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posted in May 2002
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TEL's cleaning tool picked by Sematech for low-k process evaluations
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5/31/2002   Post a comment
AUSTIN, Tex. -- Tokyo Electron Ltd. today announced that its PR200Z polymer removal system has been chosen as the process tool of record for International Sematech's Advanced Tool Development Facility and copper-oxide frontend line.
Agere re-enters USB chip market with analog companion to digital ASICs
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5/31/2002   Post a comment
ALLENTOWN, Pa. -- Agere Systems Inc. today introduced a USB 2.0 analog chip for customized digital-only ASICs serving the Universal Serial Bus 2.0 standard. The introduction is a change in course for Agere, which last year announced it was pulling out of the USB 2.0 market to focus more attention of 1394b serial links (see July 16 story).
Agilent supplies ASICs for HP's Itanium 2-based systems
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5/30/2002   Post a comment
PALO ALTO, Calif.--Agilent Technologies Inc. here today disclosed it is using 0.18-micron ASIC technology to ship a three-chip set solution to Hewlett-Packard Co. for workstations and servers based on Intel Corp.'s 64-bit Itanium 2 microprocessors.
Intel fills out development support for network processor lineup
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5/30/2002   Post a comment
SANTA CLARA, Calif.--Intel Corp. today rolled out two new hardware development platforms aimed at easing the job of designing communications systems, based on the company's IXP2800 and IXP2400 network processors. The two new platforms fill out Intel's development tools for its new network processors.
Comms companies seen as next computing giants
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5/30/2002   Post a comment
Alacritech Inc. founder and entrepreneur Larry Boucher believes the blade server implementations of today's biggest computer companies are all wrong, and that communications companies are in the best position to capitalize on this landmark system concept.
Agere works with Silicon Labs to offer new soft modem chip sets
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5/30/2002   Post a comment
ALLENTOWN, Pa. -- Agere Systems Inc. today said it has developed two next-generation chip sets for "soft" modem functions in desktop personal computers and notebook PCs that could dramatically reduce the space and cost of analog dial-up communications.
Philips design team wins EDAC award
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5/30/2002   Post a comment
Getting Graphical in 3G Wireless Designs
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5/30/2002   Post a comment
With pressures mounting in the wireless sector, 3G wireless handset and base station designers need to mitigate all design risks. New graphical modeling techniques can help out.
Circuit inverts temperature sensor output with accuracy
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5/29/2002   Post a comment
Jerry Steele returns: A well known apps engineer cracks his knuckles on a signal conditioning circuit for Maxim.
Current Mirrors with a DCP offer precision and current gain control
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5/29/2002   Post a comment
For applications that require or desire a computer controlled variable current, the use of a digitally controlled potentiometer and a current mirror with degeneration provides a low cost solution. A Xicor apps engineer examines some circuits.
Denali's on-chip bandwidth processor core targets memory efficiency
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5/29/2002   Post a comment
PALO ALTO, Calif. -- Denali Software Inc. here said it has developed an on-die programmable memory controller core to allow system-on-a-chip designers get much higher memory efficiency in their products.
Intel predicts Itanium 2 will double performance of enterprise computing
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5/29/2002   Post a comment
MUNICH -- During a meeting with European systems developers here, Intel Corp. today predicted that its upcoming 64-bit Itanium 2 microprocessor will deliver up to 1.5-to-2 times the performance of today's enterprise computers, based on existing Itanium processors.
Networking Systems Require Tight Control/Data Plane Integration
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5/29/2002   Post a comment
Treating data plane and control plane processors as separate entities won't work in next-generation networking architectures. System architectures must optimally share resources between these two planes to hit 10-Gbps data rates and beyond.
Silicon fingerprint sensor enables low-cost security
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5/28/2002   Post a comment
Forgot your PIN? Lost your access card? Password hacked? Put these security woes to bed. Your fingerprint neatly carries all that's needed to ensure secure access for a host of applications. A capacitive-based sensing chip makes fingerprint access practical.
Intel cuts MPU prices thanks to yields from 300-mm wafers, 0.13-micron process
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5/28/2002   Post a comment
SANTA CLARA, Calif. -- Intel Corp. has cut the prices of 21 microprocessor products by a range of 9-to-53% as the company's investments in 300-mm wafer fabs and 0.13-micron processes helped to drive down production costs, according to a spokesman here today.
