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Internet of Things Designline
posted in May 2013
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IBM breakthrough could alleviate mobile data bottleneck
News & Analysis  
5/31/2013   8 comments
Integrated phased-array transceiver contains all millimeter- wave components necessary for high data-rate communications.
STEM on Tektronix agenda
News & Analysis  
5/31/2013   5 comments
What is Tektronix doing to ensure the next-generation of experts in physics and electronics?
MCUs igniting creative explosion
The Engineering Life - Around the Web  
5/31/2013   Post a comment
Lowered costs and simplified development are democratizing MCU design, resulting in a burst of creativity.
Slideshow: Semi-autonomous features boost driver safety
Blog  
5/31/2013   1 comment
While self-driving cars grab headlines, semi-autonomous features are quietly working their way into production vehicles and boosting safety today.
What were they thinking: Overly complex design
Engineering Pop Culture!  
5/31/2013   12 comments
I think Wile E. Coyote was the kind of person who created many of the patents I find to write about in my “what were they thinking” series. You know what I mean – those absurdly complicated gadgets...
Video: Funny magic trick
Programmable Logic DesignLine Blog  
5/31/2013   Post a comment
I just ran across a video on YouTube (where else) billed as "Easily the funniest magic trick I've ever seen!" So, of course, I had to take a look…
Intel wins CPU slot in Samsung tablet
News & Analysis  
5/31/2013   21 comments
Atom processor gain design win in Samsung Galaxy tablet computer, according to reports.
Analyst: Chip sales were weak in April
News & Analysis  
5/31/2013   Post a comment
Financial analyst sees signs of weakness in the chip market and predicts market contraction in 2013.
NXP gears up for GaN production
Design How-To  
5/31/2013   2 comments
The U.K. government is to provide 20 percent of the budget to support the creation of 100 power semiconductor jobs at NXP's Hazel Grove wafer fab in England.
Exar releases step-down regulator for EMC/EMI sensitive applications
Product News  
5/31/2013   Post a comment
Exar’s latest power management chip delivers 3A of current with a 2.5MHz programmable operating frequency.
Texas Instruments ADS4449 14-bit A/D converter
Product News  
5/31/2013   Post a comment
According to TI, the ADS4449 is the highest-performance 4-channel A/D converter at 250 MSPS, providing an additional 4-dB SNR and 8-dB SFDR, compared to existing 4-channel A/D converters.
Linear Technology LTC2378-20 SAR A/D converter
Product News  
5/31/2013   Post a comment
Linear Technology’s 20-bit 1Msps no-latency SAR A/D converter boasts exceptionally low 0.5ppm (typ) and 2ppm (max) INL error.
Solid-state drive interface gets first interop test
Design How-To  
5/30/2013   2 comments
Eleven vendors tested solid-state drives using NVM Express in the first plugfest for the interface expected to appear in products later this year.
When is a multichannel power supply more convenient than a single-channel power supply?
Design How-To  
5/30/2013   Post a comment
Given that no equipment budget can afford every “bell and whistle,” it makes sense to ask which applications really need a multichannel power supply--and which ones don’t.
Higgs boson hunting with digitizers
Blog  
5/30/2013   7 comments
Sophisticated techniques like page-flip buffering enable analog-to-digital converters to offload data and re-arm at frequencies as high as 50 Mhz.
Slideshow: A look back at electronic test, part 1
Design How-To  
5/30/2013   Post a comment
The first segment surveys state-of-the-art test equipment for the period from 1988 to 2000.
Intel, ARM on even footing in Net of Things, says IDC
News & Analysis  
5/30/2013   12 comments
More than 25 billion intelligent systems valued at $4 trillion could ship in 2020, said an IDC analyst helping create a new trade group for the sector.
QuickLogic’s "CUB" system provides easy eval of ArcticLink III VX for customer designs
Product News  
5/30/2013   Post a comment
Multi-function boards support all variants of the ArcticLink III VX and BX families; provides fast and easy prototyping and compatibility testing.
