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Internet of Things Designline
posted in July 2009
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Will Teradyne enter DRAM test market?
News & Analysis  
7/1/2009   Post a comment
Will Teradyne Inc. enter the DRAM test market?
TSMC hit by yield issues, double ordering, says analyst
News & Analysis  
7/1/2009   Post a comment
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) is expected to exceed its second-quarter guidance, but there is ''increased concern'' over its 40-nm yields and a pattern of double ordering at the foundry giant, according to an analyst.
DAC votes for power management
Power DesignLine Blog  
7/1/2009   Post a comment
Power management is being taken seriously by the design automation community. Design Automation Conference organizers have released the votes, and "Power Scavenging: Waste Not, Want Not" won as DAC's first "community-driven" DAC Pavilion panel.
Model-driven development supports eco-friendly car design
Design How-To  
7/1/2009   3 comments
The selection of a power source for a vehicle is simple is it? If the boundary conditions call for eco-friendliness and cost-effectiveness there are difficult trade-offs to consider.
Oracle taps investors for $4.5B to fund acquisitions
News & Analysis  
7/1/2009   Post a comment
Oracle Corp. is set to sell corporate bonds worth $4.5 billion to investors as the software vendor moves to shore up its cash position following several huge acquisitions, including the pending $7.4 billion purchase of Sun Microsystems Inc.
QuantaSol touts efficiency of single-junction solar cell
News & Analysis  
7/1/2009   Post a comment
QuantaSol Ltd., a developer quantum-well based photovoltaic technology and spinoff from Imperial College, London, has developed what it says is the most efficient single junction solar cell manufactured.
Siemens sprays organic photodiodes
News & Analysis  
7/1/2009   Post a comment
Researchers from Siemens Corporate Technology (CT) have developed a cost-effective production process for organic large-area photo diodes: Instead of the usual method of casting or doctor blading, they succeeded in spraying the material.
Areva considers disposing of ST stakes
News & Analysis  
7/1/2009   Post a comment
Paris-based nuclear power giant Areva said it is considering disposing of its stakes in chipmaker STMicroelectronics NV (Geneva, Switzerland).
Robots kick the ball for RoboCup 2009
News & Analysis  
7/1/2009   Post a comment
In Graz (Austria), the RoboCup 2009 robot soccer championship has started. From July 1 to July 5, robot teams from around the world compete for the cup.
Via Licensing signals progress with NFC patent pool
News & Analysis  
7/1/2009   Post a comment
The formation of a patent pool for technologies related to near field communications (NFC) is gathering steam with one of the major players in the field, Via Licensing Corporation, signing up Motorola Inc. for its joint licensing program.
High power PD controllers address IEEE 802.3at PoE+ Standard
Product News  
7/1/2009   Post a comment
Linear Technology Corporation has introduced the LTC4269-1, LTC4269-2 and LTC4278, IEEE 802.3at compliant Power over Ethernet (PoE+) interface controllers with integrated switching regulators for high-power Powered Device (PD) applications up to 25.5 W and beyond.
Fairchild : Dc-dc converter extends talk time of 3G handsets
Product News  
7/1/2009   Post a comment
Fairchild Semiconductor claims the industry’s smallest power management solution for the designers of 3G handsets and wireless datacards.
New family of LED drivers support small LCD screens
Product News  
7/1/2009   Post a comment
Diodes Incorporated has introduced a family of three new LED drivers that provide a cost-effective and small form factor solution for small LCD screens used across a wide range of portable consumer electronics, such as portable media players, personal navigation devices and digital photo frames.
Innovasic rolls pin-compatible x86 and x88 embedded processors
Product News  
7/1/2009   Post a comment
Innovasic Semiconductor, a vendor focused on extended life semiconductors, has announced engineering samples are shipping for the IA186XL and IA188XL.
Wolfson taps former Nokia VP to lead sales
News & Analysis  
7/1/2009   Post a comment
Andy Brannan, a former VP at Finnish phone maker Nokia, has been appointed chief commercial officer at mixed-signal chip specalist Wolfson Microelectronics plc (Edinburgh, Scotland).
IC market 'surge' at hand, says analyst
News & Analysis  
7/1/2009   Post a comment
The second half of 2009 will bring welcome relief to the semiconductor and capital equipment industries, according to market research firm IC Insights, which is predicting strong seasonal strength for electronic system sales, worldwide gross domestic product growth and continuation of an IC inventory replenishment trend that began in the second quarter.
Elpida walks away from Powerchip
News & Analysis  
7/1/2009   Post a comment
Japanese DRAM maker Elpida Memory Inc. is withdrawing from Powerchip Semiconductor Corp.'s board.
Retrofit kit said to transform cars into hybrids
Design How-To  
7/1/2009   10 comments
A former IBM electrical engineer has designed a retrofit kit that he claims can transform existing automobiles into hybrids by placing an electric motor inside each wheel, thereby doubling gas mileage.
Random musings
Design How-To  
7/1/2009   1 comment
From organic houses to Charlemagne in the Middle Ages to cute USB ball speakers to radioactive soil and debris... to name but a few!
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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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