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Internet of Things Designline
posted in June 2010
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Freescale hits GaAs on RF basestation ICs
Product News  
6/30/2010   1 comment
Freescale is moving into gallium arsenide for monolithic microwave basestation ICs that harness ultralow-noise amps for trunk network amplifier radio cards and as predrivers for its high-voltage lateral diffusion MOS power amps.
SiLabs breaks low-power record for touch-sense microcontrollers
Product News  
6/30/2010   Post a comment
Silicon Laboratories claims to have broken its own record for the industry's lowest-power capacitive touch sensor microcontrollers with the new F9xx family.
Debugging: what questions engineers should ask
Blog  
6/30/2010   4 comments
Raji Bavant blogs on his attempts to understand debugging and what questions every debugging team should ask.
French defense firm takes control of MicroOLED
News & Analysis  
6/30/2010   Post a comment
Photonis Technologies SAS has announced it has taken a 51 percent stake in MicroOLED SA, a spin off from CEA-Leti pioneering the use of OLED materials in near-to-eye displays.
Plastic Logic delays e-reader, cancels orders
News & Analysis  
6/30/2010   Post a comment
Plastic Logic GmbH (Dresden, Germany) has delayed for a second time the launch of its monochrome Que e-reader and cancelled existing orders.
Micron's results: What analysts are saying
News & Analysis  
6/30/2010   Post a comment
Micron Technology Inc. roared past analysts’ consensus estimate in its recent quarter.
Qualcomm brews apps store for mobile OS
News & Analysis  
6/30/2010   Post a comment
Qualcomm Inc. is expanding its efforts in the mobile operating system and connectivity arenas.
Taiwan to invest in NAND flash project
News & Analysis  
6/30/2010   Post a comment
Taiwan Innovation Memory Co., previously rejected as a suitable case for government investment as a DRAM company, has reinvented itself as a NAND flash supplier.
MagnaChip withdraws IPO - again
News & Analysis  
6/30/2010   Post a comment
MagnaChip Semiconductor LLC, a spinoff from Hynix Semiconductor Inc. that filed for bankruptcy protection in June 2009, has withdrawn a planned initial public offering due to "adverse market conditions."
Price hikes, shortages seen in hot solar biz
News & Analysis  
6/30/2010   2 comments
Photovoltaic demand is projected to double over last year.
Gyro vendor InvenSense files IPO
News & Analysis  
6/30/2010   Post a comment
InvenSense Inc., a provider of motion processing solutions or gyroscopes, is filing for an IPO.
Dolphin Integration reduces 65nm silicon area
Product News  
6/30/2010   Post a comment
EDA and IP company Dolphin Integration SA has introduced a panoply of silicon IPs optimized for high density so that designers can increase the density of their SoC by up to 10 percent.
Samsung preps 32-GB load-reduced DIMM for servers
Product News  
6/30/2010   Post a comment
Samsung is getting ready to mass produce later this year a 32 gigabyte (GB) load-reduced, dual-inline memory module (LRDIMM), for server applications.
Mid-range IR sensors feature digital or analog outputs in three package types
Product News  
6/30/2010   Post a comment
Vishay Intertechnology Inc. has beefed up its optoelectronics portfolio with a family of mid-range infrared (IR) sensors featuring digital and analog outputs in three package types.
The Inefficiency of C++, Fact or Fiction?
Design How-To  
6/30/2010   1 comment
This article will attempt to sort out the facts from the fiction in this statement. By better understanding the underlying mechanisms of the language, a designer can avoid code bloat.
Commentary: Does SATA have a future?
Blog  
6/29/2010   8 comments
Companies are already churning out Serial ATA Revision 3.0 (SATA Gen 3) motherboards and hard drives that run at 6 Gbits/second. But is there really a long-term market for SATA Gen 3 products? Or will SATA Gen 3 be derailed quickly by the almost-as-fast USB 3.0 interface that is currently taking the market by storm?
