Renesas rolls dual-type power MOSFET Product News 7/31/2008 Post a comment Designed to make DC/DC converters more efficient for laptop PCs and communication devices, Renesas' latest power MOSFET boasts a chip mounting area that is half the size of existing dual-package power MOSFET configurations.
ASMI sells inspection gear unit News & Analysis 7/31/2008 Post a comment Under pressure on a number of fronts, ASM International N.V. has signed a letter of intent to sell its majority-owned subsidiary NanoPhotonics AG, a supplier of inspection gear.
Audio connectors shrink in size Product News 7/31/2008 1 comment ITT Interconnect Solutions has developed a miniature audio connector series, aimed at higher quality compact audio applications in video, broadcast and recording.
MIT claims 24/7 solar power Design How-To 7/31/2008 3 comments Researchers at the Massachusetts Institute of Technology have combined a liquid catalyst with photovoltaic cells to achieve what they claim is a solar energy system that could generate electricity around the clock.
Digital Potentiometers feature 1 percent accuracy Product News 7/31/2008 Post a comment Analog Devices introduced the digital potentiometer (digiPot) AD529x family with the industry's best resistor tolerance of just 1 percent, allowing designers of industrial and instrumentation equipment to meet tighter resistor matching requirements for improved system accuracy.
Higher performance in sophisticated applications with floating-point DSCs Design How-To 7/31/2008 Post a comment As embedded systems continue to undertake more sophisticated tasks such as vehicle guidance or automotive radar systems, they demand ever greater performance from control processors. High-performance Digital Signal Controllers do not only offer the computing power for such demanding applications; they can offer the same time the potential to save power.
Debug engine supports new 32-bit automotive MCUs from Freescale and ST Product News 7/31/2008 Post a comment At the same time as the launch of the automotive microcontroller families SPC560xx/SPC563xx from STMicroelectronics and MPC560/MPC563xx from Freescale, pls Programmierbare Logik & Systeme (Lauda, Germany) announces the availability of its Universal Debug Engine (UDE) 2.4, a complete debug and test environment especially for the specific features of these new Power Architecture 32-bit devices.
TDK, Epcos merger forms passive components giant News & Analysis 7/31/2008 Post a comment Electronic component vendor TDK (Tokio) plans to merge its passive component business with its German competitor Epcos AG (Munich, Germany). The Epcos management supports the plan. Both brands will be continued, the companies said.
TSMC posts mixed Q2 results News & Analysis 7/31/2008 Post a comment Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) reported consolidated revenue of NT$88.14 billion ($2.87 billion) for the second quarter, up a mere 0.8 percent from the previous period and up 17.6 percent a year ago.
Tutorial: Radio Basics for UHF RFID--Part VII Design How-To 7/31/2008 Post a comment Here is Part VII of Chapter 3--Radio Basics For UHF RFID--from The RF in RFID: Passive UHF RFID in Practice. Written for the electrical engineer but not the RFID expert, Dr. Dobkin explains what to expect, develop, and use while implementing an RFID system.
Hynix posts $700M loss for Q2 News & Analysis 7/31/2008 Post a comment South Korea's Hynix Semiconductor Inc. reported revenues of 1.86 trillion won ($1.82 billion)
for the quarter, up 16 percent from the previous quarter.
Local designers drive Chinese IC market growth News & Analysis 7/30/2008 Post a comment Semiconductors designed for consumption in China is forecast to expand more than 60 percent between 2007 and 2012 driven by the need to customize products for the local market although total Chinese IC consumption is seen growing at a slower 7.7 percent rate during the same period.
KLA buys Vistec's inspection unit News & Analysis 7/30/2008 Post a comment Continuing on its acquisition spree, KLA-Tencor Corp. has entered into an agreement to acquire the inspection business unit of Vistec Semiconductor Systems Inc.
Video: When the fab shuts down News & Analysis 7/30/2008 Post a comment Matt, a young process engineer at the Hynix DRAM fab in Eugene, Oregon, shares his views about the human impact of the Korean company's decision in late July to close its only U.S. manufacturing plant.
MAS approach optimizes WiMAX networks Design How-To 7/30/2008 Post a comment Building on top of baseline approaches that utilize the time and frequency dimensions, MAS processing includes a multitude of techniques that exploit the "spatial" dimension of the wireless signal.
AMD to sell consumer lines, says analyst News & Analysis 7/30/2008 Post a comment Amid a possible plan to spin-off its manufacturing unit, Advanced Micro Devices Inc. (AMD) may sell its consumer and handset chip lines from its ATI subsidiary, according to an analyst, who said Broadcom Corp. could be part of the mix.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.