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Internet of Things Designline
posted in June 2010
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IBM, partners to report 22-nm FinFET SRAM
News & Analysis  
6/1/2010   2 comments
A research team comprising authors from IBM Research, GlobalFoundries, Toshiba and NEC has produced an SRAM cell with an area of 0.0063 square microns using FinFET transistors and optical lithography.
ASE uses Apache's chip-package-system analysis tools
Product News  
6/1/2010   Post a comment
Taiwan's Advanced Semiconductor Engineering (ASE) Inc. announced it has licensed Apache Design Solutions’ products for chip-package-system convergence.
Cadence uses Rapid Bridge's LiquidIP
Product News  
6/1/2010   Post a comment
Cadence Design Systems Inc. and Rapid Bridge LLC have signed an agreement under which Rapid Bridge's LiquidIP, a system of interdependent, silicon-proven IPs, becomes available as part of the Cadence Open Integration Platform.
GlobalFoundries to spend $3 billion on expansion
News & Analysis  
6/1/2010   2 comments
Foundry chip maker GlobalFoundries Inc. has announced plans to expand its global semiconductor manufacturing operations with an additional spend of $3 billion over the next couple of years.
ATIC preps Abu Dhabi for chip manufacturing
News & Analysis  
6/1/2010   Post a comment
Advanced Technology Investment Co. (ATIC), the Abu Dhabi government-owned investment vehicle behind foundry chip maker GlobalFoundries Inc. (Sunnyvale, Calif.), has announced it plans to create an "advanced technology cluster" in Abu Dhabi.
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