Romanian teenager snags Intel science award
Design Contests & Competitions  
5/30/2013   8 comments
Ionut Budisteanu took home $75,000 for using artificial intelligence to create a model for a low-cost, self-driving car.
Piezoelectric straw-covered skyscraper harvests energy
Engineering Investigations  
5/30/2013   1 comment
Strawscraper, the invention of Swedish architecture firm Belatchew Arkitekter, aims to extend a building in Stockholm with an energy-producing outer shell made of piezoelectric straws that can recover wind energy.
Making yesterday’s parts with today’s green technology
Product News  
5/30/2013   Post a comment
When a critical component is declared end-of-life (EOL) by a manufacturer, a ripple effect begins. Re-manufacturing the part in an environmentally-friendly manner has become a challenge…
Samsung Galaxy S4 Mini dials back specs
Blog  
5/30/2013   1 comment
Billed as a smaller version of its powerful flagship smartphone, Samsung's Galaxy S4 Mini is nothing short of a land grab.
Production availability of SmartFusion2 SoC FPGAs from Microsemi
Product News  
5/30/2013   Post a comment
Microsemi has announced the availability of its first production-qualified SmartFusion2 System-on-Chip FPGAs, the M2S050 and M2S050T.
Avnet Electronics Marketing releases production-grade ZedBoard
Product News  
5/30/2013   Post a comment
Production-grade ZedBoard is the industry’s first development kit to offer production silicon of the Xilinx Zynq-7000 All Programmable SoC.
NXP tops automotive ASSP rankings again
Design How-To  
5/30/2013   Post a comment
Dutch chip vendor tops IHS automotive infotainment ASSP ranking for second straight year based on strength in AM/FM tuner, audio processing chips.
Lattice’s latest design software allows designers to derive big benefits from tiny FPGAs
Product News  
5/30/2013   Post a comment
Lattice Diamond v2.2 and iCEcube2 (v2013-03) tools provide access to innovative, compact, low-power FPGA solutions.
IEEE 1801-2013: A bold step towards power format convergence
Blog  
5/30/2013   Post a comment
The new IEEE 1801-2013 Standard for Design and Verification of Low Power Integrated Circuits is much more than an incremental release of UPF. It is nothing less than the first truly open, convergent power format standard …
ADI unveils ADL5544, ADL5545, ADL5610 and ADL5611 broadband RF gain blocks
Product News  
5/30/2013   Post a comment
RF amplifiers offer a combination of high linearity, power, and noise-figure performance over a wide frequency range.
Optocoupler targets military, medical apps
Product News  
5/30/2013   Post a comment
Isolink’s optocoupler is aimed at applications requiring optical isolation in gamma, neutron and proton radiation environments with high current transfer ratio and low saturation Vce.
Samsung unveils 4-Gb LPDDR3 mobile DRAM
Product News  
5/30/2013   Post a comment
20-nm-class memory can transmit data at up to 2,133 Mb/s per pin.
Stackpole RAF Series chip resistor arrays provide size, weight reduction
Product News  
5/30/2013   Post a comment
Stackpole is offering a small chip resistor array, consisting of two or four isolated 0201 equivalent resistors in a single rectangular-shaped chip with no scallops or holes.
Microsemi unveils TRRUST-Stor Series 200 high-security, self-encrypting solid state drive line
Product News  
5/30/2013   Post a comment
New 256GB, 200MB/s TRRUST-Stor series 200 SATA SSD shipping to customers.
Increasing LED bulb lifespan improves solid-state lighting
Design How-To  
5/30/2013   5 comments
Solid-state lighting can extend an LED bulb's lifetime by managing internal thermal conditions in closed lighting fixture.
Global GDP woes dragging on chip growth
News & Analysis  
5/30/2013   12 comments
IC Insights trimmed its forecast for 2013 chip market growth after preliminary Q1 GDP estimates from several regions came in soft.
