China's BCD Semi scraps IPO News & Analysis 6/30/2008 Post a comment China's BCD Semiconductor Manufacturing Ltd. has withdrew its plan for a U.S. initial public offering of its common stock, according to a filing from U.S. Securities & Exchange Commission (SEC).
8-bit MCU features dual bus design for complex multi-chip A/V subsystem control Product News 6/30/2008 1 comment Its dual SMBus feature, small form factor and support for a wide range of operating voltages make the SST89C58RC MCU an ideal solution for numerous applications, including HDMI, HDTVs, A/V receivers, home appliances, industrial instruments, notebook PCs, DVD players, Blu-ray players, RF modules and security applications such as fingerprint identification.
Designing a MMIC VCO Design How-To 6/30/2008 Post a comment Looking for insights on the simulation and layout of a VCO? Then this article is for you! Click here to read about a methodology and design flow to design negative resistance type VCOs using standard MMIC components and Agilent-ADS software for simulation and layout generation.
Private equity to take major stake in NDS News & Analysis 6/30/2008 Post a comment News Corporation is planning to sell a significant share in its NDS Group plc subsidiary to private equity group Permira. NDS Group is a supplier of software, conditional access systems and architectural blueprints for digital pay-TV systems around the world.
Modeling and Simulating Magnetoresistive Sensors in Automobiles Design How-To 6/30/2008 Post a comment Electronics and in particular, sensor technology, have made a decisive contribution to advances in the automobile as a means of accessing vehicles and interacting with its surroundings. The Magnetoresistive Effect supports a variety of sensor applications in automobiles. Since their first use in thin-film technology 30 years ago, MR-sensors have constantly captured new fields of application in magnetic field measurement.
Wanted: Battery powered votes Power Management DesignLine Blog 6/30/2008 Post a comment US presidential candidate John McCain put batteries squarely in the spotlight last week when he pledged a $300m reward for the development of a better battery-powered car.
Opinion: ST-NXP Wireless needs a new name News & Analysis 6/30/2008 3 comments ST-NXP Wireless, the new communications IC joint venture floated by STMicroelectronics NV and NXP BV, is starting life with a name that confuses its identity with those of the parent companies. Even before the ink dries up on its birth certificate, CEO Alain Dutheil should consider changing the name.
Lost in Space RF & Microwave Designline Blog 6/30/2008 Post a comment Admittedly, the bread is still being buttered by the commercial side of the business, but business also seems to be steadily growing in the defense and aerospace markets.
Fluke : ScopeMeter suits CAN-bus troubleshooting Product News 6/30/2008 Post a comment As well as enabling detailed signal measurements, the rugged Fluke 125 Industrial ScopeMeter features a "bus health" mode function which gives a clear good/bad indication for the electrical signals on a CAN-bus and other buses.
Samsung invests in Inside Contactless News & Analysis 6/30/2008 Post a comment Samsung Ventures America announced it has invested in French fabless supplier of smartcard chips Inside Contactless SA. Building upon investments from Nokia Growth Partners, Motorola Ventures and institutional investors, this participation brings the total investment in the company to about $42 million.
ADI accelerates high-speed data conversion Design How-To 6/30/2008 2 comments The sleepy data converter sector is suddenly heating up, as Analog Devices Inc. (ADI) has leapfrogged the competition to help enable a new class of industrial, medical and related equipment in the marketplace.
Airless tire reinvents wheel News & Analysis 6/30/2008 Post a comment Resilient Technologies together with the University of Wisconsin's Madison Polymer Engineering Center, are developing an airless tire to solve the problem with a four-year, $18-million grant from the Pentagon.
Are IC thermal problems hot air, question panelists News & Analysis 6/30/2008 Post a comment At the Design Automation Conference mid-June in Anaheim, California, an educational panel addressed the thermal issue in integrated circuit (IC) design. Two key questions were raised: When will this issue be emerging as a crucial concern if at all? What are the solutions to solve this potential crisis?
Europe again lags in chip sales for May '08 News & Analysis 6/30/2008 Post a comment Europe was again the laggard in semiconductor growth in May, with the WSTS figures showing it fared worst in both the three month moving average and year-to-year calculations compared to other regions, and that it showed the largest decline, of 0.3 percent, for sales between April and May 2008.
Chip sales increased 7.5% in May, says SIA News & Analysis 6/30/2008 Post a comment The three month moving average of global chip sales was $21.8 billion in May, 7.5 percent up on the $20.3 billion reported for May 2007, according to the Semiconductor Industry Association (SIA) and based on figures from WSTS.
Top DSP how-to's of 2008 Design How-To 6/29/2008 1 comment Here are top tutorials of the year so far. Topics include Spectral analysis, modulation, multirate DSP, ADCs and DACs, video compression, and DSP system design.