Motorola, AMD's Ruiz settle suit over recruitment dispute News & Analysis 6/29/2001 Post a comment SCHAUMBURG, Ill. -- Motorola Inc. and the former president of its semiconductor business, Hector de J. Ruiz, here have reached an out-of-court settlement in their suit over the alleged illegal recruitment of Motorola executives to Advanced Micro Devices Inc.
In January of 2000, Ruiz surprised the industry and Motorola by deciding to join AMD as president and chief operating officer.
Architecture melds DSP with MCU News & Analysis 6/29/2001 Post a comment Next-generation wireless applications combining voice, video and data require a processor that can efficiently implement advanced third-generation (3G) algorithms.
DSPs drive merger of voice, data News & Analysis 6/29/2001 Post a comment Voice-over-packet technology converts narrowband voice, fax and data traffic from the circuit-switched format used in telephone and wireless cellular networks to packets that can travel over next-generation Internet Protocol (IP) or asynchronous transfer mode (ATM) optical networks.
Orders from TI and others may boost Teradyne, but outlook is still cloudy News & Analysis 6/29/2001 Post a comment BOSTON -- Teradyne Inc.'s outlook remains cloudy in spite of a recent uptick orders for its automatic test equipment (ATE) from several established and new customers, reportedly including Texas Instruments Inc., according to analysts.
It's been a rough time for Teradyne and other ATE companies. The downturn in the ATE business caused Teradyne earlier this month to reduce its workforce and lower its forecast for the second quarter of 2001.
Inficon claims first multi-sensor e-diagnostics system for fabs News & Analysis 6/29/2001 Post a comment EAST SYRACUSE, N.Y.-- Inficon Holding AG today said it will be the first to offer a multi-sensor system for e-diagnostics in wafer fabs and process tools. The company plans to introduce its eFabGuard Global Support Network and the multi-sensor e-diagnostics system during Semicon West next month in San Francisco.
ARM extends Java deal for wireless with J2ME licence News & Analysis 6/29/2001 Post a comment ARM Holdings has taken out a licence for the J2ME technology from Sun Microsystems in a move that will see the companies look at adapting Java further for "the segments that ARM serves", according to Reynette Au, ARM's vice-president of corporate marketing.
Flexible flat-panel display program gets extra U.S. funding News & Analysis 6/28/2001 Post a comment EWING, N.J.--Universal Display Corp. here today announced it has been awarded an additional $1.5 million by the U.S. Defense Advanced Research Projects Agency (DARPA) to develop flexible organic light-emitting device (OLED) technology for flat-panel displays. The 18-month development program for OLED technology now totals $3 million.
Vishay acquires Infineon's infrared components business for $120 million Product News 6/27/2001 Post a comment MALVERN, Pa. -- Vishay Intertechnology Inc. late today announced that it will acquire the infrared components business of Germany's Infineon Technologies AG for $120 million.
Under the terms, Vishay will take over Infineon's development, marketing and distribution activities in the infrared space. Infineon's infrared components business is headquartered in San Jose.
Schlumberger, IMS to set up a network of worldwide IC-testing centers News & Analysis 6/27/2001 Post a comment SAN JOSE -- The new alliance between Integrated Measurement Systems Inc. (IMS) and Schlumberger Semiconductor Solutions will create a new and low-cost outsourcing model for chip-testing, according to company officials.
Last week, the two companies announced plans to set up the first in a series of independent test centers that will provide IC debug, validation, characterization, probing, and related services for chip makers
Dense-Pac to expand workforce to handle 3-D memory growth News & Analysis 6/27/2001 Post a comment GARDEN GROVE, Calif.--Dense-Pac Microsystems Inc. here today announced it will increase its direct labor force by 10-to-15% to handle growing demand for stacked memory products. The three-dimensional chip-packaging company said new demand for stacked memory "appears to be a firming business climate."
Intel confirms second 300-mm R&D fab in Oregon for 0.07-micron ICs News & Analysis 6/27/2001 Post a comment SANTA CLARA, Calif. -- Intel Corp. Wednesday confirmed that it has filed permit applications to build a $2 billion development fab capable of 0.07-micron design rules in Hillsboro, Ore. The fab represents Intel's second 300-mm wafer plant at this site.
The announcement has been expected for weeks (see May 14 story ). As first reported at SBN, Intel is moving ahead with the new 300-mm development fab in Oregon, dubbed D1D.
NeoMagic ready to sample ICs for Net appliances News & Analysis 6/27/2001 Post a comment NeoMagic Corp. is poised to jump back into the semiconductor market after more than a year away. But instead of graphics components aimed at notebook computers the product generally associated with the company NeoMagic is moving into an entirely different segment with a family of parts designed for the handheld Internet appliance market.
ATI sales up sequentially 10% in quarter News & Analysis 6/27/2001 Post a comment MARKHAM, Ontario -- Graphics and multimedia chip supplier ATI Technologies Inc. today reported an adjusted net loss of $4.2 million for the company's fiscal third quarter, ended May 31, on sales of $255.9 million, which was a 10.1% sequential increase form the prior three-month period.
Winbond starts production ramp of Rambus DRAMs, offers first samples News & Analysis 6/27/2001 Post a comment HSINCHU, Taiwan -- Winbond Electronics Corp. here today announced it has begun ramping volume production of Rambus DRAMs, with samples now available of 128- and 256-megabit memories based on Rambus Inc.'s chip architecture. Winbond becomes the first Taiwan chip company to launch Rambus DRAM production.
Semtech refocuses power management portfolio, drops some commodity ICs News & Analysis 6/27/2001 Post a comment NEWBURY PARK, Calif.--Semtech Corp. here reaffirmed that revenues for the second quarter would be in a range of $38-to-$40 million--which is 33-to-38% below $60.5 million in Q1. The company also said it has decided to take a $14.0 million charge for write-down of inventories and discontinued products after a review of its chip portfolio.
Taiwan's ASE plans two IC-assembly plants in China News & Analysis 6/27/2001 Post a comment SANTA CLARA, Calif. -- Officials with Taiwanese IC-packaging and test giant Advanced Semiconductor Engineering Inc. (ASE) here outlined a bold strategy to enter the China market, telling SBN that the company plans to open two plants at two separate locations. The first facility is expected to be in production by early 2002.
Alpha's demise thwarts Samsung's processor dreams, analysts say News & Analysis 6/26/2001 Post a comment SAN JOSE -- Samsung Electronics Co. Ltd.'s costly efforts to enter the microprocessor field may have abruptly ended this week, especially after Compaq Computer Corp.'s decision to kill the 64-bit Alpha processor by 2004 or so.
In 1998, Samsung created a U.S. joint venture with Compaq--called Alpha Processor Inc. (API)--to help it enter the high-end processor market. The venture was also aimed at expanding Samsung's non-memory chip business.
SpeedFam-IPEC posts $11.7 million loss in fiscal quarter News & Analysis 6/26/2001 Post a comment CHANDLER, Ariz.--SpeedFam-IPEC Inc. here today posted a 13% decline in revenues to $51.3 million in the company's fiscal fourth quarter, ended June 2, compared to $58.8 million in the prior three-month period. The supplier of chemical mechanical planarization (CMP) tools said its revenues were 46% below $94.9 million in the same quarter last year.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.