Image gallery: Xperia Play handset teardown News & Analysis 5/26/2011 5 comments The first "PlayStation certified" smartphone features Qualcomm's Snapdragon, Broadcom's BlueTooth/WiFi/FM combo chip and memory ICs from Micron and Elpida, among others, according to a teardown analysis.
High-temp MEMS goes seismic News & Analysis 5/26/2011 4 comments Analog Devices claims to have designed the world's first MEMS chip that can tolerate temperatures as high as 342 degrees Fahrenheit.
Smart meters wait on home net spec News & Analysis 5/26/2011 17 comments Some smart meter projects are on hold while engineers re-work a road map for Smart Energy Profile 2.0, a key standard for tomorrow's home energy networks.
Freescale CEO bullish on IPO News & Analysis 5/26/2011 6 comments Rich Beyer, Freescale Semiconductor's chairman and CEO, said he was happy with the opening of the company's IPO despite the fact that the opening price was lowered. Shares climbed up more than 5 percent by mid-day trading.
Zombie tales for people with brains Blog 5/26/2011 7 comments When I come to think about it, I’ve actually been seeing quite a lot of these little rascals recently, starting with The Walking Dead television series followed by all sorts of books…
Analyst sees flat April for global chip sales News & Analysis 5/26/2011 1 comment The three-month average of global chip sales for April are likely to be $25.3 billion April, similar to the $25.26 billion reported in March by the World Semiconductor Trade Statistics organization, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
IMEC makes GaN-on-silicon Research 5/26/2011 3 comments European research institute IMEC and its partners in a program on gallium-nitride fabrication have produced device quality GaN/AlGaN layers on 200-mm silicon wafers.
Got Discworld? Blog 5/25/2011 24 comments I am a HUGE fan of the author Terry Pratchett in general and of his Discworld books in particular. If you've not been exposed to these little rascals you are missing a real treat...
IMEC and the ARM connection Blog 5/25/2011 6 comments European research institute IMEC is holding its annual technology forum. It has one of those slides with more than a hundred partner logos and ARM's was nowhere to be seen. So what was ARM CEO Warren East doing at the event?
Audio test & measurement seminar in UK (June 2-3) News & Analysis 5/25/2011 Post a comment A two-day audio test and measurement training seminar held by Prism Sound and its UK distribution partner, TTi distribution, will introduce engineers to the practical and theoretical aspects of accurately measuring audio for a wide variety of applications.
Mixed-signal MCUs on 90nm process Product News 5/25/2011 Post a comment Targeting designers of industrial and consumer applications who need solutions with low power consumption and increased integration, Freescale has introduced the ColdFire+ MCF51Qx and MCF51Jx microcontroller families.
IBM to test wafer pruning News & Analysis 5/25/2011 10 comments IBM will test a wafer pruning technique developed at the University of California at Los Angeles said to spot bad wafers early with test structures in-between die that can reject wafers before costly metallization steps.
DESIGN TIP: The Tortoise and the Hare Test & Measurement Designline Blogs 5/25/2011 2 comments Your primo product has a problem—a bad problem. You know you have an all-hands-on-deck situation, but how do you reach a solution as quickly as possible?
Nomura sees 2011 chip market growth of 4.4% News & Analysis 5/25/2011 5 comments Brokerage firm Nomura Securities has raised its forecast for growth in the value of the global semiconductor market to 4.4 percent, an increase from its previous projection of 3.1 percent given in December 2010.
Wipro helps IMEC open up in India Research 5/25/2011 8 comments European research institute IMEC has announced it has established an R&D facility in Bangalore, India, with the help of Wipro Technologies, the consulting and outsourcing business of Wipro Ltd.
Measuring return on investment of model-based design Design How-To 5/25/2011 Post a comment Model-Based Design for embedded software development lowers costs by identifying defects early in the development process and reducing the total number of latent defects. By helping companies deliver higher-quality systems at lower cost and in less time, Model-Based Design provides a competitive advantage.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.