Video: EDA eyes new opportunities for growth News & Analysis 7/31/2009 Post a comment Opportunities for EDA to generate more revenue from outside the semiconductor industry frequently surfaced in discussion at this year's Design Automation Conference, with executives suggesting that EDA could play in markets including medical devices, military/aerospace, automotive and clean energy technology.
Signaling rate versus cable length: the CAN-bus timing trade-off Design How-To 7/31/2009 1 comment The CAN standard alludes to the trade-off between total bus distance and maximum signaling rate. This article presents specific examples that illustrate why the loop-time (round-trip delay) is an essential measure of network performance. Also included is look at component selection, slew rate control, and timing budget analysis.
Choosing the right battery technology Design How-To 7/31/2009 Post a comment Battery performance, as it relates to runtime and capacity, has become a key market differentiator for consumer electronics. A new line of batteries with technologies like lithium ion and lithium-ion phosphate that offer better performance make the choice of what battery to use harder.
Graphene nanoribbons lower power, cooler than copper News & Analysis 7/31/2009 1 comment Graphene nanoribbons below 20-nanometer widths will carry 1000-times more current, and run up to 12-time cooler, than copper interconnects according to carbon semiconductor researchers at Georgia Institute of Technology.
AMD, HP propose extensions for PCI Express 3.0 News & Analysis 7/31/2009 Post a comment Researchers from Advanced Micro Devices and Hewlett-Packard have written two extensions to the PCI Express 3.0 specification which aims to enable lower cost chips that could support multiple protocols and reduce processor overhead.
Wolfson launches advanced PMIC line Product News 7/31/2009 Post a comment Wolfson Microelectronics' latest power management chips are the first to employ its BuckWise regulator technology, helping to cut support components and facilitate advanced multitasking.
NXP Class-D car audio amplifier offer high efficiency Product News 7/31/2009 Post a comment NXP has introduced a family of dual channel Class-D amplifiers that according to the vendor's promises deliver high sound quality and energy efficiency. The NXP TDF8599 Class-D amplifier family operates with maximum output power from 70 to 130 watts (250 watts mono), significantly reducing power dissipation in the vehicle head-unit when compared to traditional Class-AB amplifiers and ensuring more efficient heat management.
Wolfson Q2 sales up 32% sequentially News & Analysis 7/31/2009 Post a comment Wolfson Microelectronics plc (Edinburgh, Scotland), a supplier of mixed-signal circuits for consumer electronics, made an operating loss of $2.4 million on second quarter revenue that reached $33.2 million, a rise of 32 percent sequentially but down 38 percent from Q2 2008.
Head unit increasingly resembles PC, iSuppli finds News & Analysis 7/31/2009 1 comment Economic pressure and customers' requirements will urge car manufacturers to look at the PC market when meeting design decisions for future head units, predicts market researcher iSuppli. Thus, the differentiating features move into the software with some interesting consequences.
Silicon Valley, Wall Street meet at interconnect event News & Analysis 7/30/2009 Post a comment The Hot Interconnects conference will move from its longstanding home on the Stanford campus to Lower Manhattan next month as organizers try to bring together Silicon Valley technologists and bleeding edge systems users on Wall Street, in part to debate the competition between 10 Gbit Ethernet and Infiniband.
Asyst sells assets to three companies News & Analysis 7/30/2009 Post a comment Ending perhaps the last chapter in a painful saga, Asyst Technologies Inc. has agreed to sell its entire assets to three companies: Crossing Automation Inc., Murata Machinery Ltd. and the Peer Group.
New E85 station opening in Arizona Product News 7/30/2009 Post a comment The Renewable Fuels Association (RFA) announces the opening of the first E85 station in Coolidge, Arizona. E85 is a blend of 85 percent ethanol, 15 percent gasoline, designed for flex-fuel vehicles.
Kappos sketches out plans for patent office News & Analysis 7/30/2009 1 comment David J. Kappos, nominated by President Barack Obama to head the U.S. Patent and Trademark Office, pledged to "refashion the patent examination process" and improve funding for the patent office in his confirmation hearing before the Senate Judiciary Committee Wednesday.
FIBEX XML format and AUTOSAR development Design How-To 7/30/2009 3 comments Engineers planning to start Autosar projects for the first time can revert on existing tool chains, at least in part: The Fibex protocol is very similarly structured, and in many cases existing Fibex tools can be adapted to Autosar.
Nissan provides e-car technical details News & Analysis 7/30/2009 Post a comment Japanese car maker Nissan plans to introduce its electric volume vehicle for 2010 production start. The OEM already offered a glimpse to the car's electric drive and internal IT systems. Surprise: The driving range is 160 km not bad to start with.
Karlsruhe tram-train runs field trial on Ni-Cd battery system News & Analysis 7/30/2009 Post a comment The pioneering Stadtbahn Karlsruhe tram-train network in Germany has completed an extended field trial with a Saft MATRICS MRX battery system to demonstrate the potential reliability, performance and TCO (Total Cost of Ownership) advantages offered by using specialised rechargeable nickel-cadmium (Ni-Cd) batteries in a light rail application.
DAC attendance spots recessionary times News & Analysis 7/30/2009 Post a comment Preliminary attendace figures at this year's Design Automation Conference show an increase in total conference and exhibit attendance by 12 percent over last year's DAC held in Anaheim, Calif. and by three percent over the 2007 San Diego event.
GlobalFoundries could be the elusive Eurofoundry, and more News & Analysis 7/30/2009 1 comment If Infineon could be persuaded to follow ST and switch outsourced IC manufacturing to GlobalFoundries in Dresden, we would some of the way along the path to creating a Eurofoundry that would keep advanced digital CMOS manufacturing in Europe, albeit with the help of Abu-Dhabian petrodollars.
Micronova shrinks HiL simulator to desktop size Product News 7/30/2009 Post a comment With the NovaSim Micro, test devices vendor Micronova (Vierkirchen, Germany) has shrunk Hardware-in-the-loop (HiL) simulators to desktop size. Despite its small size, the simulator runs function tests on complex ECUs, the vendor promises.
SMSC rolls MOST network analyzing solution Product News 7/30/2009 Post a comment With the Optolyzer G2 Premium bundle, chip vendor SMSC introduces a high-end analysis toolset that is part of SMSC Optolyzer G2 family. The bundle comes with an Optolyzer G2 for MOST25, MOST50 and MOST150 networks.
ST sees positive backlog indicators for Q4 News & Analysis 7/30/2009 Post a comment In a commentary of financial results for the first half of fiscal year 2009, European chipmaker STMicroelectronics NV (Geneva, Switzerland) expressed optimism as it expects demand to recover in the second half of 2009.
Nvidia chief scientist to EDA: Give us power tools News & Analysis 7/30/2009 Post a comment Nvidia's chief scientist told the EDA community that chip designers need new tools to usher in a new era of computing, moving to "throughput computing" from an era of "denial architecture" that has seen the semiconductor industry squeeze more performance out of single-thread processors thanks to software.
ESL/HLS buzz at DAC Programmable Logic DesignLine Blog 7/30/2009 1 comment The buzz over electronic-system level design and high-level synthesis seems to have reached a new level at this year's Design Automation Conference.
NI expands FlexRIO line Product News 7/30/2009 Post a comment National Instruments announced the expansion of its NI FlexRIO product line with multiple forthcoming adapter modules, said to provide engineers with application-specific I/O for RF, digital, time-domain and vision inspection systems.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.