Power-over-Ethernet technology goes the distance with latest enhancements
Design How-To  
6/29/2010   Post a comment
How midspans offer an energy-efficient way to deploy PoE and intelligently manage network power consumption
HP, QLogic, Emulex FCoE
News & Analysis  
6/29/2010   Post a comment
Hewlett-Packard is adopting new Fibre Channel over Ethernet chips from Emulex and QLogic in its latest round of data center systems, giving a much boost to the upcoming suppliers who face competition from entrenched chip designers including Broadcom, Intel and Marvell.
Power-over-Ethernet technology goes the distance with latest enhancements
Design How-To  
6/29/2010   Post a comment
How midspans offer an energy-efficient way to deploy PoE and intelligently manage network power consumption
ATLANTiS FrameWork eases FPGA implementation
Product News  
6/29/2010   Post a comment
The BittWare ATLANTiS FrameWork (AFW) is an integrated system framework implemented in Altera's Stratix FPGA family.
Microchip integrates USB, large RAM in PIC MCUs
Product News  
6/29/2010   Post a comment
In an effort to improve throughput and data buffering in Ethernet connectivity, remote sensing, data logging and audio streaming applications, Microchip Technology has integrated USB for Embedded Host/Peripheral/On-the-Go and 96 Kbyes of RAM into its latest microcontrollers.
TruBlue submersible level transducer stores more, lasts longer
Product News  
6/29/2010   Post a comment
Pressure Systems' TruBlue submersible level transducer gets more memory, longer battery life for environmental water usage and water resource applications.
GE licenses Rambus LED technology
News & Analysis  
6/29/2010   Post a comment
GE Lighting, a unit of the General Electric Company's appliances and lighting business, has signed a licensing agreement for the use of Rambus' lighting patents, reference designs and manufacturing process know-how.
Intel, Israel discuss next fab, says report
News & Analysis  
6/29/2010   Post a comment
Intel is discussing locating a wafer fab in Kiryat Gat, Israel, with the Ministry of Industry, Trade and Labor, according to The Media Line.
TSMC given OK to take 10% SMIC stake
News & Analysis  
6/29/2010   Post a comment
The Taiwanese Ministry of Economic Affairs has approved an application by TSMC to take up a 10 percent stake in Chinese foundry rival SMIC, according to reports.
TI offers USB 3.0 IC for 5-Gbit/s transfers
Product News  
6/29/2010   Post a comment
Texas Instruments has introduced to the market a USB 3.0 transceiver capable of 5-Gbits-per-second data transmission rates.
Dolphin Integration rolls panoply of IPs to reduce 65nm silicon area
Product News  
6/29/2010   Post a comment
EDA and IP company Dolphin Integration SA has introduced a panoply of silicon IPs optimized for high density so that designers can increase the density of their SoC by up to 10 percent.
Power-saving low-voltage comparator has tiny dimensions, extended temp range
Product News  
6/29/2010   Post a comment
ST's low-voltage comparator can operate with a supply voltage ranging from 1.6 to 5 V with only 20µA current consumption, and features rail-to-rail inputs for low-voltage applications.
Low-power ADCs extend battery life
Product News  
6/29/2010   Post a comment
Maxim's new family of ADCs consumes only 9.9mW, operates down to 2.2V, and offers burst-mode operation to deliver maximum power savings.
Using FPGA prototyping board as an SoC verification and integration platform
Design How-To  
6/29/2010   Post a comment
Size of new designs has grown so much that it easily allows creation of the entire system containing microprocessor unit and peripherals on one chip. This paper presents one practical implementation of Prototyping Board Verification and Integration Platform.
Viewpoint: The coming tsunami in the electronics ocean
Blog  
6/29/2010   3 comments
In the vast electronics ocean, there’s a tsunami headed our way. EDA might well be able to catch the wave — with a little bit of savvy, ingenuity and engineering know-how.
Freescale plans basestation-on-chip
News & Analysis  
6/29/2010   2 comments
Freescale Semiconductor plans to best its embedded communications competitors not just by depending on raw computing speed for its processors but by reaching the higher integration levels needed to put a "basestation on a chip," according to Lisa Su, senior vice president and general manager for networking and multimedia.
Micron fiscal Q3 profits surge on higher demand
News & Analysis  
6/29/2010   1 comment
Micron Technology Inc. reported strong fiscal third quarter sales and profits as rising demand, improving prices and investment gains boosted the memory company's performance.
