KLA-Tencor revenues slip 13% sequentially in quarter News & Analysis 7/31/2001 Post a comment SAN JOSE -- KLA-Tencor Corp. today reported a 13% sequential decline in revenues to $462 million in the company's fiscal fourth quarter, ended June 30, compared to $529 million in the prior quarter. The metrology supplier posted a net income of $56 million in the quarter vs. $91 million in the prior three-month period.
JMAR receives funding from U.S. Army to complete X-ray lithography tool News & Analysis 7/31/2001 Post a comment SAN DIEGO -- JMAR Technologies Inc. here today announced that it has received funding from the U.S. Army to continue the development of its X-ray lithography program.
The San Diego-based company received a total of $7,796,259 from the U.S. Army Robert Morris Acquisition Center in Adelphi, Md. The contract is sponsored by the Defense Advanced Research Projects Agency (DARPA).
Molex moves forward with new management News & Analysis 7/31/2001 Post a comment At the beginning of July, Molex Inc., one of the world's largest connector suppliers, saw two new leaders take the helm. J. Joseph King became vice chairman of the board and chief executive, while Martin Slark took over as president and chief operating officer. King and Slark replace Fred A. Krehbiel and John H. Krehbiel Jr., who are retiring from their positions as co-chief executives. The Krehbiel brothers will remain co-chairmen.
Trikon says tool orders up 15%, but sales drop 27% from Q1 News & Analysis 7/31/2001 Post a comment NEWPORT, Wales -- Trikon Technologies Inc. today reported a 27% sequential drop in revenues to $27.7 million in the second quarter, compared to $37.6 million in Q1 of 2001. The supplier of deposition and etch tools for wafer fabs said its sales were 12% higher in Q2 than $24.7 million in the period last year.
NEC confirms 600 Scottish job losses News & Analysis 7/31/2001 Post a comment NEC Semiconductor is cutting 600 jobs at its facility in West Lothian, Scotland — around 40% of the plant's 1600 staff. The company blames the continuing slump in the semiconductor market.
TI and Sun to ship copper-based Sparc processors News & Analysis 7/30/2001 Post a comment
Texas Instruments Inc. and Sun Microsystems Inc. announced Monday that qualification tests on the first copper-interconnect versions of the UltraSparc III microprocessor have been completed and production quantities with 900-MHz clock rates are expected to begin shipping within three months.
Agere's manufacturing strategy in doubt News & Analysis 7/30/2001 Post a comment Facing mounting debt and a sales slump that has nearly idled its chip fabs, Agere Systems Inc. may be forced to take more aggressive measures than slashing head count and consolidating fabs to cut costs, according to analysts last week.
But how far is the company willing to go to bring expenses in line with revenue? According to one source, a fabless ASIC strategy is not out of the question.
Microchip forms analog IC division News & Analysis 7/30/2001 Post a comment
Microchip Technology Inc. is putting more muscle behind its "black magic" analog business by forming a separate analog IC division that will also serve to bolster the company's recent push into DSPs.
G8 supports 'digital divide' issues but cuts funds News & Analysis 7/30/2001 Post a comment The G8 summit in Genoa sought to deal with the 'digital divide' by endorsing an action plan to widen the availability of information and communication technologies in the developing world. But the global leaders failed to vote any new funds to support the plan.
Update: Group delays vote on 3GIO support News & Analysis 7/30/2001 Post a comment A PCI standards organization decided Friday (July 27) to delay a vote on support for a next-generation I/O scheme backed by Intel Corp. until Aug. 3, saying it needed more time to review the spec.
Numerical's software speeds migration of design cells to advanced fab processes News & Analysis 7/30/2001 Post a comment SAN JOSE -- Numerical Technologies Inc. today said it is now offering two new software products that will help ease the task of moving embedded design cores to advanced chip-processing technologies. The company's abraMAP maps existing design cells to new wafer-processing technologies, while the abraKAZAM combines migration and cell-development capabilities.
ATI acquires Appian's desktop software technology for $2 million News & Analysis 7/30/2001 Post a comment MARKHAM, Ontario -- ATI Technologies Inc. here today announced that it has acquired Appian Graphics Corp.s' desktop management software and technology for $2 million.
Under the terms of the agreement, ATI has acquired ownership of Appian's HydraVision desktop management software and related technologies. In addition, ATI has hired several of Appian's employees to develop future enhancements to HydraVision software.
Intel and TI license ARM's upcoming 'v6' core for future processor products News & Analysis 7/30/2001 Post a comment CAMBRIDGE, England -- ARM Ltd. here today announced an extension of its RISC processor-licensing pact with Intel Corp. to include a next-generation ARMv6 architecture and other core designs. The Cambridge company today also announced a licensing agreement for ARMv6 cores with Texas Instruments Inc., which will use the low-power consuming RISC processor core in chip sets for 2.5 and 3G cellular phone handsets.
Clare to sell switch business to Sumida News & Analysis 7/27/2001 Post a comment Clare, Inc., a Beverly, Mass., designer of high-voltage analog and mixed-signal integrated circuits for the communications market, today announced a definitive agreement with Sumida REMtech Corporation, a subsidiary of Sumida Corporation of Japan, to sell all of the assets of its Reed Switch business for $8 million in cash.
ISSI plans to use cash reserves to beef up specialty memory line News & Analysis 7/27/2001 Post a comment Though its revenue has fallen by more than two-thirds in the last six months, specialty memory chip vendor Integrated Silicon Solution Inc. (ISSI) is looking to spend some of its cash reserves on an acquisition to beef up its line of specialty memory devices, chairman and chief executive officer Jimmy Lee said.
Industry facing another I/O bus collision News & Analysis 7/27/2001 Post a comment The processing I/O bottleneck the industry has been wrestling with is about to encounter a bottleneck of its own in the form of a power struggle between Advanced Micro Devices Inc. and Intel Corp.
Veeco cuts workforce by 8% and lower forecast for current quarter News & Analysis 7/27/2001 Post a comment PLAINVIEW, N.Y. -- Citing a slowdown in its chip-equipment and related businesses, Veeco Instruments Inc. here today cut its workforce by 8%, or 130 employees, and lowered its forecast in the current quarter.
The company also reported sales of $133.5 million for the quarter ended June 30, an 11% increase from the $102.3 million figure posted in the like period a year ago. It also reported a net of $10 million, or $0.40 per diluted share, compared to a $14 million loss, or a deficit of $0.60, a
A troubled Lucent threatens Agere News & Analysis 7/27/2001 Post a comment From the beginning, Lucent Technologies Inc.'s spinoff of Agere Systems Inc. has been dogged by problems and miscalculations. This week, Lucent's cash problems resurfaced, and again Agere's fate and hopes for full independence hang in the balance.
Intel to formally launch 0.13-micron Tualatin on Monday News & Analysis 7/27/2001 Post a comment Intel Corp. on Monday will officially launch its new 0.13-micron process Pentium III Tualatin processor for notebooks and servers -- an anti-climax since some OEMs and Taiwan motherboard makers have been showing products with the new chip for some time.
Japanese chip giants restructure News & Analysis 7/27/2001 Post a comment Fujitsu Ltd. Friday announced it is taking a $2.45 billion special charge, largely to scale down its semiconductor operations, which is expected to result in a $1.6 billion net loss in the current fiscal year ending next March 31.
QinetiQ power-scavenging turns mechanical News & Analysis 7/27/2001 Post a comment UK technology group QinetiQ (formerly Dera) has switched its research into power-scavenging circuits from electric shoes to devices that fit on to mechanical systems and use their motion to produce power for small devices.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.