Agilent claims first single-chip mapper for Gigabit-over-Sonet solutions
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5/28/2002   Post a comment
PALO ALTO, Calif.--Agilent Technologies Inc. today announced the first single-chip solution for Gigabit Ethernet over Sonet and Synchronous Digital Hierarchy (SDH) networks. The Ethernet-over-Sonet (EoS) mapper chip integrates a serializer/deserializer (SerDes), clock data recovery and OC-3 to OC-48 framer functions, Agilent said
Mentor's Calibre, IMEC labs formalize R&D efforts in 193- and 157-nm lithography
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5/28/2002   Post a comment
WILSONVILLE, Ore.--Mentor Graphics Corp. here today announced its Calibre division has struck an R&D alliance with the IMEC research group in Europe to jointly pursue new resolution enhancement technology (RET) for subwavelength lithography used with 193- and 157-nm exposure tools.
Intel aims R&D center in Spain at low-power processor designs
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5/28/2002   Post a comment
MUNICH -- During the European version of the Intel Developer Forum (IDF) here today, Intel Corp. and a major university in Spain announced plans to team up and open a new R&D laboratory to develop next-generation microprocessor designs.
Nazomi sues ARM for patent infringement in Java acceleration circuits
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5/28/2002   Post a comment
SANTA CLARA, Calif.--Nazomi Communications Inc. here today announced a patent infringement lawsuit against ARM Ltd., accusing the U.K.-based processor core supplier of violating its technology for Java-software acceleration.
Samsung speeds ramp of 512-Mbit DDR-II chips after evaluations with IBM
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5/28/2002   Post a comment
SEOUL -- Samsung Electronics Co. Ltd. today announced plans to begin volume production of 512-megabit DDR-II synchronous DRAMs in the third quarter this year after successfully completing system-level evaluation on prototype 128-Mbit DDR-II devices with IBM Corp.
Intel quits InfiniBand, but will support its deployment
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5/24/2002   Post a comment
Despite Intel's announcement yesterday that it would no longer produce InfiniBand host channel adapters (HCAs), Intel and observers were quick to say that the semiconductor giant will continue to support and play an instrumental role in InfiniBand's deployment.
DRAM prices tumble, but 3Q shortage looms
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5/24/2002   Post a comment
Weak demand sent contract prices for 128Mbit SDRAM plummeting as much as 20% in May.
ITC to review Toshiba vs. Samsung patent case
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5/24/2002   Post a comment
The U.S. International Trade Commission voted to investigate Toshiba's patent infringement complaint against Samsung Electronics and its U.S. subsidiaries.
Asyst will spend $66 million to set up AMHS venture with Japan's Shinko
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5/24/2002   Post a comment
FREMONT, Calif.--Asyst Technologies Inc. today announced a definitive agreement in its previously announced plans to set up a joint venture for wafer fab automated material handling systems (AMHS) with Shinko Electric Co. Ltd. of Japan.
Touchscreens Provide a Robust and Intuitive User Interface
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5/24/2002   Post a comment
Touchscreens give us a simple and effective way to interface with a computer, offering a rugged and intuitive interface for many applications. Charles Small reviews available touchscreen technologies, applications, and benefits, and shows why, for some users and environments, they are "the only game in town."
SIA applauds passage of trade bill
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5/23/2002   Post a comment
The Semiconductor Industry Association today applauded the United States Senate's passage of the Trade Promotion Authority, which will allow the Administration to negotiate to further open foreign markets to U.S. high technology exports.
Synergy Needed For 10-Gbps Backplanes
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5/23/2002   Post a comment
Designers can no longer view passive and adaptive backplane components as separate islands. To hit the 10-Gbps range, designers must develop interconnects, board traces and adaptive equalization techniques in tandem.
IBM, Sony to jointly offer chip solutions for digital TV in Europe
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5/22/2002   Post a comment
LONDON -- Sony Corp.'s Semiconductor & Devices Europe (SDE) subsidiary and IBM Corp.'s Microelectronics Division today announced plans to offer complementary and compatible products for set-top box developers in the European market.
TI claims one of the densest SRAM blocks on processor with 0.13-micron process
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5/22/2002   Post a comment
DALLAS -- Texas Instruments Inc. today announced it is using a 0.13-micron copper CMOS process to fabricate and begin shipments of a 180-million transistor multiprocessor IC for telecom applications, providing more than 200 pulse-code modulation (PCM) channels on a chip.
Cutting Power in Turbo Coding Architectures
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5/22/2002   Post a comment
Turbo coding schemes can be a power hog in 3G wireless system designs. This article lays out a decoding architecture that reduces power requirements through improvements in SNR and BER.
Future Technologies to Help You 'Live Long and Prosper'
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5/22/2002   Post a comment
Inspired by a thought-provoking panel on Killer Technology Applications at the recent Custom Integrated Circuits Conference, TechOnLine's Jim Lipman looks into his crystal ball. What he sees (and discusses) are tomorrow's superstar applications and the kinds of devices on which they will run.