BOM for iPhone 4 is $188, says iSuppli
News & Analysis  
6/28/2010   2 comments
The 16-Gbyte version of Apple's iPhone 4 carries a bill of materials cost of $187.51, keeping with Apple's strategy of maintaining hefty profit margins on the popular smartphone, according to a teardown analysis conducted by market research firm iSuppli.
Samsung, TSMC hit by ITC complaint
News & Analysis  
6/28/2010   3 comments
STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
Analyst: China's IC manufacturing spend paying off
News & Analysis  
6/28/2010   Post a comment
Semiconductor fabs in China produced 40 billion ICs in 2009, accounting for 25.1 percent of domestic demand, up from 20.9 percent in 2004, according to a new report that concludes that massive investments in China's semiconductor industry are paying dividends.
Case study: Sequential mating connector systems link portable power-distribution equipment
Product How-To  
6/28/2010   Post a comment
This is a look at a different power-connector and interconnect situation and solution, where power levels are high and user-safety issues are a major concern.
Making the most of the system level in analog design
Design How-To  
6/28/2010   Post a comment
There is a disconnect in Analog IC Design. A separation between system level and implementation level design activities has crept up on us. The analog world seems to have evolved into two realms: equations and spreadsheets on one side; netlists, polygons and Spice on the other. It is like a split between the right brain and the left, leaving us struggling to combine technology with art.
transceiver
Product News  
6/28/2010   1 comment
TI TUSB1310 provides essential physical-level functions, features sensitivity twice the USB 3.0 requirement
CoorsTek buys ceramics unit for $245M
News & Analysis  
6/28/2010   Post a comment
CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
media tablet iPad Killer
News & Analysis  
6/28/2010   3 comments
Whatever you prefer to call the next-gen media tablet, the popularity of these devices speaks to changes underway in how we use computers and consume content.
Obducat CEO resigns amid losses
News & Analysis  
6/28/2010   1 comment
Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi
News & Analysis  
6/28/2010   Post a comment
Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Firm to pay up to $58M for Atmel's smart card biz
News & Analysis  
6/28/2010   Post a comment
Atmel said it has entered into a definitive agreement to sell its Secure Microcontroller Solutions business to Inside Contactless for up to $58 million after completing consultation with the Works Council at Atmel's SMS facility in Rousset, France.
DC/DC converter powers systems from 18V to 75V
Product News  
6/28/2010   Post a comment
Ericsson Power Modules has developed a quarter-brick, isolated DC/DC converter that is optimized to deliver the highest efficiency across an ultra wide input voltage range of 18V to 75V, enabling designers to use the same DC/DC converter in both 24V and 48V-battery-based systems.
Web Services for Smart Objects - Part 2: Performance considerations
Design How-To  
6/28/2010   Post a comment
Part 2 of an excerpt from the book "Interconnecting Smart Objects with IP: The Next Internet" critically examines the question "Can smart objects maintain a good performance for web services?"
IPv4 and IPv6 Addressing - Part 4: CIDR, VLSM & IPv6 addressing
Design How-To  
6/28/2010   Post a comment
Part 4 of an excerpt from the book "The Illustrated Network: How TCP/IP Works in a Modern Network" examines the standard methods for moving the network/host address boundary - CIDR and VLSM - as well as IPv6 addressing details.
Designing systems for extreme environments
Design How-To  
6/28/2010   Post a comment
Designing embedded systems destined for extreme environments, such as 1 mile below the surface of an ocean, adds a layer of complexity and difficulty for the designer. Nate Holmes of National Instruments describes some common challenges and latest tools and approaches to issues like power and test that can aid designers in creating successful systems headed for tough spots.
Which type of "analog" designer are you?
Blog  
6/28/2010   4 comments
There are engineers doing circuits the analog way, because they absolutely want to, or because they are forced to, or somewhere in-between; judging how much analog makes sense means stepping back and making objective assessments
ADI to spend $28 million on Irish R&D
News & Analysis  
6/28/2010   1 comment
IDA Ireland, the government agency responsible for industrial development in Ireland, has announced a 23 million euro (about $28 million) investment in R&D at Analog Devices facility in Raheen, County Limerick.
Page 1 / 10   >   >>


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