SOI wafer supplier Ibis lays off 14% of workforce News & Analysis 5/31/2001 Post a comment DANVERS, Mass--Silicon-on-insulator wafer supplier Ibis Technology Corp. today announced it was laying off 14% of its workers, cutting executive salaries, and reducing overall spending in response to the chip industry's downturn.
Intel sets up flash program in Taiwan News & Analysis 5/31/2001 Post a comment SANTA CLARA, Calif. -- In a move to capitalize on the new manufacturing model in cellular phones, Intel Corp. has established a supply-chain program for its flash memory customers in Taiwan. But the program is also aimed at keeping its flash chip competitors at bay in Taiwan, most notably Advanced Micro Devices Inc., according to analysts.
Intel sets up flash-memory supply program with Taiwan's cell-phone makers News & Analysis 5/31/2001 Post a comment SANTA CLARA, Calif. -- In a move to capitalize on the new manufacturing model in cellular phones, Intel Corp. has established a supply-chain program for its flash memory customers in Taiwan. But the program is also aimed at keeping its flash chip competitors at bay in Taiwan, most notably Advanced Micro Devices Inc., according to analysts.
Altera now expects revenue decline of 25% News & Analysis 5/31/2001 Post a comment Altera Corp. today reduced its revenue guidance for the second quarter ending June 30, saying it now expects that revenues in
quarter are likely to decline in the range of 25% from first quarter revenues of $287.4 million compared with earlier guidance for a 20% sequential decline.
Fujitsu, Infineon add app-specific DRAMs News & Analysis 5/31/2001 Post a comment Fujitsu Microelectronics Inc. and Infineon Technologies NA Corp. will roll out two new application-specific DRAMs later this year, adding to the list of specialty memory parts each company is now separately gearing up to produce.
Three activate OLED News & Analysis 5/31/2001 Post a comment DuPont Displays is joining forces with Philips Components and US start-up Alien Technology to develop active matrix polymer organic LED (OLED) on plastic technology.
Incubation for frozen switch News & Analysis 5/31/2001 Post a comment US-based incubator Atlantic Technology Ventures has signed an agreement to license optical technology from the University of Rochester, New York, for use in its refrigerated network kit.
Band-gap control boost to displays News & Analysis 5/31/2001 Post a comment Toronto-based company Luxell Technologies has developed a technique to improve the efficiency of thin-film electroluminescent (EL) displays by controlling the band-gap within the active layer.
Tiny moulds make 3D structures News & Analysis 5/31/2001 Post a comment Engineers at the NanoStructure Laboratory at Princeton University have developed a lithographic printing technique to produce 3D structures smaller than 40nm.
Cypress acquires USB designer ScanLogic News & Analysis 5/30/2001 Post a comment Cypress Semiconductor Corp. today announced the acquisition of ScanLogic Corp., a privately-held company specializing in Universal Serial Bus (USB) controllers for embedded applications.
Catalyst posts 27% sequential drop in sales during quarter News & Analysis 5/30/2001 Post a comment SUNNYVALE, Calif.--Catalyst Semiconductor Inc. here today reported a 27% sequential drop in revenues to $17.3 million in the company's fiscal fourth quarter, ended April 30, compared to $23.6 million in the prior three-month period. Catalyst's sales were up 1% from $17.1 million in the fiscal fourth quarter last year.
Cypress acquires ScanLogic to bring USB into non-PC markets News & Analysis 5/30/2001 Post a comment SAN JOSE -- In a move to expand its presence in the Universal Serial Bus (USB) device market, Cypress Semiconductor Corp. here today announced it will acquire ScanLogic Corp. of Burlington, Mass.
With the acquisition of ScanLogic, Cypress will expand its USB presence into some new and emerging non-PC markets. ScanLogic's host/slave USB chip family is designed for use in PDAs, cellular phones, set-top boxes, digital cameras, Internet appliances and automotive communication systems.
Toshiba licenses IP cores from Germany's sci-worx for SOC designs News & Analysis 5/30/2001 Post a comment TOKYO -- In a move to expand its system-on-a-chip portfolio, Japan's Toshiba Corp. has licensed the intellectual-property (IP) cores from sci-worx GmbH of Hanover, Germany.