Cymer, LTB to develop measurement tools for DUV light sources
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5/21/2002   Post a comment
SAN DIEGO -- Cymer Inc. here and Germany's LTB Lasertechnik Berlin GmbH today announced plans to jointly develop advanced spectrometer systems for measuring the spectral performance of deep-ultraviolet (DUV) light sources.
Advantest, Synopsys team up on failure diagnostics for complex ICs
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5/21/2002   Post a comment
SANTA CLARA, Calif. -- Advantest Corp. announced it was collaborating with Synopsys Inc. to develop a fast, accurate failure diagnostics system for deep-submicron system-on-chip (SoC) designs. The failure diagnostics tools will leverage Synopsys' TetraMAX automatic test pattern generation (ATPG) technology, said Advantest.
Advanced Energy plans to appeal verdict in MKS patent suit
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5/21/2002   Post a comment
FORT COLLINS, Colo. -- Advanced Energy Industries Inc. today promised to appeal a jury's verdict awarding $4.2 million in damages to MKS Instruments Inc. in a patent lawsuit against the Colorado-based company.
Counteracting Impairments in Comm Interface Designs
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5/21/2002   Post a comment
Skew and lossy interconnects plague today's networking chip interfaces. Fortunately, automatic skew compensation, equalization, and more are here to help.
MKS says it won $4.2 million in patent suit against Advanced Energy
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5/20/2002   Post a comment
ANDOVER, Mass. -- MKS Instruments Inc. today announced it won $4.2 million in damages from a federal court jury in a patent lawsuit against Advanced Energy Industries Inc. of Fort Collins, Colo.
Storage switches need fast, programmable data path processors
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5/20/2002   Post a comment
To effectively consolidate networked attached storage (NAS), SANs and other emerging storage solutions into a single storage infrastructure, will require an intelligent storage networking switch that includes data path processing performance in the tens of Gigabits/second.
Scalable virtual ring detector aims at fault tolerant distributed computing
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5/20/2002   Post a comment
In many distributed computer systems, there are large numbers of computers or processing nodes that control various facets of the system.
Infiniband backs 'blade' servers
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5/20/2002   Post a comment
With the convergence of telecom/datacom switching centers and traditional LAN and Internet-based data centers, a distributed server architecture based on "blades" is emerging.
AMD's Austin fab ramps flash memories, plans last processor in Q3
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5/20/2002   Post a comment
AUSTIN, Tex. -- Advanced Micro Devices Inc. today said its 200-mm wafer Fab 25 here is now ramping volume production of 32- and 64-megabit flash chips using a 0.17-micron process technology after beginning a transition from microprocessor production to nonvolatile memories.
Multiple Protocols Vie for Role in Networking Storage
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5/20/2002   Post a comment
Storage area network (SAN) and network attached storage (NAS) technologies are moving to new distributed-storage architectures.
Gateway architecture integrates telecom, data center
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5/20/2002   Post a comment
Voice and data are now sharing high-bandwidth pipes into an enterprise with frame relay protocols, voice over IP, firewalls for communications systems, and telephony programming interfaces that automate call center traffic.
Distributed CPU blades enable loosely coupled application servers
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5/20/2002   Post a comment
Loosely coupled application servers are a natural application for first-generation blade servers- essentially a repackaging of the widely deployed single board 1U server.
Converged telecom/network data center needs redundancy options
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5/20/2002   Post a comment
Several forces are at play in the move toward using cost effective, commercial off-the-shelf components (COTS) in the new highly available telecom/datacom and networking system servers, routers and switches for the converged voice over IP.
Combining cPCI, RAID provides effective telecom database solution
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5/20/2002   Post a comment
The ultimate solution for building reliable high-performance storage systems for mission-critical database applications in telecommunications requires a combination of industry standards: the CompactPCI system bus architecture; the RAID (Redundant Array of Independent Disks) mass-storage methodology; and the SCSI peripheral bus.
'Linda' spans telecom/Web servers
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5/20/2002   Post a comment
Many limitations of current servers and the failover techniques used to achieve the appropriate level of reliability necessitate compromises when applied to telecom services.
TI aims to beat 300-mm savings estimates with layouts, shrinks, and automation
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5/17/2002   Post a comment
DALLAS -- Texas Instruments Inc. figures it can beat industry estimates for cost savings from 300-mm wafers with chip-layout tricks and by aggressively pushing device shrinks after the company completes qualification of its new 0.13-micron (130-nm) process technology in a 300-mm fab here next month.
Design Considerations for Edge Routers: Part 2
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5/16/2002   Post a comment
As service-edge routers evolve, there must be a close interaction between the router functionality and the element management system. Part 2 of this series explores how designers can achieve this interaction.
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