FDA defends 510(k) as debate begins News & Analysis 7/29/2011 5 comments Launching a public debate, U.S. regulators were quick to reject the conclusion of a report saying it should scrap its most widely used process for approving medical devices.
Free Cortex A-Series Programmer's Guide Design How-To 7/29/2011 2 comments ARM recently released the Cortex A-Series Programmer's Guide which provides a gentle introduction to the ARM architecture used in Cortex A-Series processors, covering the main concepts that you need to know about the processor architecture and providing practical advice on how to write both C and Assembly Language programs that will run efficiently on an ARM processor.
NXP grew again in Q2; may decline in Q3 News & Analysis 7/29/2011 4 comments NXP Semiconductors reported a sequential increase in product revenue for the ninth consecutive quarter, but said the streak could come to an end in the third quarter because of a pause in demand from automotive customers, slower-than-expected deployment of near field communications technology and global macroeconomic weakness.
Trident signs IP license deal amid Q2 loss News & Analysis 7/28/2011 Post a comment Trident Microsystems announced it reached an agreement to license some of its video processing technology and reported a narrower second quarter loss on sales that fell short of consensus analysts' expectations.
Tablets, smartphones hit sales of CE devices News & Analysis 7/28/2011 7 comments As sales of multi-function electronics devices like tablets and smartphones rise, sales of single-task products like MP3 players and digital still cameras are projected to decline or stay flat, according to IHS iSuppli.
SofCheck preps ParaSail parallel language Research 7/28/2011 10 comments SofCheck Inc., best known as a vendor of software analysis and verification technology and Ada Compilers, is working on a parallel programming language called ParaSail that has been presented at two learned conferences recently.
TSMC forecasts falling sales in Q3 News & Analysis 7/28/2011 Post a comment Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced that its net income fell in the second quarter and has forecast its revenue will decline by about 7 percent in the third quarter.
Using an MCU peripheral to wake up a capacitive touch-sensing device Design How-To 7/28/2011 Post a comment When a capacitive touch screen goes into sleep or standby mode to save energy, how can you design the system to wake up quickly without degrading its performance or burning a lot of power. In an article on Embedded.com Nithin Kumar Mada and Harsha Jagadish of Microchip Technology describe two options: a traditional method and a new MCU-based method.
Infineon profits as car woes no-show News & Analysis 7/28/2011 Post a comment Expected problems in the automotive supply chain failed to materialize for Infineon Technologies AG in the second quarter and helped the German chip maker turn in higher than expected sales and profits.
VIA launches dual core VB8004 Mini-ITX Mainboard Product News 7/27/2011 Post a comment VIA Technologies, Inc has announced a dual core version of the low power VIA VB8004 Mini-ITX board. Coupling the 1.6GHz VIA Nano X2 E-series processor with the VIA VX900 media system processor, the VIA VB8004 provides a high performance and highly scalable solution for advanced digital signage and gaming systems.
Lam sees steep decline in tool spending News & Analysis 7/27/2011 Post a comment Lam Research reported quarterly results that beat analysts' expectations but warned of a significant decline equipment spending that would cause its revenue to contract in the current quarter.
IEEE publishes 'white space' WRAN standard Research 7/27/2011 6 comments The Institute of Electrical and Electronics Engineers (IEEE) has published the 802.22 standard for Wireless Regional Area Networks (WRANs). The standard covers broadband wireless access at up to 22-Mbps per channel over distances up to 100 kilometers from a transmitter without interfering with terrestrial television broadcasts that use the same part of the spectrum.
ST-Ericsson to close R&D sites News & Analysis 7/27/2011 12 comments Mobile chip company ST-Ericsson is set to close R&D sites as part of the latest round of restructuring, according to CEO Gilles Delfassy. A site in Basingstoke, England, has already been earmarked for closure with a loss of up to 139 jobs, according to a local report.
TI touts 3-D packaging technology News & Analysis 7/27/2011 9 comments Texas Instruments said it has shipped more than 30 million power management devices featuring its PowerStack 3-D packaging technology, which the company says offers performance, thermal, power consumption and board space advantages compared with conventional packaging technologies.
ADI invests $70 million in Irish R&D Research 7/27/2011 Post a comment The Industrial Development Agency of Ireland (IDA Ireland) has announced that chip company Analog Devices Inc. is embarking on a 50 million euro (about $70 million) R&D investment program at its Raheen campus near Limerick.
Israel offers Intel $290 million to expand News & Analysis 7/27/2011 11 comments The Israeli government is offering semiconductor giant Intel up to 1 billion shekels (about $290 million) to expand its manufacturing operations in the country, according to local reports.
DRAM price declines suggest tough second half News & Analysis 7/27/2011 5 comments The contract price of 2-GB DRAM modules has decreased nearly 16 percent in July compared with June, a warning sign that the DRAM market outlook for the second half of 2011 could be bleak, according to DRAMeXchange.
Research points to vulnerability in Xilinx FPGAs Semi Conscious 7/27/2011 1 comment A recent paper published by a team of German researchers concludes that the bitstream encryption mechanism of Xilinx Virtex-4 and Virtex-5 FPGAs can be "completely broken with moderate effort" through side-channel analysis attacks, posing a potential risk of IP theft and more serious issues.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.