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posted in May 2001
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Karl Suss tailors probers for test of sensors and MEMS components
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5/2/2001   Post a comment
MUNICH -- The Karl Suss unit of Suss MicroTec AG here today announced it was expanding its wafer prober portfolio into address testing applications for infrared sensor arrays, superconductors, and microelectromechnical systems (MEMS) for pressure- and vacuum-related applications.
Semiconductor sales fell 7% in March
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5/2/2001   Post a comment
Sales of semiconductors were $14.4 billion in March 2001, compared to $15.48 billion in February, and down 4.5% from the $15.1 billion of March 2000.
Candescent formally withdraws initial public stock offering
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5/2/2001   Post a comment
Candescent Technologies Corp., as expected, today formally withdrew its application for an initial public stock offering, blaming "market conditions" for the move.
Two-year-old Transilica rolls out single-chip Bluetooth solution in small BGA
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5/2/2001   Post a comment
SAN DIEGO--Transilica Inc. here claimed development of the world's smallest system-on-chip solution for Bluetooth wireless systems. The company's OneChip device features flash memory, radio-frequency (RF) transceiver, baseband modem, microprocessor, and SRAM.
Chip sales plunge 7% in March from prior month, says SIA report
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5/2/2001   Post a comment
SAN JOSE -- The troubled chip industry was pummeled in March. Worldwide revenues dropped 7% in March from sales in February as chip suppliers struggled with a rocky combination of inventory corrections and weakening economies, said the Semiconductor Industry Association here today.
Xilinx considers shifting one-third product revenues to 300-mm wafers
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5/2/2001   Post a comment
HITACHINAKA CITY, Japan -- A joint venture 300-mm fab here between Hitachi Ltd. and United Microelectronics Corp. has begun producing FPGA products for Xilinx Inc., which today said it plans to quickly move more of its field-programmable gate arrays to the larger diameter wafers.
Jobs blow as seaside slumps
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5/2/2001   Post a comment
Paignton experiencing the vicious side-effects of the technological downturn
Semitool says patented technology will improve copper yields as ICs shrink
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5/1/2001   Post a comment
KALISPELL, Mont.--Semitool Inc. here today announced a patent for an enhancement to copper seed-layer processing that the company says will minimize defects and help extend copper interconnects to IC design rules below 0.10 micron.
Mattson's president of Wet Division resigns five months after three-way merger
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5/1/2001   Post a comment
FREMONT, Calif.--The president of Mattson Technology Inc.'s Wet Division--Roger A. Carolin--has resigned five months after his company was acquired in a three-way merger that greatly expanded Mattson's portfolio of wafer fab tools.
Via's new processor roadmap calls for 1.2-GHz chip
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5/1/2001   Post a comment
SANTA CLARA, Calif. -- Via Technologies Inc. here today disclosed its new microprocessor roadmap, including plans to develop an x86-based product with speeds up to 1.2-GHz. The company plans to announce a 1.2-GHz processor by year's end, with shipments slated for late 2001 or early 2002, said Dan Havey, director of U.S. marketing for Via, based in Taipei, Taiwan.
Analysis: Wide impact seen from last Rambus claims
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5/1/2001   Post a comment
Monday's dramatic ruling by Federal Judge Robert Payne dismissing 54 patent infringement claims by Rambus Inc. against Infineon Technologies could soon be overshadowed by the fate of the three claims he left intact.
Mitsubishi packs TV video processor, MCU on single chip for American market
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5/1/2001   Post a comment
SUNNYVALE, Calif.--Mitsubishi Electric Corp.'s U.S. subsidiary here today claimed that the company has developed the first IC to integrate a color TV image signal processor and 8-bit microcontroller for North American television sets.
The Once and Future Ethernet
Design How-To  
5/1/2001   Post a comment
Alpha Industries to use Kopin HBT wafers for wireless, broadband products
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5/1/2001   Post a comment
TAUNTON, Mass.-- Kopin Corp. here today announced a multi-year agreement to supply Alpha Industries Inc. with wafers for indium gallium phosphide (InGaP) heterojunction bipolar transistors (HBTs).
AMD delays Hammer processors
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5/1/2001   Post a comment
Advanced Micro Devices Inc. will delay the release of its Hammer processor family by two to six months, which could push their release to the second half of 2002 under a worst-case scenario.
FSI to supply rinse/drying technology to Korean wet bench supplier
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5/1/2001   Post a comment
MINNEAPOLIS--FSI International Inc. today announced an agreement to supply wafer-drying technology and integrated modules to Digital Neo-tech System Korea Co. Ltd. (KDNS), which will use the systems in automated wet bench equipment.
Diodes Inc. reports decline in revenues and profits
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5/1/2001   Post a comment
Diodes Inc. today reported revenues for the first quarter of ended March 31 were $25.7 million, a decrease of 6.2% as compared to $27.4 million for the comparable quarter in 2000.
Micron Electronics strikes deal with buyout firm to take PC business
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5/1/2001   Post a comment
NAMPA, Idaho--Following through with its plans to exit the PC business, Micron Electronics Inc. here today announced an agreement to sell its personal computer operations to Gores Technology Group, a buyout firm based in Los Angeles.
National to use Artisan design libraries for TSMC processes
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5/1/2001   Post a comment
SANTA CLARA, Calif.-- In a move to ease its ability to use outside foundry services and speed IC development, National Semiconductor Corp. here has entered into a multi-technology, multi-process licensing agreement for design libraries from nearby Artisan Components Inc.
Micron completes purchase of DRAM joint venture in Japan
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5/1/2001   Post a comment
BOISE, Idaho--Micron Technology Inc. today announced it has completed the purchase of all shares in KMT Semiconductor Ltd. from Kobe Steel Ltd. in Japan, and the former joint-venture DRAM operation is now a wholly-owned subsidiary of Micron.
Virtual Silicon, Hynix to develop nonvolatile memory for SoC logic processes
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5/1/2001   Post a comment
SUNNYVALE, Calif.--South Korea's Hynix Semiconductor Inc.--formerly called Hyundai Electronics Industries--today announced a joint-development partnership with Virtual Silicon Technology Inc. here to create advanced nonvolatile memory for embedded use in system-on-chip designs.
Micron adds 16-Mbit page-mode flash for new wireless handset designs
News & Analysis  
5/1/2001   Post a comment
BOISE, Idaho--In a move to expand its product offering for wireless systems, Micron Technology Inc. here introduced a new 16-megabit flash memory architecture that offers read-while-write capabilities in a page-mode format. A comparable 16-Mbit burst-mode flash chip was introduced last year.
Bookham to build single-chip nodes
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5/1/2001   Post a comment
M-LVDS: A New Standard for High-Speed Multipoint Data Buses
News & Analysis  
5/1/2001   Post a comment
A new standard, M-LVDS, is emerging to solve multiple-driver, multiple-receiver, half-duplex design problems. Texas Instruments' Jim Dietz discusses the unique considerations associated with multipoint topologies, describes M-LVDS, and compares the evolving standard with existing multipoint and single-ended solutions.
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