Taiwan's electronic medicine outperforms drugs
Design How-To  
5/30/2013   4 comments
research labs at National Taiwan University are pioneering innovations in medical electronics.
Innovation gap calls for new processes, survey shows
Blog  
5/29/2013   10 comments
Electronics and high tech companies aren't getting as much return on their drive for innovation as they should, a sign they need new processes.
Innovation gap calls for new processes, survey shows
Blog  
5/29/2013   10 comments
Electronics and high tech companies aren't getting as much return on their drive for innovation as they should, a sign they need new processes.
Infineon launches 3-D sensor for gesture recognition
Design How-To  
5/29/2013   1 comment
German chipmaker, working with fabless specialist in time-of-flight image sensors, has introduced 3-D image sensor chips designed to implement touchless gesture recognition.
Collaborative Advantage: Low-power futures industry meeting at DAC
Blog  
5/29/2013   Post a comment
Si2 and the IEEE DASC are co-sponsoring an open industry meeting on low power standardization futures…
EDA/IP weekly roundup – May 29th 2013
Blog  
5/29/2013   Post a comment
ARM, ATopTech, Atrenta, Avery, Cadence, ClioSoft, Concept, EnSilica, G-Analog, Kilopass, Mentor, National Photonics, PRO DESIGN, ProximusDA, S2C, Silicon Frontline, STMicroelectronics, Synopsys, TSMC, UMC and Xilinx made the lineup today. See here for their news…
Improving the Doherty amplifier
Design How-To  
5/29/2013   Post a comment
Freescale claims its advanced Doherty alignment module improves upon symmetric Doherty amplifiers. Here's what they have to say.
Improving high-end active speaker performance using digital active crossover filters
Design How-To  
5/29/2013   2 comments
In a high-end active speaker, availability of DSP resources within a Class-D amplifier architecture allows easy implementation of digital active crossovers with significant audio performance advantages over their more traditional passive counterparts, while also providing benefits in accuracy, repeatability and efficiency.
Xilinx to test FinFET FPGAs in 2013
Design How-To  
5/29/2013   4 comments
Xilinx's 'FinFast' program with foundry TSMC is aimed at delivering FPGA products made using 16-nm FinFETs in 2014, the same year that Altera will get 14-nm FinFET FPGAs from Intel.
Intel is buyer of ST-Ericsson GPS unit
Design How-To  
5/29/2013   Post a comment
No sale price given but Intel purchase will save STMicroelectronics $90 million in close-down costs. 130 staff set to join Intel.
Mobile-focused Samsung sells MCU business
Design How-To  
5/29/2013   12 comments
Sale of Samsung 4- and 8-bit microcontroller business to Ixys Corp. follows on from decision for its system LSI division to focus on mobile chips.
Tablets expected to outship notebooks in 2013
News & Analysis  
5/29/2013   8 comments
IDC cuts PC market forecast as consumers turn increasingly to tablets, smartphones.
SRC sponsors research in Abu Dhabi
News & Analysis  
5/29/2013   1 comment
The Semiconductor Research Corporation is jointly funding semiconductor development efforts with the Globalfoundries parent company.
AMD rolls 'Kyoto' server processors
News & Analysis  
5/29/2013   Post a comment
Firm claims small core processors outperform Intel's Atom server chips with better power efficiency.
Five ARM Tech Con papers I’d really like to see
Blog  
5/29/2013   5 comments
I’d love to see a description of a Samsung 64-bit ARM SoC, a new mobile graphics benchmark and a paper from an Apple engineer this fall.
Preparing for DAC: Keynotes and the IoT
Blog  
5/29/2013   2 comments
If the Internet of Things or increased mobile connectivity excites you, or scares you, you may want to go the three keynotes at DAC this year…
Page 1 / 7   >   >>


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