Panel: Future job prospects bright for EDA pros News & Analysis 7/29/2009 Post a comment Amid concerns that EDA may be permanently shrinking, technical professionals with EDA experience nevertheless have good future job prospects, according to members of a career-oriented panel discussion at the Design Automation Conference.
DFM debated as a 'weapon of mass design' News & Analysis 7/29/2009 Post a comment The more than abused DFM acronym reared its ugly head again at a leading design engineering forum. The consensus is that Design for Manufacturing has its place in the chip design world, but basically it's a crapshoot.
UMC posts profit, raises capex News & Analysis 7/29/2009 Post a comment Taiwan's United Microelectronics Corp. (UMC) moved back into the black in the second quarter and raised its capital spending from $400 million to $500 million in 2009.
Quad and dual 14-bit 125 Msps ADCs dissipate one-third the power Product News 7/29/2009 Post a comment Linear Technology Corporation has announced a family of 24 low-power 14-bit/12-bit, 125-Msps to 25-Msps, quad and dual ADCs that dissipate as little as one-third the power of competing ADCs. The flagship ADC is the LTC2175-14, a quad 14-bit, 125Msps ADC that dissipates only 558 mW (140 mW per channel).
TSMC keynoter touts cooperative business models News & Analysis 7/29/2009 Post a comment Future growth in EDA and other segments of the semiconductor industry supply chain depends on the evolution of a new breed of collaborative business model that enable partners to pool costs and increase profits, according to Fu-Chieh Hsu, vice president of Design & Technology Platform at TSMC.
Intuition for signal integrity Power DesignLine Blog 7/29/2009 Post a comment The design process is a creative process and intuition is the most important skill you rely on first. Once you have a design, then you apply your analysis skills to evaluate the cost-performance tradeoffs.
ST widens loss in first half News & Analysis 7/28/2009 Post a comment European chipmaker STMicroelectronics NV (Geneva, Switzerland) reported that its second half net loss was $860 million, or $-0.98 per share, compared to a net loss of $131 million, or $-0.15 per share in the first half of 2008.
Spansion moves to emerge from Chapter 11 News & Analysis 7/28/2009 2 comments Spansion Inc. provided an update on its ongoing restructuring efforts that are aimed for the company to emerge from a Chapter 11 bankruptcy filing by the fourth quarter of this year.
Mountz introduces Hybrid torque control assembly solution Product News 7/28/2009 1 comment Mountz has introduced the Hybrid, a new product for repeatable screw fastening technology. According to Mountz, the patented HD Series Torque Control System is the world's first torque control tool using both air and electric power to set and control torque.
SMIC posts loss, sales up News & Analysis 7/28/2009 Post a comment Chinese foundry provider Semiconductor Manufacturing International Corp. (SMIC) posted another loss in the second quarter, but the company's sales rebounded in the period.
The TSMC Tsunami at DAC 2009 Blog 7/28/2009 Post a comment In a well-orchestrated and clearly scripted show of force, the CEOs of the three "largest" companies in EDA appeared together under the Big Top at the 2009 Design Automation Conference in San Francisco on Monday, July 27th, for a highly touted afternoon keynote panel purportedly addressing "Futures for EDA."
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.