and critical for the next level of integration in silicon design…
Cisco validates Emerson 3U processor board for communications in defense apps
Product News  
4/27/2012   Post a comment
Emerson Network Power said its CPCI7203 rugged 3U CompactPCI processor blade has been verified by Cisco for secure unified communications in federal and defense applications.
Dialog signs up to use Intrinsic-ID on-chip security
News & Analysis  
4/27/2012   1 comment
Fabless chip company Dialog Semiconductor plc has integrated security technology from startup Intrinsic-ID BV into its SC14453S voice-over-IP processor.
Beta rolls MIL-STD-1553 data bus coupler
Product News  
4/27/2012   1 comment
Beta Transformer Technology Corp., a subsidiary of Data Device Corp., has launched the BXC-A-3, MIL-STD-1553 data bus couplers designed for use in systems development, benchtop test and flight maintenance applications.
Chip execs see 20 nm variants, 3-D ICs ahead
News & Analysis  
4/27/2012   12 comments
GlobalFoundries is mulling low power and high performance variants of its 20 nm processes while several chip execs see 3-D ICs coming in 2014 and a path to 7 nm.
Spansion looks for return to profitability in Q2
News & Analysis  
4/26/2012   Post a comment
Flash memory vendor Spansion reported a loss on declining sales for the first quarter, but said it expects a revenue increase and return to profitability in the second quarter.
ARM TechCon 2012 – Call for abstracts closes on Friday 27 April 27 2012
News & Analysis  
4/26/2012   Post a comment
This year's ARM TechCon will be held October 30 – November 1, 2012 at the Santa Clara Convention Center in Santa Clara, CA.
Google drive: I wish I could drive them out of town!
Engineering Pop Culture!  
4/26/2012   21 comments
Google continues to make unreasonable claims with content on the Internet. Once the heroes of the Internet, they have turned into the “evil empire”…
Achronix chairman: Intel foundry gambit poised for payoff
News & Analysis  
4/26/2012   14 comments
Achronix Semiconductor Corp., eight years into its startup phase, is hanging its hat on Intel’s 22-nm FinFET process technology for its survival and envisioned victory as it prepares to go public in 2014.
CAST’s Talos eval kits help designers choose the best MCU Cores
Product News  
4/26/2012   1 comment
Talos Series Evaluation Kits are part of the full line of microcontroller and processor IP cores available through and supported by CAST
Pixel Qi claims it can beat iPad display
News & Analysis  
4/26/2012   9 comments
Pixel Qi, a developer of reflective liquid crystal displays that can be read in sunlight thereby saving power, has announced that it can produce a screen with higher image quality than the iPad 3 retina screen.
Book excerpt: Power integrity for I/O interfaces: with signal integrity/power integrity co-design Part 4
Design How-To  
4/26/2012   Post a comment
The power to signal coupling noise can get amplified due to the channel effects and resonances. This, in turn, gets translated into jitter at the receiver…
Page 1 / 10   >   >>


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