Chip sales plunge 7% in March from prior month, says SIA report News & Analysis 5/2/2001 Post a comment SAN JOSE -- The troubled chip industry was pummeled in March. Worldwide revenues dropped 7% in March from sales in February as chip suppliers struggled with a rocky combination of inventory corrections and weakening economies, said the Semiconductor Industry Association here today.
Via's new processor roadmap calls for 1.2-GHz chip News & Analysis 5/1/2001 Post a comment SANTA CLARA, Calif. -- Via Technologies Inc. here today disclosed its new microprocessor roadmap, including plans to develop an x86-based product with speeds up to 1.2-GHz.
The company plans to announce a 1.2-GHz processor by year's end, with shipments slated for late 2001 or early 2002, said Dan Havey, director of U.S. marketing for Via, based in Taipei, Taiwan.
AMD delays Hammer processors News & Analysis 5/1/2001 Post a comment Advanced Micro Devices Inc. will delay the release of its Hammer processor family by two to six months, which could push their release to the second half of 2002 under a worst-case scenario.
National to use Artisan design libraries for TSMC processes News & Analysis 5/1/2001 Post a comment SANTA CLARA, Calif.-- In a move to ease its ability to use outside foundry services and speed IC development, National Semiconductor Corp. here has entered into a multi-technology, multi-process licensing agreement for design libraries from nearby Artisan Components Inc.
M-LVDS: A New Standard for High-Speed Multipoint Data Buses News & Analysis 5/1/2001 Post a comment A new standard, M-LVDS, is emerging to solve multiple-driver, multiple-receiver, half-duplex design problems. Texas Instruments' Jim Dietz discusses the unique considerations associated with multipoint topologies, describes M-LVDS, and compares the evolving standard with existing multipoint and single-ended solutions.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.