Philips' reference design upgrades CRT-based tuners to LCD TVs News & Analysis 8/27/2003 Post a comment Practically all the consumer electronics manufacturers are "moving into LCD TV sets," says Philips Semiconductors. They are looking for a solution that lets them "jumpstart quickly in the new market." Junko Yoshida reports on a reference design that enables TV set manufacturers to make a quick and painless migration from CRT to mid-end LCD TV designs.
Shortages, price hikes hit flash, MPUs, DVD chips News & Analysis 8/26/2003 Post a comment It only seemed like yesterday when the semiconductor industry was suffering from overcapacity and otherwise lackluster demand for chips. But suddenly, there are signs of spot shortages--and even price hikes--for select parts, such as DVD chips, microprocessors, and NAND-based flash memories.
Getting 12-bits of Resolution out of your 10-bit A/D News & Analysis 8/26/2003 Post a comment Cost sensitive designs benefit from using lower resolution A/Ds and simple signal processing techniques. Including software solutions in you're A/D selection process can reduce your system cost without sacrificing performance. In Part 1 of this multi-part tutorial, FAE Fugerer looks at sample "averaging" as a means of increasing A/D resolution. In Part 2, he examines "oversampling." (Be sure too to look at the Appendix material that accompanies these articles.)
Structured-ASIC debate building in fervor News & Analysis 8/25/2003 Post a comment A custom-chip design approach that was initially dismissed by critics as a fad is proving to have staying power as system architects increasingly seek a middle ground between cell-based designs and FPGAs. Crista Souza has these insights.
Intel sees demand, spot shortages, for chips News & Analysis 8/25/2003 Post a comment At a time when the IC industry is supposed to be in the summer doldrums, Intel's logic fabs are running at full capacity due to unexpected demand for processors, chip sets and motherboards, according to the company. On the down side, the company's communications business, especially flash memories, remains weak. Mark LaPedus reports.
The logic price wars News & Analysis 8/25/2003 Post a comment Despite tough market conditions and aggressive pricing tactics, suppliers of commodity standard logic remain committed to their products. A number of these companies appear well positioned to take advantage of the industry's next upswing as they continue to expand wafer manufacturing capabilities, shift to larger 6in. wafer sizes for cost advantages, and launch hundreds of new products targeting the growing wireless and handheld sectors.
Danish start-up nibbles on Ethernet News & Analysis 8/25/2003 Post a comment A small Danish engineering firm with roots in Multi-Protocol Label Switching (MPLS) is positioning itself as a center of expertise for Metro Ethernet Forum semiconductors and firmware by supplying chipsets, modules, and design assistance for small OEMs moving into Ethernet access.
Tezzaron delivers challenge to SRAM, DRAM News & Analysis 8/25/2003 Post a comment Tezzaron Semiconductor Inc. last week announced a new type of pseudo-static memory technology intended to provide an alternative to embedded SRAM or DRAM in discrete memory ICs and systems-on-chip.
Structured-ASIC debate building in fervor News & Analysis 8/25/2003 Post a comment A custom-chip design approach that has come to be known as "structured ASIC" was initially dismissed by critics as a fad, but it is proving to have staying power as system architects increasingly seek a middle ground between cell-based designs and FPGAs.
eXtreme Graphics muscles into the mainstream market News & Analysis 8/25/2003 Post a comment Fresh off its acquisition of Trident Microsystems Inc.'s PC graphics division, Taiwan start-up eXtreme Graphics Innovation (XGI) is expected to field two lines of processors in the fall that will inaugurate its pursuit of the mainstream and high-end markets.
Structured-ASIC debate building in fervor News & Analysis 8/22/2003 Post a comment A custom-chip design approach that has come to be known as "structured ASIC" was initially dismissed by critics as a fad, but it is proving to have staying power as system architects increasingly seek a middle ground between cell-based designs and FPGAs.
SOI and strained silicon complement each other News & Analysis 8/22/2003 Post a comment For the past 25 years, geometric scaling of silicon CMOS transistors has enabled not only an exponential increase in circuit integration density Moore's Law but also a corresponding enhancement in the transistor performance itself.
Silicon germanium challenges metrology Design How-To 8/22/2003 Post a comment To enable continued migration to smaller design rules in advanced CMOS processes, the semiconductor industry must deal with a proliferation of materials-from 20 materials options at the 130-nanometer node to nearly double that at the 65-nm node.
Right on time -- requirements for advanced custom design News & Analysis 8/22/2003 Post a comment Custom IC design is becoming phenomenally more complex. In this whitepaper, Cadence Design Systems authors Lavi Lev and Ted Vucurevich analyze today's custom design flow and propose a new "advanced custom design" methodology that combines accuracy with fast turn-around times.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.