Voice gateways pose challenges to design engineers News & Analysis 5/6/2002 Post a comment As the adoption of Voice over IP (VoIP) has accelerated, it has taken on a variety of forms in different application spaces. More than 15 million VoIP ports are in use today, primarily in the infrastructure, often without consumers even being aware that they are talking over VoIP lines.
Telephone moves to broadband News & Analysis 5/6/2002 Post a comment Voice-over-broadband (VoB) represents the next incremental step in the evolution of the global voice/data network from a circuit- to packet-switching architecture.
Digital voice market needs novel apps Design How-To 5/6/2002 Post a comment Much of the hype around voice-over-Internet Protocol (VoIP) to date has focused on the technology's ability to deliver exciting new services that are not possible in the narrowband public switched telephone network (PSTN).
Channelized DSL targets multiservice Design How-To 5/6/2002 Post a comment There are essentially three ways to transport voice traffic over a copper phone line using digital subscriber line (DSL) bandwidth: voice-over-Internet Protocol (IP), voice-over-asynchronous transfer mode (ATM) and channelized voice-over-DSL.
Advanced analog voice solutions in a VoIP world Design How-To 5/6/2002 Post a comment VoIP holds out the promise that the wired desktop will converge into one major appliance, allowing companies to do away with traditional analog telephones and FAX machines and avoid installing both Ethernet and twisted-pair copper lines throughout the building.
GaAs IC revenues will recover with 17% growth in 2002, says new report News & Analysis 5/6/2002 Post a comment NEW TRIPOLI, Pa. -- After plunging 33% in 2001, the market for gallium-arsenide (GaAs) integrated circuits is now expected to grow 17% and reach $1.9 billion in 2002 with cellular phones applications helping to revive revenues this year, said a new report from The Information Network here. The research firm is predicts that worldwide GaAs IC revenues will reach $4.2 billion in 2005.
Signal Integrity Sign-Off Verification Design How-To 5/6/2002 Post a comment The proliferation of deep-submicron technology has made the awareness
and verification of signal-integrity (SI) issues an important part of
chip development. Magma Design Automation's Rajit Chandra offers an
overview of SI effects of which you need to be aware throughout the
Flash Storage Alternatives for the Low-Pin-Count (LPC) Bus News & Analysis 5/3/2002 Post a comment Sharon Dagan of M-Systems discusses trends in the embedded market that
have brought about the decline of the ISA bus and its replacement by the Low Pin Count (LPC) bus. Ms. Dagan also reviews LPC bus benefits,
various storage solutions supporting the LPC bus, and a case study
showing migration from ISA to LPC bus on a thin-client platform.
Infineon forms new wireless unit, de-emphasizes cordless phone chip activities News & Analysis 5/2/2002 Post a comment MUNICH -- Infineon Technologies AG today announced formation of a new Local Area Wireless business unit to address applications using Bluetooth radio-frequency (RF) connections and wireless local area networking (WLAN) technologies. The Munich chip maker also indicated that the move was part of a new strategy to refocus resources to avoid price wars in the digital cordless phone segments.
Infineon signs production deal with Taiwan's Nanya News & Analysis 5/2/2002 Post a comment TAOYUAN, Taiwan -- Infineon Technologies AG confirmed today that it has signed an agreement with Nanya Technology Corp. to build a 300mm-wafer facility in Taiwan, a deal that would significantly increase the German chipmaker's market share.
OFDM Uncovered Part 1: The Architecture Design How-To 5/2/2002 Post a comment OFDM is quickly becoming the de-facto modulation scheme for WLAN architectures around the world. In Part 1 of this series we look at the OFDM architecture and how it handles multipath fading problems.
Sarnoff launches UV-light inspection system for wafers, photomasks News & Analysis 5/2/2002 Post a comment PRINCETON, N.J. -- Sarnoff Corp. here this week announced it has applied charged-coupled device (CCD) technology and its camera expertise to develop a new deep-submicron semiconductor inspection system, which uses ultraviolet light and high-speed UV-sensitive cameras to find defects in photomasks and wafers.
Electromagnetic Modeling of RF MEMS Devices Design How-To 5/2/2002 Post a comment The use of MEMS components in RF systems is on the rise due to their low cost, small area, and high performance. Ansoft's Nick Campbell
discusses the design and analysis of a tunable LC filter for wireless
A new true single supply power amplifier solution for dual and tri-band handsets News & Analysis 5/1/2002 Post a comment Until recently, the depletion-mode GaAs antenna drivers used in most cell phones required a negative rail generator. This paper, reprinted from Microwave Engineering in the UK, describes the implementation of a three-stage dual-band single supply RF power amplifier for cellular handsets. With output matching, this device can be easily used in tri-band applications (GSM900/DCS1800/PCS1900). The IC is fabricated using 1m pHEMT enhancement mode technology developed specifically for single 3.6-V sup
LSI Logic becomes first to license ARM's new synthesizable processor core News & Analysis 5/1/2002 Post a comment SAN JOSE -- LSI Logic Corp. today announced plans to use ARM Ltd.'s new synthesizable 32-bit ARM1026EJ-S microprocessor core in system-on-chip designs for advanced communications, storage, and consumer electronics applications. Making the announcement at the Embedded Processor Forum here, LSI Logic said it was the first semiconductor company to license ARM's new core, which was introduced at the meeting on Tuesday.
Transactions Take Object-based Route News & Analysis 5/1/2002 Post a comment Today's system designs are almost always centered on processing complex transactions, but verifying such designs at the level of individual signals, bits and bytes with Verilog or VHDL testbenches is rapidly becoming impractical.
Notebook processors sizzling, and that's a problem News & Analysis 5/1/2002 Post a comment Mobile-processor suppliers say they are prepared to accept the challenge, which is expected to arise with the advent of 5GHz chips that consist of 300 million or more transistors and are manufactured on 90nm-and-finer linewidths. Among the array of solutions are techniques like clock gating, dynamic frequency scaling, new IC packaging, and the use of larger on-chip caches that designers say will allow CPUs to consume a respectable 3W of power or less through 2004.
Without new methods for curbi
Infineon and Nanya poised to sign DRAM deal News & Analysis 5/1/2002 Post a comment TAOYUAN, Taiwan -- Infineon Technologies AG is poised to team up with Nanya Technology Corp., the latest bid by the German chipmaker to expand in the fast-consolidating DRAM market.
Infineon will establish a joint venture with Nanya to build 300mm wafer facilities in Taiwan and develop process technologies, Nanya chairman Y. C. Wang said in a public appearance today. The two companies are slated to sign a memorandum of understanding (MOU) tomorrow, when details will be revealed.
So many callers, so little time: PFT engine slices wideband frequency channels News & Analysis 5/1/2002 Post a comment RF Engine's Vectis family DSP cores, announced April 17, perform complex filtering faster than any general-purpose processor. In addition to channel selection and filtering for cellular applications, Vectis' developer - a military contractor gone commercial - believes the cores support VDSL communications as well as signal intelligence for defense. The vectis4000R2 core, which processes data continuously at a 200 Msamples/s rate, can be implemented with room-to-spare on Xilinx Virtex/E FPGA. Th
Embedding Call Monitoring in VoIP Designs News & Analysis 5/1/2002 Post a comment With QoS issues plaguing VoIP systems, designers need to find ways to monitor traffic that can accurately determine voice quality. Embedded passive monitoring agents could hold the key to success.
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.