ASE gains $365 million syndicated loan News & Analysis 6/29/2009 1 comment Taiwan's Advanced Semiconductor Engineering Inc. (ASE) has signed a syndicated loan agreement with 17 banks. The five-year loan is worth NT$12 billion ($364.7 million).
Altera rolls low power, anti-tamper FPGAs Product News 6/29/2009 Post a comment Altera this week is rolling out a new product family, Cyclone III LS, billed by the company as the industry's first low power FPGAs with anti-tamper, design-security and design-separation features.
Mentor adds support for control logic to Catapult C Product News 6/29/2009 Post a comment EDA vendor Mentor Graphics announced extensions to its Catapult C Synthesis tool to support full-chip high-level synthesis, a move billed by company executives as the most significant enhancements to Catapult C since the tool was introduced in 2004.
Industry agrees on unified cellphone chargers News & Analysis 6/29/2009 Post a comment The members of industry association Digitaleurope have signed a memorandum of understanding aiming at developing a common charging solution for mobile phones. The move dangles the availability of a charger that can be used across all almost brands.
Semico projects five-fold netbook growth News & Analysis 6/29/2009 Post a comment As many as 59 million netbooks will ship in 2013, nearly 22 percent of the mobile PC market and up almost five-fold from 2008, according to a new report by Semico Research that profiles the major chip contenders in the sector.
Green shoots start to sprout in green sector News & Analysis 6/29/2009 Post a comment Canada's alternative energy sector is showing signs of a budding recovery, as companies resurrect financing deals and public offerings that withered with the recession, but that revival remains very fragile.
Stantum, Sitronix team for multi-touch controllers News & Analysis 6/29/2009 Post a comment Stantum Technologies, the French multi-touch sensing technologies specialist, has teamed with Taiwanese group Sitronix (Hsinchu), which focuses on LCD driver and SoC design, to develop voltage matrix multi-touch single-chip solutions.
Siemens platform addresses Hi-Mix Low-Volume production News & Analysis 6/29/2009 Post a comment After several months of field testing, Siemens Electronics Assembly Systems GmbH (Munich) has launched sales for its Siplace SX component insertion machine platform. With a high degree of flexibility, the platform particularly addresses production environments characterized by frequent product changes and low volumes.
Sematech addresses EUV inspection gap News & Analysis 6/26/2009 Post a comment Following recent warning shots from Intel Corp., Sematech on Friday (June 26) sounded the alarm bells--again. The chip-making consortium warned that there is still a major funding shortfall and a lack of mask inspection gear to enable extreme ultraviolet (EUV) lithography.
Robust growth predicted for 193-nm resist News & Analysis 6/26/2009 Post a comment The market for 193-nm photoresist is expected to grow at a compound annual rate of 27 percent over the next five years, reaching nearly $1.2 billion in 2013, according to a report by an electronic materials consulting firm.
Interview with Rajeev Madhaven Design How-To 6/26/2009 Post a comment Sean Murphy has served as an advisor to dozens of startups, helping them explore new options and bring their businesses to new levels. Here, he interviews Rajeev Madhavan, Chairman and CEO of Magma Design Automation.
Safety in a new way Design How-To 6/26/2009 Post a comment Based on its openness and widespread installation, PROFIsafe is currently the global market leader with over 630,000 PROFIsafe nodes. Ten years ago, however, it was necessary to convince safety authorities, 25 renowned safety engineering companies, and users to accept the completely new technology
Imagination sales, profits up as PowerVR pays off News & Analysis 6/26/2009 Post a comment Graphics IP core licensor Imagination Technologies Group plc (Kings Langley, England) made a net profit of £8.24 million (about $13.6 million) on revenue of £64.09 million (about $105.7 million) for the year to April 30, 2009.
Bluetooth integrates them all Automotive DesignLine Blog 6/26/2009 1 comment A generation of car users drives around with a navigation system stuck at their windshield with arguable estethics and negative consequences for safety. Now a research project aims at creating an interface to integrate these devices. It's high time.
Q-Cells strengthens its CIGS leg News & Analysis 6/26/2009 Post a comment Solar cell manufacturer Q-Cells SE (Wolfen-Bitterfeld, Germany) has bought the remaining shares of thin film module manufacturer Solibro GmbH. With the move, Q-Cells emphasizes its commitment to the CIGS (Copper, Indium, Gallium, Sulphur/Selen) technology.
French asynchronous design startup raises $6.9 million News & Analysis 6/26/2009 Post a comment Tiempo AS, French startup specializing in the design of asynchronous ICs, announced it has raised 5 million euros ($6.9 million) in a Series B financing round with venture capital firms Viveris Management and Oddo Private Equity and existing investors Emertec Gestion, Schneider Electric Ventures, INPG Entreprise SA and Alma Capital Finances.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.