Under the agreement, sci-worx will license its DesignObjects family of IP cores to Toshiba. The DesignObjects library consists of over 65 soft cores, including a complete portfolio of products for multimedia and networking applications.
Intel to bundle RealNetworks' Internet-enabled software on motherboard lines News & Analysis 5/30/2001 Post a comment SEATTLE -- RealNetworks Inc. here today announced an agreement with Intel Corp. under which RealNetworks' Internet-enabled, media-management software will be bundled with Intel's new PC motherboard lines.
Under the terms, RealNetworks' RealPlayer and RealJukebox software will be offered with Intel's new D815EEA2 and D815EFV line of motherboards. The boards themselves support Intel's Pentium III and Celeron processors.
Micron and Infineon to co-develop low-latency memory News & Analysis 5/30/2001 Post a comment Infineon Technologies AG and Micron Technology, Inc., today announced they signed an agreement to co-develop a new family of
Reduced Latency DRAM (RLDRAM) for high-performance memory applications. Infineon and Micron are aiming RLDRAM at switches, routers and other high-bandwidth latency-sensitive applications.
Altera, Nortel strike R&D alliance and five-year PLD supply pact News & Analysis 5/30/2001 Post a comment SAN JOSE -- Altera Corp. here today announced a long-term agreement with Nortel Networks Corp. to cooperate in development of future products and technologies. In addition to the R&D pact, Nortel has signed a five-year purchasing agreement to gain access to Altera programmable logic devices and system-on-a-programmable-chip (SoPC) solutions.
ADC to restructure operations after sales drop News & Analysis 5/30/2001 Post a comment ADC, the fibre-optic network equipment company saw sales for the second quarter of 2001 decline by 15% from the same quarter's value in the previous. They were in line with the guidance that the company gave last month, coming in at $652m.
Japan's reign on top of chip gear sales will be short lived, predict analysts News & Analysis 5/30/2001 Post a comment SAN JOSE -- Japan stunned most industry observers by becoming the world's largest semiconductor equipment market in the first quarter of 2001. For a variety of reasons, equipment shipments in Japan surged 31.7% in Q1 from the prior quarter while other regions nose-dived, according to new data released last week (see May 23 story). But now, most industry analysts expect Japan's capital spending to plunge as well in the second
Intel finds more money for formal methods News & Analysis 5/30/2001 Post a comment Intel Capital, the investment arm of the world's largest chip maker, has take part in a third round of venture capital funding for France-based Esterel Technologies. The funding is worth €12.3m.
Cirrus to integrate Silicon Wave's Bluetooth technology in processors News & Analysis 5/30/2001 Post a comment SAN DIEGO--Silicon Wave Inc. here announced it has licensed Bluetooth wireless connectivity technology to Cirrus Logic Inc., which plans to integrate the function into its Maverick microprocessors for consumer products, such as Internet audio players, personal digital assistants (PDAs) and electronic books.
Applied to buy Israel's Oramir to expand wafer-defect control systems News & Analysis 5/30/2001 Post a comment SANTA CLARA, Calif.--Applied Materials Inc. today announced plans to acquire Oramir Semiconductor Equipment Ltd., an Israeli-based supplier of advanced laser cleaning technologies for wafer fabs. The acquisition will expand Applied Material's portfolio of wafer-defect control systems, said company officials.
Shipley enters spin-on low-k dielectric arena with porous film process News & Analysis 5/29/2001 Post a comment MARLBOROUGH, Mass. -- Shipley Co. L.L.C. today entered the spin-on dielectric market for next-generation interconnects on ICs with the launch of a new porous material, called Zirkon LK. The porous film can be applied with standard dielectric spin-coating tools for k values between 2.6 and 2.0, according to the company.
LSI Logic acquires RAID storage business News & Analysis 5/29/2001 Post a comment LSI Logic Corp., Milpitas, Calif., and American Megatrends, Inc., Atlanta, today announced an agreement in which LSI Logic will acquire the assets of AMI's RAID (Redundant Array of Independent Disks) business.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.